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Song, Chang.Effectiveness of stress release geometries on reducing residual stress in electroforming metal ...[J],JOURNAL OF MICROMECHANICS AND MICROENGINEERING,2021,28(4)
Guo, Chunfang.Roller embossing process for the replication of shark-skin-inspired micro-riblets[J],MICRO & NANO LETTERS,2021,12(7):439-444
Zhao, Zhong.Enhancing the adhesion strength of micro electroforming layer by ultrasonic agitation method an...[J],ULTRASONICS SONOCHEMISTRY,2021,33:10-17
Zhao, Zhong.Effects of ultrasonic agitation on adhesion strength of micro electroforming Ni layer on Cu sub...[J],ULTRASONICS SONOCHEMISTRY,2021,29:1-10
杜立群.用于老年人安全检测的可穿戴式惯性开关的研制[J],电加工与模具,2021,1:47-52
魏壮壮,高林松,王仁彻,吕辉,杜立群.金属微通道热沉换热特性仿真与实验研究[J],真空与低温,2020,26(2):131-138
闫卫平,杜立群,朱剑波,马灵芝.金属薄膜加热器的研究[J],传感技术学报,2004,17(4):615-618
赵雯,吕辉,翟科,宋满仓,魏壮壮,姬学超,杜立群.高密集金属微通道散热器成形及封装工艺研究[J],航空制造技术,2019,62(19):92-98
Liu, Junshan,Hu, Xiaoguang,Cai, Yindi,Liu, Zhe,Liu, Zehan,Xu, Zheng,Zhang, Xi,Du, Liqun,Wang, Zelong.Transfer printing via a PAA sacrificial layer for wrinkle-free PDMS metallization[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2020,31(3):2347-2352
Du, L. Q.,Chen, S. L.,Zhao, M.,Tao, Y. S.,Luo, L.,Yang, T.,Liu, S. J.,Hao, Y. P..Research on Fabrication of a Multi-Scale Inertial Switch with Ultra-High Aspect Ratio[A],2018,243-249
杜立群,王伟泰,杜成权,刘旭强,赵剑.基于微电铸工艺的镍微型惯性开关的研制[J],电加工与模具,2019,2:47-51
Zhao, Ming,Zhang, Xi,Cao, Qiang,Ji, Xuechao,Wei, Zhuangzhuang,Liu, Junshan,Du, Liqun,Xu, Zheng.Improving the thickness uniformity of micro electroforming layer by megasonic agitation and the...[J],MATERIALS CHEMISTRY AND PHYSICS,2020,239
Song C.,Du L.,Yang T.,Luo L.,Tao Y.,Zhang X..Experimental study on the relationship between dislocation density and internal stress in micro e...[J],Key Engineering Materials,2015,645:405-410
杜立群,赵文君,翟科,杜成权,魏壮壮,姬学超.基于纳米压痕技术的兆声辅助电铸微器件残余应力研究[J],电加工与模具,2019,4:44-48,68
Zhai, Ke,Du, Liqun,Wen, Yikui,Wang, Shuxuan,Cao, Qiang,Zhang, Xi,Liu, Junshan.Fabrication of micro pits based on megasonic assisted through-mask electrochemical micromachining[J],Ultrasonics,2020,100:105990
李晓军,吕辉,朱和卿,赵雯,杜立群.雷达用高深宽比金属铜微通道散热器的制作[J],航空制造技术,2019,62(1):95-100
朱和卿,吕辉,赵雯,姬学超,魏壮壮,杜立群.金属微通道散热器结构微电铸均匀性研究[J],电加工与模具,2019,1:43-48,51
吕辉,王仁彻,严战非,沈涛,杜立群.金属微通道结构UV-LIGA精密成形技术研究[J],电子机械工程,2018,34(6):39-42
Song, Chang,Du, Liqun,Ji, Xuechao.Reducing the residual stress in micro electroforming layer by megasonic agitation[J],ULTRASONICS SONOCHEMISTRY,2018,49:233-240
杜立群,翟科,姬学超,魏壮壮,杜成权,刘旭强.兆声波精密微电铸设备及相关工艺研究[J],航空制造技术,2018,61(21):52-56
Du, Liqun,Zhao, Wenjun,Zhai, Ke,Song, Chang,Li, Qingfeng.Fabrication of microfluidic chip mold based on through-mask electrochemical etching and micro e...[J],JOURNAL OF MICROMECHANICS AND MICROENGINEERING,2018,28(7)
