International Journal on the Science and Technology of Condensed Matter Films



Thin Solid Films is an international journal which serves scientists and engineers working in the fields of thin film synthesis, characterization, modelling, and applications. The topical scope of Thin Solid Films reflects a wide range of thin film related themes:
Thin film synthesis, with particular emphasis on the control of growth for desired physical properties
Surfaces and interfaces
Solar energy conversion
Catalysis
Batteries and other electrochemical devices
Metallurgical, protective, and hard coatings
Electronics, optics, and opto-electronics
Magnetics and magneto-optics
Superconductivity


Note to authors
Contributions to Thin Solid Films should concern thin films and their potential applications. Details of film synthesis are required, together with the reproducibility of achieved results. Simulations should always be compared with corresponding original or published experimental data.

Benefits to authors
We also provide many author benefits, such as free PDFs, a liberal copyright policy, special discounts on Elsevier publications and much more. Please click here for more information on our author services.

Please see our Guide for Authors for information on article submission. If you require any further information or help, please visit our Support Center

• Full length (regular) papers 
• Invited review articles
• Letters

Editor-in-Chief
J.E. Greene
Frederick Seitz Materials Research Lab., University of Illinois at Urbana-Champaign, Urbana, Illinois, USA
Associate Editors
D. Abou-Ras
Helmholtz-Zentrum Berlin für Materialien und Energie, Berlin, Germany
Z.H. Barber
Department of Materials Science and Metallurgy, University of Cambridge, Cambridge, UK
P. Desjardins
Dépt. de Génie Physique, École Polytechnique de Montreal, Montréal, Quebec, Canada
T.A. Gessert
Gessert Consulting, LLC, Conifer, Colorado, USA
C. S. Lee
Dept. of Chemistry, City University of Hong Kong, Kowloon, Hong Kong
Editorial Board
T.L. Alford
Dept. of Chemical & Materials Engineering, Arizona State University, Tempe, Arizona, USA
J.-M. Baribeau
Inst. for Microstructural Sciences, Conseil national de recherches Canada (CNRC), Ottawa, Ontario, Canada
P.B. Barna
Res. Inst. for Technical Physics HAS, Budapest, Hungary
J.P. Chu
Dept. of Materials Science and Engineering, National Taiwan University of Science and Technology, Taipei, Taiwan
M.-A. De Paoli
Instituto de Química, Universidade Estadual de Campinas (UNICAMP), Campinas, Brazil
A. Djurisic
School of Biomedical Sciences, Li Ka Shing Faculty of Medicine, The University of Hong Kong, Pokfulam, Hong Kong
D. Gall
Materials Science & Engineering, MRC 204, Rensselaer Polytechnic Institute, Troy, New York, USA
C.G. Granqvist
Dept. of Engineering Science (Inst. för Teknikvetenskaper), Uppsala Universitet, Uppsala, Sweden
H.J. Kim
School of Electrical and Electronic Engineering, Yonsei University, Seodaemun-Gu, Seoul, The Republic of Korea
Y. Li
Institute of Chemistry, Chinese Academy of Sciences (CAS), Beijing, China
P.J. Martin
Materials Science & Engineering, Commonwealth Scientific and Industrial Research Organisation (CSIRO), Lindfield, New South Wales, Australia
A.K. Pal
Dept. of Materials Science, Indian Association. for the Cultivation of Science, Jadavpur, Kolkata, India
J. Patscheider
Evatec AG, Trübbach, Switzerland
J.-J. Pireaux
LISE Lab., Université de Namur, Namur, Belgium
B. Ratner, PhD
Dept. of Bioengineering, University of Washington, Seattle, Washington, USA
I.K. Schuller
Dept. of Physics, 0319, University of California at San Diego (UCSD), La Jolla, California, USA
J.A.N.T. Soares
Materials Research Lab., University of Illinois at Urbana-Champaign, Urbana, Illinois, USA