The Journal of Materials Engineering and Performance (JMEP) strives to publish articles that will assist in solving day-to-day engineering challenges, especially those involving components for larger systems.
It covers all aspects of materials selection, design, processing characterization and evaluation, including:
How to improve materials properties through processes and process control of casting, forming, heat treating, surface modification and coating, and fabrication.
Testing and characterization (including mechanical and physical tests, NDE, metallography, failure analysis, corrosion resistance, chemical analysis, surface characterization, and microanalysis of surfaces, features and fractures)
Industrial performance measurement
Presents a clear understanding of relationships between materials selection, processing, applications and performance
The Journal of Materials Engineering and Performance publishes contributions on all aspects of materials selection, design, processing, characterization, and evaluation. The scope includes all materials used in engineering applications: those that typically result in components for larger systems.
Relationships between material type, secondary processing, and component performance are emphasized. Improvement of materials properties through processes such as casting, forming, heat treating, surface modification and coating, fabrication, and the control of these processes is presented. Testing and characterization are demonstrated through mechanical and physical tests, NDE, metallography, failure analysis, corrosion resistance, chemical analysis, surface characterization, and microanalysis of surfaces, features and fractures.

Editors
Rajiv Asthana, Editor, University of Wisconsin-Stout, Menomonie, WI, USA
Associate Editors
Elvin Beach, Associate Editor, The Ohio State University, Columbus, OH, USA
Omar S. Es-Said, Associate Editor, Loyola Marymount University, Los Angeles, CA, USA
William E. Frazier, Associate Editor, Pilgrim Consulting, LLC, Lusby, MD, USA
Sergiy Kalnaus, Associate Editor, Oak Ridge National Laboratory, Oak Ridge, TN, USA
P.R. Subramanian, Associate Editor, General Electric, Niskayuna, NY, USA 
Jeffery Waldman, Associate Editor, NAVMAR Applied Sciences Corporation, Warminster, PA, USA
Editorial Committee
Tatsuki Ohji, Chair, AIST, Japan; Dileep Singh, Vice Chair, Argonne National Laboratories, Argonne, IL, USA; Francisco Sola, Secretary, NASA, Cleveland, OH, USA; Hua-Tay Lin, Immediate Past Chair, Guangdong University, Guangzhou, China; Bandar AlMangour, SABIC, Dammam Eastern Providence, Saudi Arabia; Antonello Astarita, University of Naples Federico II, Naples, Italy; Pierpaolo Carlone, University of Salerno, Fisciano, Italy; Daolun Chen, Ryerson University, Toronto, ON, Canada; Fei Chen, Wuhan University of Technology, Wuhan, Hubei, China; Gaoqiang Chen, Tsinghua University, Beijing, China; Kester Clarke, Colorado School of Mines, Golden, CO, USA; Timothy P. Gabb, NASA Glenn Research Center, Cleveland, OH, USA; Surojit Gupta, University of North Dakota, Grand Forks, ND, USA; Sivaraman Guruswamy, University of Utah, Salt Lake City, UT, USA; Andrew Gyekenyesi, Ohio Aerospace Institute, Cleveland, OH, USA; Carter Hamilton, Miami University, Oxford, OH, USA; Jeffrey A. Hawk, National Energy Technology Laboratory, Albany, OR, USA; Ibrahim Karaman, Texas A&M University, College Station, TX, USA; Y.C. Lin, Central South University, Changsha, China;Yellapu Murty, MC Technologies LLC, Charlottesville, VA, USA; Thomas Niendorf, University of Kassel, Kassel, Germany; Todd Palmer, Pennsylvania State University, State College, PA, USA; S.V. Raj, NASA, Cleveland, OH, USA;T. S. Srivatsan, The University of Akron, Akron, OH, USA; John M. Tartaglia, Element Materials Technology, Wixom, MI, USA; Jingyang Wang, Institute of Material Research, Shenyang, China; Gerhard Welsch, Case Western Reserve University, Cleveland, OH, USA; Hao Zhang, The Boeing Company, Portland, OR, USA; Rajiv Asthana, ex-officio member, University of Wisconsin-Stout, Menomonie, WI, USA; Elvin Beach, ex-officio member, The Ohio State University, Columbus, OH, USA;Omar S. Es-Said, ex-officio member, Loyola Marymount University, Los Angeles, CA, USA; William E. Frazier, ex-officio member, Pilgrim Consulting, LLC, Lusby, MD, USA; Sergiy Kalnaus, ex-officio member, Oak Ridge National Laboratory, Oak Ridge, TN, USA; P.R. Subramanian, ex-officio member, General Electric, Niskayuna, NY, USA; Jeffery Waldman, ex-officio member, NAVMAR Applied Sciences Corporation, Warminster, PA, USA; Mary Anne Fleming, Staff Liaison, ASM International,Materials Park, OH, USA; Scott Henry, Staff Associate, ASM International, Materials Park, OH, USA;