Abstract
Ni electrochemical deposition into a matrix of various diameters (500–2000 nm) vertical vias in Si/SiO2 substrates with a barrier layer at the vias’ bottom has been investigated. Morphological study of Ni deposits in the vias showed they are deposited directly on the surface of the barrier layer. Repeatability and stability in combination with a homogeneous structure and 70% filling degree of vias determine the prospects of the Si/SiO2/Ni system as a basic element for the creation of three-dimensional micro-, nanostructures, and 3D assembly of IC crystals.
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Ali G, Ahmad M, Javed IA, Khan M, Shafqat K, Muhammad M, Yang SG (2010) Characterization of cobalt nanowires fabricated in anodic alumina template through AC electrodeposition. IEEE Trans Nanotechnol 9(2):223–228. https://doi.org/10.1109/TNANO.2009.2027599
Arumugam PU, Chen H, Siddiqui S, Weinrich JAP, Jejelowo A, Li J, Meyyappan M (2009) Wafer-scale fabrication of patterned carbon nanofiber nanoelectrode arrays: a route for development of multiplexed, ultrasensitive disposable biosensors. Biosens Bioelectron 24(9):2818–2824. https://doi.org/10.1016/j.bios.2009.02.009
Bajpai VK, Pant P, Solanki CS (2017) Thin uniform nickel seed layer formation and its impact on Ni-Cu contact adhesion for c-Si solar cell applications. Sol Energy 155:62–74. https://doi.org/10.1016/j.solener.2017.06.002
Banerjee A, Halder N (2010) Electrochemical growth of ordered nickel nano-rods within a composite structure of anodic-alumina-membrane/metal/silicon substrate. J Nanosci Nanotechnol 10(7):4252–4258. https://doi.org/10.1166/jnn.2010.2675
Basaev AS, Shulitskii BG, Vorob'eva AI, Prudnikova EL, Labunov VA, Mozalev AM, Shaman YP, Kukin VN (2011) Nanocomposite carbon material with ordered structure synthesized using porous aluminum oxide. Nanotechnol Russia 6(3–4): Article No.171. https://doi.org/10.1134/S1995078011020029
Chiodarelli N, Kellens K, Cott DJ, Peys N, Arstila K, Heyns MM, De Gendt S, Groeseneken G, Vereecken PM (2009) Integration of vertical carbon nanotube bundles for interconnects. J Electrochem Soc 157:K211–K217. https://doi.org/10.1149/1.3246595
Defforge T, Billoué J, Diatta M, Tran-Van F, Gautier G (2012) Copper-selective electrochemical filling of macropore arrays for through-silicon via applications. Nanoscale Res Lett 7:Article No. 375. https://doi.org/10.1186/1556-276X-7-375
Demyanov SE, Kaniukov EY, Petrov AV, Belonogov EK, Streltsov EA, Ivanov DK, Ivanova YA, Trautmann C, Terryn H, Petrova M, Ustarroz J, Sivakov V (2014) On the morphology of Si/SiO2/Ni nanostructures with swift heavy ion tracks in silicon oxide. J Surf Investig. X-Ray, Synchrotron Neutron Techniques 8:805–813. https://doi.org/10.1134/S1027451014040326
Dixit P, Miao J (2006) Aspect-ratio-dependent copper electrodeposition technique for very high aspect-ratio through-hole plating. J Electrochem Soc 153(6):G552–G559. https://doi.org/10.1149/1.2189238
Dixit P, Chen X, Miao J, Divakaran S, Preisser R (2007) Study of surface treatment processes for improvement in the wettability of silicon-based materials used in high aspect ratio through-via copper electroplating. Appl Surf Sci 253(21):8637–8646. https://doi.org/10.1016/j.apsusc.2007.04.067
Edelstein DC, Sai-Halasz GA, Mii YJ (1995) VLSl on-chip interconnection performance simulations and measurements. IBM J Res Dev 39:383–402. https://doi.org/10.1147/rd.394.0383
Joo SW, Banerjee AN (2010) Field emission characterization of vertically oriented uniformly grown nickel nanorod arrays on metal-coated silicon substrate. J Appl Phys 107(11):Article No.114317. https://doi.org/10.1063/1.3443577
Kaniukov EY, Demyanov SE (2011) Engineering of low-temperature magnetic field sensors based on heterostructures Si/SiO2/Ni. Pribory i metody izmerenij (rus) 1(2):10–16. ISSN 2220-9506 (print), ISSN 2414-0473 (online)
Kye-Sun P, Sunjun K (2010) Seedless copper electrodeposition onto tungsten diffusion barrier. J Electrochem Soc 157:D609–D613. https://doi.org/10.1149/1.3491351
Lu LM, Zhang L, Qu FL, Lu HX, Zhang XB, Wu ZS, Huan SY, Wang QA, Shen GL, Yu RQ (2009) A nano-Ni based ultrasensitive nonenzymatic electrochemical sensor for glucose: enhancing sensitivity through a nanowire array strategy. Biosens Bioelectron 25(1):218–223. https://doi.org/10.1016/j.bios.2009.06.041
