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ENGINEERING WITH COMPUTERS
基本信息
期刊名称 ENGINEERING WITH COMPUTERS
ENG COMPUT-GERMANY
期刊ISSN 0177-0667
期刊官方网站 http://link.springer.com/journal/366
是否OA
出版商 Springer London
出版周期 Quarterly
始发年份 1985
年文章数 60
最新影响因子 8.7(2022)  scijournal影响因子  greensci影响因子
中科院SCI期刊分区
大类学科 小类学科 Top 综述
工程技术3区 COMPUTER SCIENCE, INTERDISCIPLINARY APPLICATIONS 计算机:跨学科应用3区
ENGINEERING, MECHANICAL 工程:机械3区
CiteScore
CiteScore排名 CiteScore SJR SNIP
学科 排名 百分位 4.09 0.722 1.498
Mathematics
Modelling and Simulation
15 / 259 94%
Engineering
General Engineering
15 / 275 94%
Computer Science
Software
59 / 360 83%
Computer Science
Computer Science Applications
87 / 569 84%
补充信息
自引率 16.20%
H-index 37
SCI收录状况 Science Citation Index Expanded
官方审稿时间
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PubMed Central (PML) http://www.ncbi.nlm.nih.gov/nlmcatalog?term=0177-0667%5BISSN%5D
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期刊投稿网址 https://www.editorialmanager.com/ewco/default.aspx
收稿范围

Engineering with Computers is an international journal for simulation-based engineering. It publishes original papers and authoritative state-of-the-art reviews on the technologies supporting simulation-based engineering, and examples of operational simulation-based engineering systems. A partial list of the technical areas covered includes: adaptive simulation techniques, engineering databases, integration with CAD geometry, mesh generation, parallel simulation methods, simulation frameworks, user interface technologies and visualization techniques. Application areas covered include any to which engineering technologies are applied and will range from applications in the automotive industry, to the design of medical devices.

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编辑信息

EDITOR:

Prof. Mark S. Shephard
Director Scientific Computation Research Center, Rensselaer Polytechnic Institute, Troy, New York 12180-3590, USA
Tel: (518) 276-6795
Email: shephard@rpi.edu 

FOUNDING EDITORS:

Professor Ted Belytschko and Professor Steven J. Fenves 

EDITORIAL BOARD

Frédéric Alauzet
INRIA EPI Gamma3, Saclay Ile-de-France, France

Klaus J. Bathe
Massachusetts Institute of Technology, Cambridge, Massachusetts, USA

Ted D. Blacker
Sandia National Laboratories, Albuquerque, New Mexico, USA 

Robert H. Dodds
University of Illinois, Urbana, Illinois, USA

Charbel Farhat
Stanford University, Stanford, California, USA

Thomas J. R. Hughes
The University of Texas at Austin, Austin, Texas, USA

Xiangmin (Jim) Jiao
Stony Brook University, Stony Brook, New York, USA

Louis Komzsik
Siemens-PLM, Cypress, California, USA

Ahmed K. Noor
ODU-NASA Langley Research Center, Hampton, Virginia, USA

Assad A. Oberai
Rensselaer Polytechnic Institute, Troy, New York, USA

Steven J. Owen 
Sandia National Laboratory, Albuquerque, New Mexico, USA

Ekkehard Ramm
University of Stuttgart, Stuttgart, Germany

Jean-François Remacle
Université catholique de Louvain, Louvain-la-Neuve, Belgium

Onkar Sahni
Rensselaer Polytechnic Institute, Troy, New York, USA

Sunil Saigal
New Jersey Institute of Technology, Newark, New Jersey, USA

Ian F. C. Smith
EPFL - Swiss Federal Institute of Technology, Lausanne, Switzerland

Barna A. Szabo
Washington University, St Louis, Missouri, USA

Nigel P. Weatherill
University of Wales, Swansea, UK

Nils-Erik Wiberg
Chalmers University of Technology, Gothenburg, Sweden

Peter Wriggers
TU Darmstadt, Darmstadt, Germany

Yongjie Jessica Zhang
Carnegie Mellon University, Pittsburgh, Pennsylvania, USA


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