杜立群,齐磊杰,朱和卿,赵雯,阮久福.基于电化学沉积的金属基微射频T形功分器研制[J],电加工与模具,2018,3:26-30,44
杜立群,李爰琪,齐磊杰,李晓军,朱和卿,赵雯,阮久福.高精度AZ厚胶光刻及在微型射频同轴器制作中的应用[J],航空制造技术,2018,61(9):26-31
Du Liqun,Li Yu,Zhao Jian,Wang Weitai,Zhao Wenjun,Zhao Wen,Zhu Heqing.A low-g MEMS inertial switch with a novel radial electrode for uniform omnidirectional sensitiv...[J],SENSORS AND ACTUATORS A-PHYSICAL,2018,270:214-222
高林松,吕继组,白敏丽,胡成志,杜立群.微米结构表面强化沸腾传热实验研究[A],2018
Song, Chang,Du, Liqun,Qi, Leijie,Li, Yu,Li, Xiaojun,Li, Yuanqi.Residual stress measurement in a metal microdevice by micro Raman spectroscopy[J],JOURNAL OF MICROMECHANICS AND MICROENGINEERING,2017,27(10)
Song, Chang,Du, Liqun,Li, Xiaojun,Li, Yuanqi,Qi, Leijie,Li, Yu.Residual stress modeling and analysis for micro electroforming layer[J],MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS,2017,23(10):4709-4716
杜立群,李庆峰,李爰琪,赵文君.基于电化学刻蚀与微电铸工艺的微流控芯片模具制作[J],航空制造技术,2017,17:16-20
杜立群,赵雪岭,宋畅.Ni-SiC复合电铸层内应力实验研究[J],电加工与模具,2017,4:38-42
杜立群,陶友胜,李爰琪,齐磊杰.基于电化学沉积的高深宽比无源MEMS惯性开关的研制[J],航空制造技术,2017,14:24-29
Du, Liqun,Hao, Yongping,Liu, Shuangjie,Yang, Tong,Zhao, Ming,Luo, Lei,Tao, Yousheng,Chen, Shengli.Stress reduction method in fabrication of a multi-scale inertial switch with ultra-high aspect ...[J],3rd International Conference on Engineering and Technology Innovation (ICETI),2017,23(6,SI):1867-1877
罗磊,杜立群,赵明,李宇,李晓军.基于微电铸工艺的高深宽比引信开关制作[J],电加工与模具,2017,2:40-44
徐征,崔岩,刘冲,刘军山,王大志,杜立群.MEMS设计课程教学方法研究[J],教育教学论坛,2017,12:186-187
徐征,栾庆蕾,曹栋,杜立群,刘冲.用于微反应器塑件整平的等温热压工艺[J],光学精密工程,2016,24(11):2705-2711
Zhang, Xiaolei,Du, Liqun,Zhao, Ming,Song, Chang.Investigation in the interface adhesion strength between SU-8 photoresist and metal substrate b...[J],MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS,2016,22(10):2425-2433
Shao, Ligeng,Wang, Liding,Du, Liqun.Influence of initial current density on bonding strength between Ni layer and Cu substrate in m...[J],JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY,2016,30(18):2013-2023
杜立群,陈胜利,陶友胜,罗磊,赵明,刘双杰.跨尺度、高深宽比惯性微开关制作工艺研究[J],电加工与模具,2016,4:26-29,44
邵力耕,王法震,杜立群,王立鼎.微电铸中电场均匀性分布与控制方法[J],传感技术学报,2016,29(5):675-680
杜立群,杨彤,赵明,王磊,刘冲,陶友胜,罗磊.超声电铸提高金属微流控芯片模具的均匀性[J],强激光与粒子束,2016,28(6):064111-1-064111-5
Du, Liqun,Yang, Tong,Zhao, Ming,Tao, Yousheng,Luo, Lei,Wang, Lei,Liu, Chong.Study on Improving Thickness Uniformity of Microfluidic Chip Mold in the Electroforming Process[J],MICROMACHINES,2016,7(1):1-12
王大志,任同群,张宏,崔岩,孙晶,梁军生,刘冲,张永顺,杜立群.论双语教学在"微纳米制造技术"课程中的应用[J],教育教学论坛,2015,49:184-185
Feng, Zhihua,Shao, Ligeng,Du, Liqun,Wang, Liding.Threefold Diffusion Layer Model for One Kind of Pulse Reverse Nanoelectroforming[J],JOURNAL OF COMPUTATIONAL AND THEORETICAL NANOSCIENCE,2015,12(9):2259-2263
