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Effect of Component Flexibility During Thermal Cycling of Sintered Nano-Silver Joints by X-ray Microtomography

  • TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder
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Abstract

X-ray tomography was used to monitor damage evolution in nano-silver sintered joints during thermal cycling. Samples consisted of a silicon die joined to a direct bond copper substrate by sintering nano-silver paste. The amount of observable damage was significantly affected by the amount of allowable warping during the thermal cycling tests. By fully constraining the sample from flexing during thermal cycling, all observable damage was eliminated.

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Acknowledgments

Financial support from the Toyota Research Institute of North America (TRINA) is gratefully acknowledged. The authors acknowledge the use of research facilities at ASU-NanoFab Cleanroom and the Center for 4D Materials Science at Arizona State University. The authors are thankful to Dr. Stefan Myhajlenko for helpful discussions regarding metallization and sample preparation.

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Authors and Affiliations

  1. Center for 4D Materials Science, School for Engineering of Matter, Transport, and Energy (SEMTE), Arizona State University, 501 E. Tyler Mall, ECG 303, Tempe, AZ, 85287-6106, USA

    Jason J. Williams, Irene Lujan Regalado & Nikhilesh Chawla

  2. Toyota Research Institute of North America, 1555 Woodridge Ave., Ann Arbor, MI, 48105, USA

    Leo Liu & Shailesh Joshi

Authors
  1. Jason J. Williams
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  2. Irene Lujan Regalado
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  3. Leo Liu
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  4. Shailesh Joshi
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  5. Nikhilesh Chawla
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Correspondence to Nikhilesh Chawla.

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Williams, J.J., Regalado, I.L., Liu, L. et al. Effect of Component Flexibility During Thermal Cycling of Sintered Nano-Silver Joints by X-ray Microtomography. J. Electron. Mater. 49, 241–244 (2020). https://doi.org/10.1007/s11664-019-07461-7

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  • DOI: https://doi.org/10.1007/s11664-019-07461-7

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