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PACKAGING TECHNOLOGY AND SCIENCE
基本信息
期刊名称 PACKAGING TECHNOLOGY AND SCIENCE
PACKAG TECHNOL SCI
期刊ISSN 0894-3214
期刊官方网站 http://onlinelibrary.wiley.com/journal/10.1002/(ISSN)1099-1522
是否OA
出版商 John Wiley and Sons Ltd
出版周期 Bimonthly
始发年份
年文章数 67
最新影响因子 1.881(2018)  scijournal影响因子  greensci影响因子
中科院SCI期刊分区
大类学科 小类学科 Top 综述
工程技术4区 ENGINEERING, MANUFACTURING 工程:制造4区
FOOD SCIENCE & TECHNOLOGY 食品科技4区
CiteScore
CiteScore排名 CiteScore SJR SNIP
学科 排名 百分位 2.24 0.513 1.342
Chemistry
General Chemistry
114 / 371 69%
Engineering
Industrial and Manufacturing Engineering
148 / 579 74%
Materials Science
General Materials Science
157 / 439 64%
补充信息
自引率 22.10%
H-index 39
SCI收录状况 Science Citation Index Expanded
官方审稿时间
网友分享审稿时间 数据统计中,敬请期待。
PubMed Central (PML) http://www.ncbi.nlm.nih.gov/nlmcatalog?term=0894-3214%5BISSN%5D
投稿指南
期刊投稿网址 http://mc.manuscriptcentral.com/pts
收稿范围

Packaging Technology & Science publishes original research, applications and review papers describing significant, novel developments in its field.

The Journal welcomes contributions in a wide range of areas in packaging technology and science, including:

  • Active packaging
  • Aseptic and sterile packaging
  • Barrier packaging
  • Design methodology
  • Environmental factors and sustainability
  • Ergonomics
  • Food packaging
  • Machinery and engineering for packaging
  • Marketing aspects of packaging
  • Materials
  • Migration
  • New manufacturing processes and techniques
  • Testing, analysis and quality control
  • Transport packaging


Topics may relate to the packaging of: foods; fragile and high value goods; medical and pharmaceutical products; high volume consumer goods; chemicals and hazardous materials.

It is emphasized that the above is by no means an exhaustive list.

The journal publishes full-length papers, which should not normally exceed 10,000 words, and short communications, which can be at most 2500 words with three tables or illustrations. Two-part papers will not be considered.

The journal has specific editorial policies and requirements concerning mathematical models, new materials (including bio-polymers and anti-microbial treatments), direct food coatings, distribution environmental data and research on the packaging of specific products. These requirements are set out in the Author Check-list: papers failing to meet these requirements will not be considered.

Please note this journal does not cover the microencapsulation (packaging) of electronic circuits and devices.


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编辑信息

Editor-in-Chief

David Shires

Surrey, UK

Email:pts@shires.me.uk


Associate Editors

Cristina Nerin

University of Saragoza, Spain


Gordon L. Robertson

University of Queensland, Brisbane, Australia


Vincent Rouillard

Victoria University, Melbourne, Australia


Yves Wyser

Nestle Research Centre, Lausanne, Switzerland


Alaster Yoxall

Sheffield Hallam University, UK


 


Editorial Board

R. Auras

Michigan State University School of Packaging, USA 


V. Chonhenchob

Kasetsart University, Bangkok,

Thailand


J. de la Fuente

California Polytechnic State University,

USA


R. Gavara

IATA-CSIC, 

Spain


C. Guzman-Siller

Universidad de Monterrey, San Pedro, Garza Garcia, Mexico


T. Karbowiak

University of Bourgogne, 

France


R. ten Klooster

University of Twente, 

Netherlands


D. S. Lee

Kyungnam University, Changwon, 

South Korea


S. Østergaard

Danish Technological Institute, Taastrup, Denmark 


L. Piergiovanni

Universita di Milano, Milan,

Italy


E. Schlick-Hasper

BAM Institute, 

Germany


S. Tondella Dantas

ITAL Institute of Food Technology, Campinas, Brazil


J. Wang

Jiangnan University,

P.R. China


R. Wever

Linköping University, 

Sweden


K. L. Yam

Rutgers State University, New Brunswick, New Jersey, USA


G. Batt

Clemson University, 

USA


A. East

Massey University, 

New Zealand


M. Galotto

University of Santiago de Chile(USACH),

Chile


C. Ge

RIT (Rochester Institute of Technology),

USA


L. Horvath

Virginia Tech, 

USA


J. Kerry

University College, Cork,

Ireland


C. Koelsch Sand

Packaging Technology and Research, Michigan State University, USA


A. Olsson

Lund University, 

Sweden


M. Pascall

Food Innovation Center, Ohio State University, USA


K. Saito

Kobe University, 

Japan


K. Tanprasert

King Mongkut's University of Technology Thonburi, Thailand


K. Verghese

RMIT University, Melbourne, 

Australia


Z. W. Wang

Jinan University, Guangzhou,

P.R. China


F. Welle

Fraunhofer Institute for Process Engineering and Packaging, Freising, Germany


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