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VACUUM
基本信息
期刊名称 VACUUM
VACUUM
期刊ISSN 0042-207X
期刊官方网站 http://www.journals.elsevier.com/vacuum/
是否OA
出版商 Elsevier Ltd
出版周期 Monthly
始发年份 1951
年文章数 620
最新影响因子 2.515(2018)  scijournal影响因子  greensci影响因子
中科院SCI期刊分区
大类学科 小类学科 Top 综述
工程技术3区 MATERIALS SCIENCE, MULTIDISCIPLINARY 材料科学:综合4区
PHYSICS, APPLIED 物理:应用4区
CiteScore
CiteScore排名 CiteScore SJR SNIP
学科 排名 百分位 2.42 0.581 1.169
Materials Science
Surfaces, Coatings and Films
27 / 116 76%
Physics and Astronomy
Instrumentation
30 / 123 76%
Physics and Astronomy
Condensed Matter Physics
114 / 397 71%
补充信息
自引率 22.30%
H-index 69
SCI收录状况 Science Citation Index
Science Citation Index Expanded
官方审稿时间
网友分享审稿时间 数据统计中,敬请期待。
PubMed Central (PML) http://www.ncbi.nlm.nih.gov/nlmcatalog?term=0042-207X%5BISSN%5D
投稿指南
期刊投稿网址 http://www.evise.com/evise/faces/pages/navigation/NavController.jspx?JRNL_ACR=VAC
收稿范围

Vacuum is an international rapid publications journal with a focus on short communication. All papers are peer-reviewed, with the review process for short communication geared towards very fast turnaround times. The journal also published full research papers, thematic issues and selected papers from leading conferences.

A report in Vacuum should represent a major advance in an area that involves a controlled environment at pressures of one atmosphere or below.

The scope of the journal includes:
1. Vacuum; original developments in vacuum pumping and instrumentation, vacuum measurement, vacuum gas dynamics, gas-surface interactions, surface treatment for UHV applications and low outgassing, vacuum melting, sintering, and vacuum metrology. Technology and solutions for large-scale facilities (e.g., particle accelerators and fusion devices). New instrumentation ( e.g., detectors and electron microscopes).
2. Plasma science; advances in PVD, CVD, plasma-assisted CVD, ion sources, deposition processes and analysis.
3. Surface science; surface engineering, surface chemistry, surface analysis, crystal growth, ion-surface interactions and etching, nanometer-scale processing, surface modification.
4. Materials science; novel functional or structural materials. Metals, ceramics, and polymers. Experiments, simulations, and modelling for understanding structure-property relationships. Thin films and coatings. Nanostructures and ion implantation.


The aim of the short communications is to enable researchers to rapidly share their most exciting work with their colleagues. The expected time from submission to final decision is approximately 6.4 weeks

收录体裁
Short Communications
Full Research Papers
reviews
thematic issues 
a selection of conference papers
投稿指南 https://www.elsevier.com/journals/vacuum/0042-207x/guide-for-authors
投稿模板
参考文献格式 https://www.elsevier.com/journals/vacuum/0042-207x/guide-for-authors
编辑信息
Editor-in-Chief
L.G. Hultman
Linköping University, Linköping, Sweden
Editor
Linköping University, Linköping, Sweden
Special Issue Editor
STFC Daresbury Laboratory, Warrington, Cheshire, United Kingdom
Associate Editors
STFC Daresbury Laboratory, Warrington, Cheshire, United Kingdom

P. Mayrhofer

TU Wien, Wien, Austria
Università degli Studi di Bari Aldo Moro, Bari, Italy
Editorial Board Member

G. Abadias

Université de Poitiers, Chasseneuil-Futuroscope, France

M. Anderle

Autonomous Province of Trento, Trento, Italy

K. Baba

Industrial Technology Center of Nagasaki, Nagasaki, Japan

S. Baba

Seiki University, Tokyo, Japan

S. Baragetti

University of Bergamo, Dalmine BG, Italy

L. Bardos

Uppsala University, Uppsala, Sweden

M. Bartosik

TU Wien, Wien, Austria

F. Berto

Norwegian University of Science & Technology NTNU, Trondheim, Norway

H. Biederman

Charles University, Praha 2, Czech Republic

W. Dai

Pennsylvania State University, University Park, Pennsylvania, USA

J.L. de Segovia

Instituto de Ciencia de Materiales de Madrid, Cantoblanco, Madrid, Spain

Y. Du

Central South University, Changsha, Hunan, China

R.G. Elliman

Australian National University, Canberra, Australian Capital Territory, Australia

A. Erdemir

Argonne National Laboratory, Argonne, Illinois, USA

A. Goodyear

The Open University, Milton Keynes, UK

J.H. Huang

National Tsing Hua University, Hsinchu, Taiwan

R.E. Hurley

Queen's University Belfast, Belfast, Northern Ireland, UK

A. Ignatiev

University of Houston, Houston, Texas, USA

K. Jousten

Physikalisch-Technische Bundesanstalt, Berlin, Germany

D.S. Karpuzov

University of Alberta, Edmonton, Alberta, Canada

R. Kersevan

CERN, Geneva 23, Switzerland

S. Kodambaka

University of California at Los Angeles (UCLA), Los Angeles, California, USA

M.K. Lei

Dalian University of Technology, Dalian, China

K. Ludwig

Boston University, Boston, Massachusetts, USA

R. Miles

Northumbria University, Newcastle Upon Tyne, UK
University of Kiel, Kiel, Germany

A.Z. Moshfegh

Sharif University of Technology, Tehran, Iran

D. Music

RWTH Aachen University (RWTH), Aachen, Germany

J. Musil

University of West Bohemia, Plzen, Czech Republic

V. Nagirnyi

University of Tartu, Tartu, Estonia

H. Pedersen

Linköping University, Linköping, Sweden

I. Petrov

University of Illinois at Urbana-Champaign, Urbana, Illinois, USA

H. Pouraliakbar

WorldTech Scientific Research Center (WT-SRC), Tehran, Iran

A. Prakash

Intersil, A Renesas Company, Tempe, Arizona, USA

C. Rego

Manchester Metropolitan University, Manchester, UK

A. Rossi

Università di Cagliari, Cagliari, Italy

Y. Saito

KEK Japan, Tsukuba, Japan

J. Šetina

Institute of Metals and Technology, Ljubljana, Slovenia

F. Sharipov

Universidade Federal do Paraná (UFPR), Curitiba, Brazil

L. Siller

Newcastle University, Newcastle Upon Tyne, UK
Nanyang Technological University, Singapore, Singapore

Y. Tanimoto

KEK Japan, Tsukuba, Japan

D. Valougeorgis

University of Thessaly, Volos, Greece

H. Wang

Texas A&M University, College Station, Texas, USA

M.S. Wong

National Dong Hwa University, Hualien, Taiwan

V.E. Yurasova

M.V. Lomonosov Moscow State University, Moscow, Russian Federation

W. Zheng

Jilin University, Changchun City, China


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