Data and code availability
This study did not generate/analyze any datasets or code.
Germanium, a representative diamond-cubic semiconductor, shows enhanced carrier mobility under mechanical strains. It has great potential for optoelectronics and ultrafast semiconductor devices. Traditionally, diamond-cubic materials are quite brittle, which hinders investigations of their mechanical properties at relatively low temperatures. Here, we have used in situ compression of micron-sized specimens to study plasticity in single crystalline Ge over a wide temperature range, including cryogenic temperatures. This spans a homologous temperature range of 0.14–0.56 Tm for Ge. We have investigated the influence of size as a function of both temperature and strain rate in this temperature range to encompass all three deformation mechanism regimes for diamond-cubic crystals. This provides information on fundamental plasticity and associated defect behavior for the design and fabrication of Ge-based microdevices.
This study did not generate/analyze any datasets or code.
Lead contact