程萍 - 上海交通大学 - 微纳电子学系

个人简介

2000-2005年上海交通大学获工学博士学位（硕博连读）；2006-2008年清华大学博士后；2008-2016年上海交通大学副研究员；2016-2017年美国加州大学伯克利分校伯克利传感器与执行器中心(BSAC)博士后；2017- 至今上海交通大学电子信息与电气工程学院微纳电子学系副研究员

研究领域

1高温MEMS工艺与器件；2、三维高密度封装；3、非硅微纳加工技术及器件；4、表面／界面失效机理研究

近期论文

查看导师最新文章（温馨提示：请注意重名现象，建议点开原文通过作者单位确认）

[1]Ping Cheng, Hong Wang, Guifu Ding. Recent progress in through silicon vias (TSVs): Cu filling, microstructure characterization and mechanical properties. IEEE CPMT Symposium, Kyoto University, 2013, Japan, Invited talk [2]Ping Cheng, Ying Zhang, Shenping Mao, Hong Wang, Guifu Ding*, Congchun Zhang, Xuhan Dai, Xiaolin Zhao. Novel electro-thermal latching micro-switch based on Ni/electrophoretic polymer micro-cantilevers. Journal of Micromechanics and Microengineering. 2014, 24(12 ): 125015 (9pp) [3]Jie Han, Ping Cheng*, Hong Wang, Congchun Zhang, Jiubin Zhang, YanWang, Li Duan, Guifu Ding. MEMS-based Pt film temperature sensor on an alumina substrate. Materials Letters. 2014, 125:224–226 [5]Yazhou Zhang, Guifu Ding, Hong Wang, Ping Cheng*. Optimization of innovative approaches to the shortening of filling times in 3D integrated through-silicon vias (TSVs). Journal of Micromechanics and Microengineering. 2015, 25(4):045009 (11pp) [6]Yazhou Zhang, Guifu Ding, Hong Wang, and Ping Cheng*. Effect of External Factors on Copper Filling in 3D Integrated. Journal of the Electrochemical Society. 2015, 162 (9) D427-D434 [7]Yazhou Zhang, Yunna Sun, Guifu Ding, Yan Wang, Hong Wang, and Ping Cheng*. Numerical Simulation and Mechanism Analysis of Through-Silicon Via (TSV) Filling Using an Arbitrary Lagrange-Eulerian (ALE) Method. Journal of the Electrochemical Society. 2015,162 (10) :D540-D549 [8]Zhaoyu Wang, Hong Wang, Ping Cheng*, Guifu Ding, Xiaolin Zhao. Simultaneous filling of through silicon vias（TSV）with different aspect ratios using multi-step direct current density. Journal of Micromechanics and Microengineering. 2014, 24(8 ): 085013(8pp) [9]Gu Ting, Cheng Ping*, Wang Huiying，Dai Xuhan，Wang Hong，Ding Guifu. Micro-Compression Testing of TSV Copper Pillar: An in-situ Method and Mechanical Property. Electronic Materials Letters, 2014, 10 ( 4): 851-855 [10]Zhang Yazhou, Ding Guifu, Wang Hong, Cheng Ping*, Luo Jiangbo. Effect of Seed Layer Thickness Distribution on 3D Integrated Through-Silicon-Vias (TSVs) Filling Model. ECS Electrochemistry Letters. 2015, 4(6): D18-D20 [11]Zhang Yazhou, Ding Guifu, Cheng Ping, Wang Hong. Numerical Simulation and Experimental Verification of Additive Distribution in Through-Silicon Via during Copper Filling Process. Journal of the Electrochemical Society. 2015, 162(1): D62-D67 [14]Ming Wang, Ping Cheng, Jianhua Li, Yan Wang, Hong Wang, Guifu Ding and Xiaolin Zhao. Fabrication and performances of a novel copper-ordered-reinforced polymer composite interpose. Journal of Micromechanics and Microengineering. 24 (2014) 025016 (8pp) [15]Huiying Wang, Ping Cheng, Su Wang, Hong Wang, Ting Gu, Junyi Li, Xiao Gu, Guifu Ding*. Effect of thermal treatment on the mechanical properties of Cu specimen fabricated using electrodeposition bath for through-silicon-via filling. Microelectronic Engineering. 2014, 114: 85–90