郭福 - 北京工业大学 - 材料科学与工程学院

个人简介

1994年本科毕业、1997年硕士毕业于北京工业大学金属材料科学与工程学系（现材料科学与工程学院）。从1997年起赴美国留学，于2001年11月在美国密歇根州立大学(Michigan State University)获得材料科学与工程专业的博士学位。2001年12月开始在美国密歇根州立大学电子与计算机工程系电子材料实验室进行博士后研究工作。　　2003年8月回国，于2003年9月起在北京工业大学材料学院任教，2004年1月起任教授，2004年5月任博士生导师，2004年12月任材料学院党委副书记。

近期论文

查看导师最新文章（温馨提示：请注意重名现象，建议点开原文通过作者单位确认）

Ruihong Zhang, Guangchen Xu, Xitao Wang, Fu Guo, Andre Lee, and K.N. Subramanian, “Electromigration in Sn-Bi Modified with Polyhedral Oligomeric Silsesquioxane”, Journal of Electronic Materials, 39(12), 2513(2010). Fu Guo, Guangchen Xu, Hongwen He, Mengke Zhao, Jia Sun, and C. Henry Wang, "Effect of Electromigration and Isothermal Aging on the Formation of Metal Whiskers and Hillocks in Eutectic SnBi Solder Joints and Reaction Films", Journal of Electronic Materials, 38(12), 2647(2009). Ruihong Zhang, Ran Zhao, Fu Guo, Xia, and Zhidong Xia, “Interfacial reaction between the electroless nickel immersion gold substrate and Sn-based solders”, Microelectronics Reliability, 49(3), 303(2009). Fu Guo, Guangchen Xu, and Hongwen He, "Electromigration behaviors in Sb particle-reinforced composite eutectic SnAgCu solder joints", Journal of Materials Science, 44(20), 5595(2009). Fu Guo, Guangchen Xu, Jia Sun, Zhidong Xia, Yongping Lei, Yaowu Shi, and Xiaoyan Li, "Resistance changes in eutectic SnBi solder joints during electromigration," Journal of Electronic Materials, 38(12), 2756(2009). Fu Guo, Mengke Zhao, Zhidong Xia, Yongping Lei, Xiaoyan Li, and Yaowu Shi, “Lead-free solders with rare earth additions”, JOM, 61(6), 39(2009). Fu Guo, “Composite lead-free electronic solders”, J Mater Sci: Mater Electron, volume 18, Numbers 1-3, ISSN 0957-4522 March 2007, pp.129 F. Guo, J.G. Lee, and K.N. Subramanian, “Electrical conductivity changes in bulk Sn, and eutectic Sn-Ag in bulk and in joints, from aging and thermal shock”, Journal of Materials Research, 20 (2), 364 (2005). K.F. Hsu, S. Loo, F. Guo, W. Chen, J. S. Dyck, C. Uher, T. Hogan, E. K. Polychroniadis, M.G. Kanatzidis, “Cubic AgPbmSbTe2+m: Bulk Thermoelectric Materials with High Figure of Merit”, Science, 303, 818 (2004). J.R. Salvador, D. Bilc, S.D. Mahanti, T. Hogan, F. Guo, and M.G. Kanatzidis, “Yb8Ge3Sb5, a metallic mixed-valent Zintl phase containing the polymeric 1(infinity)[Ge3(4-)] anions”, Journal of the American Chemical Society, 126 (14), 4474 (2004). C.H. Kim, S.S. Kim, F. Guo, T. P. Hogan, T.J. Pinnavaia, “Polymer Intercalation in Mesostructured Carbon”, Advanced Materials, 16 (8), 736 (2004). J.R. Salvador, F. Guo, T. Hogan, and M.G. Kanatzidis, “Zero Thermal Expansion in YbGaGe due to an Electronic Valence Transition”, Nature, 425, 704 (2003).