Thin Solid Films is an international journal which serves scientists and engineers working in the fields of thin-film synthesis, characterization, and applications. The field of thin films, which can be defined as the confluence of materials science, surface science, and applied physics, has become an identifiable unified discipline of scientific endeavor. The scope of Thin Solid Films is indicated by, but not limited to, the following topical subheadings: 
• A. Synthesis and Characterization 
• B. Surfaces, Interfaces, and Colloidal Behaviour 
• C. Metallurgical, Protective, and Hard Layers 
• D. Mechanics and Nanomechanics of Thin Layers 
• E. Electronics, Optics, and Opto-electronics 
• F. Magnetics and Magneto-optics 
• G. Superconductivity 
• H. Langmuir—Blodgett, Biological, and Related Films 
• I. Thin Film Devices, Sensors, and Actuators 
• J. Condensed Matter Film Behaviour.

• Full length (regular) papers 
• Invited review articles
• Letters

Editor-in-Chief
J.E. Greene
Frederick Seitz Materials Research Lab., University of Illinois at Urbana-Champaign, Urbana, Illinois, USA
Associate Editors
D. Abou-Ras
Helmholtz-Zentrum Berlin für Materialien und Energie, Berlin, Germany
Z.H. Barber
Department of Materials Science and Metallurgy, University of Cambridge, Cambridge, UK
P. Desjardins
Dépt. de Génie Physique, École Polytechnique de Montreal, Montréal, Quebec, Canada
T.A. Gessert
Gessert Consulting, LLC, Conifer, Colorado, USA
C. S. Lee
Dept. of Chemistry, City University of Hong Kong, Kowloon, Hong Kong
Editorial Board
T.L. Alford
Dept. of Chemical & Materials Engineering, Arizona State University, Tempe, Arizona, USA
J.-M. Baribeau
Inst. for Microstructural Sciences, Conseil national de recherches Canada (CNRC), Ottawa, Ontario, Canada
P.B. Barna
Res. Inst. for Technical Physics HAS, Budapest, Hungary
J.P. Chu
Dept. of Materials Science and Engineering, National Taiwan University of Science and Technology, Taipei, Taiwan
M.-A. De Paoli
Instituto de Química, Universidade Estadual de Campinas (UNICAMP), Campinas, Brazil
A. Djurisic
School of Biomedical Sciences, Li Ka Shing Faculty of Medicine, The University of Hong Kong, Pokfulam, Hong Kong
D. Gall
Materials Science & Engineering, MRC 204, Rensselaer Polytechnic Institute, Troy, New York, USA
C.G. Granqvist
Dept. of Engineering Science (Inst. för Teknikvetenskaper), Uppsala Universitet, Uppsala, Sweden
H.J. Kim
School of Electrical and Electronic Engineering, Yonsei University, Seodaemun-Gu, Seoul, The Republic of Korea
Y. Li
Institute of Chemistry, Chinese Academy of Sciences (CAS), Beijing, China
P.J. Martin
Materials Science & Engineering, Commonwealth Scientific and Industrial Research Organisation (CSIRO), Lindfield, New South Wales, Australia
A.K. Pal
Dept. of Materials Science, Indian Association. for the Cultivation of Science, Jadavpur, Kolkata, India
J. Patscheider
Evatec AG, Trübbach, Switzerland
J.-J. Pireaux
LISE Lab., Université de Namur, Namur, Belgium
B. Ratner, PhD
Dept. of Bioengineering, University of Washington, Seattle, Washington, USA
I.K. Schuller
Dept. of Physics, 0319, University of California at San Diego (UCSD), La Jolla, California, USA
J.A.N.T. Soares
Materials Research Lab., University of Illinois at Urbana-Champaign, Urbana, Illinois, USA