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[1]Zhang, Shuye,Huang, Mingliang,Wu, Yang,Yang, Ming,Lin, Tiesong,He, Peng,Paik, Kyung-Wook.A Study on the Oxygen Plasma Treatment on the Peel Adhesion Strength and Solder Wettability of SnB[A],2019,2019-May:2022-2028
[2]M.L. Huang,J.M. Kuang,H.Y. Sun.Electromigration-induced β-Sn grain rotation in lead-free flip chip solder bumps[A],2019,2036-2041
[3]Chunyan Lu,Feifei Huang.Effects of Electroplating Process Parameters on Properties of Co-electroplated Au-Sn alloy[A],2019,1-5
[4]Zhijie Zhang.Abnormal migration behavior and segration mechanism of Bi atoms undergoing liquid-solid electromigra[J],Journal Materials Science,2019,54:7975-7986
[5]Kunwar, Anil,Ma, Haoran,Ma, Haitao,Sun, Junhao,Zhao, Ning,Huang, Mingliang.On the increase of intermetallic compound's thickness at the cold side in liquid Sn and SnAg solde[J],MATERIALS LETTERS,2018,230:76-76
[6]Shang, Shengyan,Kunwar, Anil,Yao, Jinye,Wang, Yunpeng,Zhao, Ning,Huang, Mingliang,Ma, Haitao.All-round suppression of Cu6Sn5 growth in Sn/Cu joints by utilizing TiO2 nanoparticles[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2018,29(18,SI):15966-15972
[7]黄明亮,孙洪羽.倒装芯片无铅凸点β-Sn晶粒取向与电迁移交互作用[J],金属学报,2018,54(07):1077-1086
[8]Lv, Qipeng,Huang, Mingliang,Zhang, Shaoqian,Deng, Songwen,Gong, Faquan,Wang, Feng,Pan, Yanwei,Li, Gang,Jin, Yuqi.Effects of Annealing on Residual Stress in Ta2O5 Films Deposited by Dual Ion Beam Sputtering[J],COATINGS,2018,8(4)
[9]Ma, Haoran,Kunwar, Anil,Liu, Zhiyuan,Chen, Jun,Wang, Yunpeng,Huang, Mingliang,Zhao, Ning,Ma, Haitao.Shielding effect of Ag3Sn on growth of intermetallic compounds in isothermal heating and cooling d[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2018,29(6):4383-4390
[10]Zhang, Shuye,Yang, Ming,Wu, Yang,Du, Jikun,Lin, Tiesong,He, Peng,Huang, Mingliang,Paik, Kyung-Wook.A Study on the Optimization of Anisotropic Conductive Films for Sn-3Ag-0.5Cu-Based Flex-on-Board A[J],IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY,2018,8(3):383-391
[11]Zhang, Yahong,Duan, Yuping,Liu, Jia,Ma, Guojia,Huang, Mingliang.Wormlike Acid-Doped Polyaniline: Controllable Electrical Properties and Theoretical Investigation[J],JOURNAL OF PHYSICAL CHEMISTRY C,2018,122(4):2032-2040
[12]Ren, Jing,Huang, Mingliang,Yang, Xudong.Effect of Ag element on microstructure and mechanical properties of Sn-Bi-xAg solders designed by [A],2018,265-269
[13]Huang, M. L.,Zou, L.,Yin, S. Q..Electromigration Behavior and Mechanical Properties of the Whole Preferred Orientation Intermetall[A],2018,2018-May:2041-2048
[14]Guo, Bingfeng,Kunwar, Anil,Jiang, Chengrong,Zhao, Ning,Sun, Junhao,Chen, Jun,Wang, Yunpeng,Ma, Haitao,Huang, Mingliang.Synchrotron radiation imaging study on the rapid IMC growth of Sn-xAg solders with Cu and Ni subst[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2018,29(1):589-601
[15]A. Nylander,Y.F. Fu,M.L. Huang,J. Liu.Covalent anchoring of carbon nanotube based thermal interface materials using epoxy silane monolayer[J],IEEE Transaction on Components,2018,6(1):1-8
[16]Mingliang Huang,Lin Zou,SiQi Yin.Electromigration behavior and mechanical properties of the whole preferred orientation intermetallic[A],2018,2035-2042
[17]Lv, Qipeng,Huang, Mingliang,Deng, Songwen,Zhang, Shaoqian,Li, Gang.Effects of oxygen flows on optical properties, micro-structure and residual stress of Ta2O5 films [J],OPTIK,2018,166:278-284
[18]Yin, Siqi,Huang, Mingliang,Chen, Yu.Effect of In addition on the properties of Sn-Au-Cu lead-free solder[A],2018,1363-1367
[19]Kuang, Jiameng,Huang, Mingliang.Effect of Soldering Sequences on Cu-Ni interaction in flip-chip interconnects[A],2018,1368-1371
[20]Ma, Haitao,Ma, Haoran,Kunwar, Anil,Shang, Shengyan,Wang, Yunpeng,Chen, Jun,Huang, Mingliang,Zhao, Ning.Effect of initial Cu concentration on the IMC size and grain aspect ratio in Sn-xCu solders during[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2018,29(1):602-613
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