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IMAGE AND VISION COMPUTING
基本信息
期刊名称 IMAGE AND VISION COMPUTING
IMAGE VISION COMPUT
期刊ISSN 0262-8856
期刊官方网站 http://www.journals.elsevier.com/image-and-vision-computing/
是否OA
出版商 Elsevier Ltd
出版周期 Monthly
始发年份
年文章数 74
最新影响因子 4.7(2022)  scijournal影响因子  greensci影响因子
中科院SCI期刊分区
大类学科 小类学科 Top 综述
工程技术3区 COMPUTER SCIENCE, ARTIFICIAL INTELLIGENCE 计算机:人工智能3区
COMPUTER SCIENCE, SOFTWARE ENGINEERING 计算机:软件工程2区
COMPUTER SCIENCE, THEORY & METHODS 计算机:理论方法3区
ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气3区
OPTICS 光学3区
CiteScore
CiteScore排名 CiteScore SJR SNIP
学科 排名 百分位 3.58 0.633 1.541
Computer Science
Computer Vision and Pattern Recognition
18 / 75 76%
Computer Science
Signal Processing
25 / 99 75%
补充信息
自引率 4.30%
H-index 118
SCI收录状况 Science Citation Index
Science Citation Index Expanded
官方审稿时间
网友分享审稿时间 数据统计中,敬请期待。
PubMed Central (PML) http://www.ncbi.nlm.nih.gov/nlmcatalog?term=0262-8856%5BISSN%5D
投稿指南
期刊投稿网址 http://ees.elsevier.com/imavis/default.asp?acw=1
收稿范围

Image and Vision Computing has as a primary aim the provision of an effective medium of interchange for the results of high quality theoretical and applied research fundamental to all aspects of image interpretation and computer vision. The journal publishes work that proposes new image interpretation and computer vision methodology or addresses the application of such methods to real world scenes. It seeks to strengthen a deeper understanding in the discipline by encouraging the quantitative comparison and performance evaluation of the proposed methodology. The coverage includes: image interpretation, scene modelling, object recognition and tracking, shape analysis, monitoring and surveillance, active vision and robotic systems, SLAM, biologically-inspired computer vision, motion analysis, stereo vision, document image understanding, character and handwritten text recognition, face and gesture recognition, biometrics, vision-based human-computer interaction, human activity and behavior understanding, data fusion from multiple sensor inputs, image databases.

 

In addition to regular manuscripts, Image and Vision Computing Journal solicits manuscripts for the Opinions Column, aimed at initiating a free forum for vision researchers to express their opinions on past, current, or future successes and challenges in research and the community.

 

An opinion paper should be succinct and focused on a particular topic. Addressing multiple related topics is also possible if this helps making the point. While posing questions helps raising awareness about certain issues, ideally, an opinion paper should also suggest a concrete direction how to address the issues. Topics of interest include, but are not limited to:

  • Comments on success and challenges in a (sub-) field of computer vision,

  • Remarks on new frontiers in computer vision

  • Observations on current practices and trends in research, and suggestions for overcoming unsatisfying aspects

  • Observations on current practices and trends in the community regarding, e.g., reviewing process, organizing conferences, how journals are run, and suggestions for overcoming unsatisfying aspects

  • Reviews of early seminal work that may have fallen out of fashion

  • Summaries of the evolution of one's line of research

  • Recommendations for educating new generations of vision researchers.

The format of an opinion paper should comply with the existing formatting guidelines for the Image and Vision Computing Journal submissions, and should not exceed 2 pages.

收录体裁
投稿指南 https://www.elsevier.com/journals/image-and-vision-computing/0262-8856/guide-for-authors
投稿模板
参考文献格式 https://www.elsevier.com/journals/image-and-vision-computing/0262-8856/guide-for-authors
编辑信息

Editors in Chief

S. Todorovic

Oregon State University School of Electrical Engineering and Computer Science, 2111 Kelley Engineering Center, Corvallis, Oregon, OR 97331, United States


Opinions Editor

S. Todorovic

Oregon State University School of Electrical Engineering and Computer Science, Corvallis, Oregon, United States


