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Advanced Materials Interfaces
基本信息
期刊名称 Advanced Materials Interfaces
ADV MATER INTERFACES
期刊ISSN 2196-7350
期刊官方网站 http://onlinelibrary.wiley.com/journal/10.1002/(ISSN)2196-7350
是否OA
出版商 John Wiley and Sons Ltd
出版周期
始发年份
年文章数 540
最新影响因子 5.4(2022)  scijournal影响因子  greensci影响因子
中科院SCI期刊分区
大类学科 小类学科 Top 综述
工程技术2区 CHEMISTRY, MULTIDISCIPLINARY 化学综合3区
MATERIALS SCIENCE, MULTIDISCIPLINARY 材料科学:综合3区
CiteScore
CiteScore排名 CiteScore SJR SNIP
学科 排名 百分位 4.38 1.570 0.836
Engineering
Mechanics of Materials
30 / 352 91%
Engineering
Industrial and Manufacturing Engineering
43 / 579 92%
补充信息
自引率 4.50%
H-index 20
SCI收录状况 Science Citation Index Expanded
官方审稿时间
网友分享审稿时间 数据统计中,敬请期待。
PubMed Central (PML) http://www.ncbi.nlm.nih.gov/nlmcatalog?term=2196-7350%5BISSN%5D
投稿指南
期刊投稿网址 https://www.editorialmanager.com/advmatinterfaces/default.aspx
收稿范围

Aims and Scope

Advanced Materials Interfaces publishes top-level research on interface technologies and effects. Considering any interface formed between solids, liquids, and gases, the journal ensures an interdisciplinary blend of physics, chemistry, materials science, and life sciences. Advanced Materials Interfaces was launched in 2014 and has an Impact Factor of 4.713 (2018 Journal Impact Factor, Journal Citation Reports (Clarivate Analytics, 2019)).

The scope of Advanced Materials Interfaces is dedicated to interfaces and surfaces that play an essential role in virtually all materials and devices. Physics, chemistry, materials science and life sciences blend to encourage new, cross-pollinating ideas, which will drive forward our understanding of the processes at the interface.

Advanced Materials Interfaces covers all topics in interface-related research:

  • Oil / water separation
  • Applications of nanostructured materials
  • 2D materials and heterostructures
  • Surfaces and interfaces in organic electronic devices
  • Catalysis and membranes
  • Self-assembly and nanopatterned surfaces
  • Composite and coating materials
  • Biointerfaces for technical and medical applications

Advanced Materials Interfaces provides a forum for topics on surface and interface science with a wide choice of formats: Reviews, Full Papers, and Communications, as well as Progress Reports and Research News.


收录体裁
Communications
Full Papers
Reviews
Progress Reports
Essays
Correspondences
投稿指南 https://onlinelibrary.wiley.com/page/journal/21967350/homepage/2706_authorresources.html
投稿模板 https://onlinelibrary.wiley.com/page/journal/21967350/homepage/2706_authorresources.html
参考文献格式
编辑信息

Executive Advisory Board:

 

      Hans M. Christen, ORNL

       Harald Fuchs, University of Münster

       Karen K. Gleason, MIT

       Bartosz A. Grzybowski, Northwestern University

       Lei Jiang, CAS Beijing

       Alexander Shluger, UCL

Advisory Board:

 

        Raymond Adomaitis, UMERC

       Ariando, NUS

      Charles Ahn, Yale University

       Robert W. Carpick, University of Pennsylvania

       Lifeng Chi, FUNSOM Institute, Soochow University

       Paul K. Chu, City University of Hong Kong

       Anjana Devi, Ruhr-University Bochum

       Georg Duesberg, Trinity College Dublin

       Mats Fahlman, Linköping University

       Hongjin Fan, NTU

       Jinlong Gong, Tianjin University

       Michael Hitchman, University of Strathclyde

       Gary Hodes, Weizmann Institute

       Rene A. J. Janssen, TU Eindhoven

       Antoine Kahn, Princeton University

       Mikhail Katsnelson, Radboud University, Nijmegen

       David Kisailus, UC Riverside

       Mato Knez, nanoGUNE

       Sander Leeuwenburgh, Radboud University, Nijmegen

       Maria Antonietta Loi, University of Groningen

       Graziella Malandrino, Universitá Degli Studi di Catania

       Francis Maury, CIRIMAT

       Gianfranco Pacchioni, University of Milano-Bicocca

       Jeong Young Park, SCALE Laboratory, KAIST

       Martyn Pemble, University College Cork

       Hailin Peng, Peking University

       Karsten Reuter, TU München

       Mikko Ritala, University of Helsinki

       Jennifer Rupp, Massachusetts Institute of Technology

       Udo Schwingenschlögl, KAUST

       Yukihiro Shimogaki, University of Tokyo

       Taolei Sun, Wuhan University of Technology

       Dan Wang, Institute of Process Engineering, Chinese Academy of Sciences

       Jianjun Wang, Institute of Chemistry, Chinese Academy of Sciences

       Christof Wöll, KIT

       Han Woong Yeom, POSTECH

       Aleksander M. Wrobel, Polish Academy of Sciences

       Kai Wu, Peking University

       Jimmy Yu, The Chinese University of Hong Kong

       Han Zuilhof, Wageningen UR

       Qiang Zhang, Tsinghua University

       Nanfeng Zheng, Xiamen University


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