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[1]赵宁.Characters of multicomponent lead-free solders[J],JOURNAL OF MATERIALS SCIENCE MATERIALS IN ELECTRONICS,2022,24(10):3925-3931
[2]Zhong, Y..Continuous epitaxial growth of extremely strong Cu6Sn5 textures at liquid-Sn/(111)Cu interface und[J],APPLIED PHYSICS LETTERS,2022,111(22)
[3]Zhong, Yi.Coupling effect of thermomigration and cross-interaction on evolution of intermetallic compounds i[J],JOURNAL OF MATERIALS RESEARCH,2022,32(16):3128-3136
[4]Fan, M..Cross-solder interaction on interfacial reactions in Ni/Sn-3.0Ag-0.5Cu/Cu solder interconnects[A],17th International Conference on Electronic Packaging Technology (ICEPT),2022,542-545
[5]Qiao, Y. Y..Dramatic morphological reservation of prism-type Cu6Sn5 formed on single crystal Cu substrates und[J],Materials Today Communications,2020,23
[6]乔媛媛.Y.Y. Qiao, F.Y. Yu, N. Zhao*, C.Y. Liu. Characteristics of Cu6Sn5 grains formed on different Cu subs[A],2021
[7]乔媛媛.Y.Y. Qiao, N. Zhao*, C.Y. Liu, C.M.L. Wu, Y.P. Wang, H.T. Ma. Dramatic morphological reservation of [J],Materials Today Communications,2021,23:1-4
[8]常正洋.Effects of cooling rate and joint size on Sn grain features in Cu/Sn-3.5Ag/Cu solder joints[J],Materialia,2021,14:1-9
[9]Ma, H. R.,Dong, C.,Zhao, N.,Wang, Y. P.,Li, X. G.,Ma, H. T.,Chen, J..Analysis and control of Cu6Sn5 preferred nucleation on single crystal (001)Cu[J],MATERIALS LETTERS,2020,265
[10]Qiao, Y. Y.,Zhao, N.,Liu, C. Y.,Wu, C. M. L.,Wang, Y. P.,Ma, H. T..Dramatic morphological reservation of prism-type Cu6Sn5 formed on single crystal Cu substrates und[J],MATERIALS TODAY COMMUNICATIONS,2020,23
[11]Yao, Mingjun,Zhao, Ning,Wang, Teng,Yu, Daquan,Xiao, Zhiyi,Ma, Haitao.Study of Three-Dimensional Small Chip Stacking Using Low Cost Wafer-Level Micro-bump/B-Stage Adhes[J],JOURNAL OF ELECTRONIC MATERIALS,2018,47(12):7544-7557
[12]Kunwar, Anil,Ma, Haoran,Ma, Haitao,Sun, Junhao,Zhao, Ning,Huang, Mingliang.On the increase of intermetallic compound's thickness at the cold side in liquid Sn and SnAg solde[J],MATERIALS LETTERS,2018,230:76-76
[13]Yao, Mingjun,Zhao, Ning,Wang, Teng,Yu, Daquan,Xiao, Zhiyi,Ma, Haitao.Optimization and Characterization of Low-Temperature Wafer-Level Hybrid Bonding Using Photopattern[J],IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY,2018,8(10):1855-1862
[14]Zhong, Y.,Zhao, N.,Dong, W.,Wang, Y. P.,Ma, H. T..In situ study on the effect of Cu5Zn8 intermetallic layer on the Cu-Ni cross interaction in Cu/Sn-[J],MATERIALS CHEMISTRY AND PHYSICS,2018,216:130-135
[15]Shang, Shengyan,Kunwar, Anil,Yao, Jinye,Wang, Yunpeng,Huang, Mingliang,Ma, Haitao,Zhao, Ning.All-round suppression of Cu6Sn5 growth in Sn/Cu joints by utilizing TiO2 nanoparticles[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2018,29(18,SI):15966-15972
[16]Ma, H. R.,Kunwar, A.,Shang, S. Y.,Jiang, C. R.,Wang, Y. P.,Ma, H. T.,Zhao, N..Evolution behavior and growth kinetics of intermetallic compounds at Sn/Cu interface during multip[J],INTERMETALLICS,2018,96:1-12
[17]Ma, Haoran,Kunwar, Anil,Chen, Jun,Qu, Lin,Wang, Yunpeng,Song, Xueguan,Raback, Peter,Zhao, Ning,Ma, Haitao.Study of electrochemical migration based transport kinetics of metal ions in for Sn-9Zn alloy[J],MICROELECTRONICS RELIABILITY,2018,83:198-205
[18]Zhao, N.,Wang, M. Y.,Zhong, Y.,Ma, H. T.,Wang, Y. P.,Wong, C. P..Effect of Zn content on Cu-Ni cross-interaction in Cu/Sn-xZn/Ni micro solder joints[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2018,29(6):5064-5073
[19]Guo, Bingfeng,Kunwar, Anil,Zhao, Ning,Chen, Jun,Wang, Yunpeng,Ma, Haitao.Effect of Ag3Sn nanoparticles and temperature on Cu6Sn5 IMC growth in Sn-xAg/Cu solder joints[J],MATERIALS RESEARCH BULLETIN,2018,99:239-248
[20]Ma, Haoran,Kunwar, Anil,Liu, Zhiyuan,Chen, Jun,Wang, Yunpeng,Huang, Mingliang,Zhao, Ning,Ma, Haitao.Shielding effect of Ag3Sn on growth of intermetallic compounds in isothermal heating and cooling d[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2018,29(6):4383-4390
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