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Optimizing temperature gradient for rapid fabrication of Cu/Sn/Cu full intermetallic compounds joints via vacuum thermal compression bonding

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Abstract

This study employed an improved thermal compression bonding process with two temperature settings (180 °C/250 °C, 250 °C/250 °C) to rapidly fabricate the complete intermetallic compound joints. While observing and evaluating the microstructure and shear strength of the joints, the influence of holding time and temperature gradients on the growth and evolution of the interfacial IMCs were investigated. The results demonstrated that reducing the temperature gradient can mitigate the adverse effects caused by significant differences in IMC thickness, while an overall increase in system temperature accelerated IMC growth. Utilizing vacuum thermal compression bonding allowed the rapidly forming complete IMC joints within 15 to 30 min and suppressed the voids effectively. In comparison to traditional transient liquid phase bonding, the rate of full IMC joints formation was accelerated by a factor of 2 to 4, accompanied by an average shear strength enhancement ranging from 8.9 to 18.7%. Thus, vacuum thermal compression bonding demonstrates the potential for rapidly fabricating high-strength full IMC joints with the judicious selection of appropriate temperature conditions, representing a promising technological advancement.

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The authors declare that all data supporting the findings of this study are available within the article.

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Acknowledgements

This work was supported by the High Level Talent Research Initiation Project of Xiamen University of Technology (YKJ22054R), Fujian Provincial “Minjiang Scholar” Distinguished Professor Talent Plan Project, and the Natural Science Foundation of Jiangsu Province (BK20211351).

Funding

High Level Talent Research Initiation Project of Xiamen University of Technology, YKJ22054R. Fujian Provincial “Minjiang Scholar” Distinguished Professor Talent Plan Project, Natural Science Foundation of Jiangsu Province, BK20211351.

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Authors and Affiliations

  1. School of Materials Science and Engineering, Xiamen University of Technology, Xiamen, 361024, China

    Chen Chen, Liang Zhang, Xing-Yu Guo, Jia-Min Zhang & Xi Huang

  2. School of Mechatronic Engineering, Jiangsu Normal University, Xuzhou, 221116, China

    Chen Chen

Authors
  1. Chen Chen
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  2. Liang Zhang
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  3. Xing-Yu Guo
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  4. Jia-Min Zhang
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  5. Xi Huang
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Contributions

Chen Chen: Conceptualization, Methodology, Data curation, Writing—original draft preparation, and editing; Liang Zhang: Corresponding author, Data curation, Reviewing, and editing; Xing-yu Guo: Reviewing and investigation; Jia-min Zhang: Investigation, Supervision; Xi Huang: Validation, Investigation.

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Correspondence to Liang Zhang.

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Chen, C., Zhang, L., Guo, XY. et al. Optimizing temperature gradient for rapid fabrication of Cu/Sn/Cu full intermetallic compounds joints via vacuum thermal compression bonding. J Mater Sci: Mater Electron 35, 823 (2024). https://doi.org/10.1007/s10854-024-12604-6

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  • DOI: https://doi.org/10.1007/s10854-024-12604-6

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