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Ultralow Interfacial Thermal Resistance of Graphene Thermal Interface Materials with Surface Metal Liquefaction
Nano-Micro Letters ( IF 31.6 ) Pub Date : 2022-12-09 , DOI: 10.1007/s40820-022-00979-2
Wen Dai 1, 2 , Xing-Jie Ren 3 , Qingwei Yan 1, 2 , Shengding Wang 4 , Mingyang Yang 1 , Le Lv 1, 2 , Junfeng Ying 1, 2 , Lu Chen 1, 2 , Peidi Tao 1 , Liwen Sun 1, 2 , Chen Xue 1, 2 , Jinhong Yu 1, 2 , Chengyi Song 5 , Kazuhito Nishimura 6 , Nan Jiang 1, 2 , Cheng-Te Lin 1, 2
Affiliation  

  • A three-tiered thermal interface materials was proposed with the through-plane thermal conductivity up to176 W m−1 K−1 and contact thermal resistance as low as 4–6 K mm2 W−1 (double sides).

  • The liquid metal acts as a buffer layer to connect vertically aligned graphene with the rough heater/heat sink, improving effective contact thermal conductance by more than an order of magnitude.



中文翻译:

表面金属液化石墨烯热界面材料的超低界面热阻

  • 提出了一种三层热界面材料,其平面导热系数高达176 W m -1 K -1,接触热阻低至4-6 K mm 2 W -1(双面)。

  • 液态金属充当缓冲层,将垂直排列的石墨烯与粗加热器/散热器连接,从而将有效接触热导率提高一个数量级以上。

更新日期:2022-12-09
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