SiC devices are promising for outperforming Si counterparts in high-frequency applications due to its superior material properties. Conventional wirebonded packaging scheme has been one of the most preferred package structures for power modules. However, the technique limits the performance of a SiC power module due to parasitic inductance and heat dissipation issues that are inherent with aluminum wires. In this article, low parasitic inductance and high-efficient cooling interconnection techniques for Si power modules, which are the foundation of packaging methods of SiC ones, are reviewed first. Then, attempts on developing packaging techniques for SiC power modules are thoroughly overviewed. Finally, scientific challenges in the packaging of SiC power module are summarized.

中文翻译：

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功率模块包装方案审查

SiC器件具有优异的材料性能，因此有望在高频应用中优于Si器件。常规的引线键合封装方案已成为功率模块最优选的封装结构之一。但是，由于铝线固有的寄生电感和散热问题，该技术限制了SiC电源模块的性能。本文首先综述了作为SiC功率模块封装方法基础的Si功率模块的低寄生电感和高效冷却互连技术。然后，全面概述了开发SiC功率模块封装技术的尝试。最后，总结了SiC功率模块包装中的科学挑战。