Du, Liqun,Zhao, Ming,Wang, Aoan,Chen, Shengli,Nie, Weirong.Fabrication of novel MEMS inertial switch with six layers on a metal substrate[J],MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS,2015,21(9,SI):2025-2032
Song C.,Du L.,Yang T.,Luo L.,Tao Y.,Zhang X..Experimental study on the relationship between dislocation density and internal stress in micro e...[J],Key Engineering Materials,2015,645:405-410
Du L.,Yin P.,Zhao Z.,Li Q.,Tan Z.,Song C..Study on internal stress in micro-electroformed layer[J],Key Engineering Materials,2015,645:178-183
杜立群,王大志,崔岩,刘军山,徐征,李经民.“MEMS技术基础”课程教学方法的改革与实践[J],教育教学论坛,2015,16:124-125
杜立群,位广彬,杨彤,陈胜利.金属表面微坑阵列掩膜电化学刻蚀技术研究[J],电加工与模具,2015,2:29-32,37
杜立群,鲍其雷,赵明,王翱岸.在金属基底上制作高深宽比金属微光栅的方法[J],光学精密工程,2015,23(3):700-707
Zhao, Zhong,Du, Liqun.Quantitative relationship between crystallite size and adhesion strength of the electroforming ...[J],MICRO & NANO LETTERS,2015,10(2):64-66
杜立群.Fabrication of SU-8 microneedle based on backside exposure technology[A],2015,645
杜立群.Study on internal stress in micro-electroformed layer[A],2015,645:178-183
杜立群.Experimental study on the relationship between dislocation density and internal stress in micro e...[A],2015,645:405-410
Zhang, Xiaolei,Du, Liqun,Zhao, Ming.Quantitative Investigation of the Adhesion Strength Between an SU-8 Photoresist and a Metal Sub...[J],JOURNAL OF APPLIED POLYMER SCIENCE,2014,131(24,SI)
Du L.,Wang Z.,Ruan X.,Chen S.,Shan Q..Fabrication of SU-8 micro needle based on backside exposure technology[A],2014,645-646:853-858
赵丹阳,郭纯方,田倩倩,杜立群,王敏杰.仿生鲨鱼皮减阻微沟槽滚压复制技术基础研究[A],2014,95-99
Shao, Ligeng,Du, Liqun,Wang, Liding.Enhancing the Adhesion Strength Between Cu Substrate and Ni Layer in Microelectroforming[J],MATERIALS AND MANUFACTURING PROCESSES,2014,29(7):795-800
Xi Zhanwen,Zhang Ping,Nie Weirong,Du Liqun,Cao Yun.A novel MEMS omnidirectional inertial switch with flexible electrodes[J],SENSORS AND ACTUATORS A-PHYSICAL,2014,212:93-101
Shao, Ligeng,Du, Liqun,Liu, Chong,Wang, Liding.Microstructure and mechanical properties of nanocrystalline nickel prepared by pulse reverse mi...[J],JOURNAL OF EXPERIMENTAL NANOSCIENCE,2014,9(3):299-309
Liu, Junshan,Song, Dongfang,Zong, Guoge,Yin, Penghe,Zhang, Xiaolei,Xu, Zheng,Du, Liqun,Liu, Chong,Wang, Liding.Fabrication of SU-8 moulds on glass substrates by using a common thin negative photoresist as a...[J],7th International Conference on Microtechnologies in Medicine and Biology (MMB),2014,24(3)
Zhao, Zhong,Du, Liqun,Tan, Zhicheng.Influence of electrodeposited crystallite size on interfacial adhesion strength of electroforme...[J],MICRO & NANO LETTERS,2014,9(2):73-76
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