Managing Editor

K. Wang

University of California Los Angeles, Los Angeles, California, United States


Advisory Editors

J.K. Aggarwal

University of Texas at Austin, Austin, Texas, United States

A. Blake

Samsung Group, Seoul, Korea, Republic of

K.W. Bowyer

University of Notre Dame, Notre Dame, Indiana, United States

G. Medioni

University of Southern California, Los Angeles, California, United States

A.P. Pentland

Massachusetts Institute of Technology, Cambridge, Massachusetts, United States

J.K. Tsotsos

York University, Toronto, Ontario, Canada

Associate Editors

Y. Aloimonos

University of Maryland at College Park, College Park, Maryland, United States

Y. Andreopoulos

University College London, London, United Kingdom

V. Athitsos

University of Texas at Arlington, Arlington, Texas, United States

J.P. Barreto

University of Coimbra, Coimbra, Portugal

R. Bowden

University of Surrey, Guildford, United Kingdom

I. Buciu

University of Oradea, Oradea, Romania

R. Chellappa

University of Maryland at College Park, College Park, Maryland, United States

O. Chum

T.F. Cootes

The University of Manchester, Manchester, United Kingdom

D.J. Crandall

Indiana University Bloomington School of Informatics and Computing, Bloomington, Indiana, United States

M. Daoudi

IMT Lille Douai, France

S. Dickinson

University of Toronto, Toronto, Ontario, Canada

E. Dunn

University of North Carolina at Chapel Hill, Chapel Hill, North Carolina, United States

J. Feng

Tsinghua University, Beijing, China

C. Fermüller

University of Maryland at College Park, College Park, Maryland, United States

Y. R. Fu

Northeastern University, Boston, Massachusetts, United States

B. Ghanem

King Abdullah University of Science and Technology, Thuwal, Saudi Arabia

B. Glocker

Imperial College London, London, United Kingdom

M. Goesele

Darmstadt University of Technology, Darmstadt, Germany

H. Gunes

University of Cambridge, Cambridge, United Kingdom

T.K Kim

Imperial College London, London, United Kingdom

K. Kitani

Carnegie Mellon University, Pittsburgh, Pennsylvania, United States

S.-W. Lee

Korea University Department of Computer Science and Engineering, Seongbuk-gu, Korea, Republic of

A. Leonardis

University of Ljubljana Faculty of Computer and Information Science, Ljubljana, Slovenia

S. Leutenegger

Imperial College London, England, United Kingdom

F. Li

Oregon State University, Corvallis, Oregon, United States

H. Li, PhD

Australian National University, Canberra, Australia

C. Liu

National Laboratory of Pattern Recognition, Beijing, China

E. Memin

Institute for Research in Computer Science and Random Systems, Rennes, France

L. Merino

Pablo de Olavide University, Sevilla, Spain

P. Mordohai

Stevens Institute of Technology, Hoboken, New Jersey, United States

M. Nappi

University of Salerno, Fisciano, Italy

Mark S. Nixon

University of Southampton, Southampton, United Kingdom

V. Pavlovic

Rutgers University Department of Computer Science, Piscataway, New Jersey, United States

N. Petkov

University of Groningen, Groningen, Netherlands

T. Pock

Graz University of Technology, Graz, Austria

H.P. Proença

University of Beira Interior, Covilha, Portugal

X Roca

Computer Vision Center, Barcelona, Spain

A. Ross

Michigan State University Department of Computer Science and Engineering, East Lansing, Michigan, United States

B. Sankur

Bogazici University Department of Electrical and Electronics Engineering, ?stanbul, Turkey

S. Sclaroff

Boston University, Boston, Massachusetts, United States

N. Sebe

University of Trento Department of Information Engineering and Computer Science, Povo, Italy

S.K. Shah

University of Houston, Houston, Texas, United States

M. Tistarelli

University of Sassari Department of Humanities and Social Sciences, Alghero, Italy

M. Turk

University of California Santa Barbara Department of Computer Science, Santa Barbara, California, United States

G. Tzimiropoulous

University of Lincoln, Lincoln, United Kingdom

M. Valstar

University of Nottingham, Nottingham, United Kingdom

X. Wang

Chinese University of Hong Kong Department of Electronic Engineering, Shatin, New Territories, Hong Kong

T. Wu

North Carolina State University Department of Electrical and Computer Engineering, Raleigh, North Carolina, United States

T. Xiang

University of London, London, United Kingdom

M.-H. Yang

University of California Merced, Merced, California, United States

Y. Yang

University of Technology Sydney, Sydney, Australia

L. Yin

Binghamton University, Binghamton, New York, United States

S. Zafeiriou

Imperial College London, London, United Kingdom

L. Zhang

Hefei University of Technology, Hefei, China

G. Zhao

University of Oulu, Oulu, Finland

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