Malferrari L, Jagminiene A, Veronese GP, Odorici F, Cuffiani M, Jagminas A (2009) Alumina template-dependant growth of cobalt nanowire arrays. J Nanotechnol Article ID 149691. https://doi.org/10.1155/2009/149691
Mallory GO (1990) The fundamental aspects of electroless nickel plating. In: Mallory GO, Hajdu JB (eds) Electroless plating: fundamentals & applications, 1st edn. American Electroplaters and Surface Finishers Society, Orlando, pp 1–56
Moffat TP, Walker M, Chen PJ, Bonevich JE, Egelhoff WF, Richter L, Witt C, Aaltonen T, Ritala M, Leskelä M, Josell D (2006) Electrodeposition of Cu on Ru barrier layers for damascene processing. J Electrochem Soc 153(1):C37–C50. https://doi.org/10.1149/1.2131826
Musa S, Rand DR, Cott DJ, Loo J, Bartic C, Eberle W, Nuttin B, Borghs G (2012) Bottom-up SiO2 embedded carbon nanotube electrodes with superior performance for integration in implantable neural microsystems. ACS Nano 6:4615–4628. https://doi.org/10.1021/nn201609u
Nay L, Huili W, Dixit Pradeep Xu, Ting ZS, Jianmin M (2009) Investigation of carbon nanotube growth on multimetal layers for advanced interconnect applications in microelectronic devices. J Electrochem Soc 156:K23. https://doi.org/10.1149/1.3060347
Nielsch K, Müller F, Li A, Gösele U (2000) Uniform nickel deposition into ordered alumina pores by pulsed electrodeposition. Adv Mater 12(8):582–586. https://doi.org/10.1002/(SICI)1521-4095(200004)12:8%3c582::AID-ADMA582%3e3.0.CO;2-3
Nihei M, Kawabata A, Kondo D, Horibe M, Sato S, Awano Y (2005) Electrical properties of carbon nanotube bundles for future via interconnects. Jpn J Appl Phys 44:1626–1628. https://doi.org/10.1143/JJAP.44.1626
Okotrub AV, Kurenya AG, Gusel’nikov AV, Kudashov AG, Bulusheva LG, Berdinskii AS, Ivanova YA, Ivanov DK, Strel’tsov EA, Fink D, Petrov AV, Belonogov EK (2009) The field emission properties of carbon nanotubes and SiC whiskers synthesized over Ni particles deposited in ion tracks in SiO2. Nanotechnol Russ 4(9–10):627–633. https://doi.org/10.1134/S1995078009090079
Radisic A, Cao Y, Taephaisitphongse P, West AC, Searson PC (2003) Direct copper electrodeposition on TaN barrier layers. J Electrochem Soc 150(5):C362–C367. https://doi.org/10.1149/1.1565137
Radisic A, Lühn O, Philipsen HGG, El-Mekki Z, Honore M, Rodet S, Armini S, Drijbooms C, Bender H, Ruythooren W (2011) Copper plating for 3D interconnects. Microelectron Eng 88:701–704. https://doi.org/10.1016/j.mee.2010.06.030
Razeeb KM, Rhen FMF, Roy S (2009) Magnetic properties of nickel nanowires: effect of deposition temperature. J Appl Phys 105(8):Article No.083922. https://doi.org/10.1063/1.3109080
Santos A, Vojkuvka L, Pallares J, Ferre-Borrull J, Marsal LF (2009) Cobalt and nickel nanopillars on aluminum substrates by direct current electrodeposition process. Nanoscale Res Lett 4:1021–1028. https://doi.org/10.1007/s11671-009-9351-5
Sharma G, Kripesh V, Sim MC, Sow CH (2007) Synthesis and characterization of patterned and nonpatterned copper and nickel nanowire arrays on silicon substrate. Sensor Actuat a: Phys 139(1–2):272–280. https://doi.org/10.1016/j.sna.2006.10.049
Song C, Wang Z, Chen Q, Cai J, Liu L (2008) High aspect ratio copper through-silicon-vias for 3D integration. Microelectronic Eng 85:1952–1956. https://doi.org/10.1016/j.mee.2008.05.017
Soo KM, Jin WS, Jin LY, Hee HJ, Hae CJ, Ho LB, Sun SD, Ho PS, Woong KJ (2011) CVD-cobalt for low resistance word line electrode of 3D NAND flash memory. In: Proc. 2011 IEEE int. interconnect technol. conf., pp 1–3. https://doi.org/10.1109/IITC.2011.5940281
Toimil-Molares ME, Buschmann V, Dobrev D, Scholz R, Schuchert IU, Vetter J (2001) Single-crystalline copper nanowires produced by electrochemical deposition in polymeric ion track membranes. Adv Mater 13:62–65. https://doi.org/10.1002/1521-4095(200101)13:1%3c62::AID-ADMA62%3e3.0.CO;2-7
Tőkei Z (2016) End of Cu roadmap and beyond Cu. In: 2016 IEEE int. interconnect. technol. conf./adv. metalliz. conf. (IITC/AMC), pp 1–58. https://doi.org/10.1109/IITC-AMC.2016.7507738
van der Veen MH, Vandersmissen K, Dictus D, Demuynck S, Liu R, Bin X, Nalla P, Lesniewska A, Hall L, Croes K, Zhao L, Bömmels J, Kolics A, Tökei Z (2015) Cobalt bottom-up contact and via prefill enabling advanced logic and DRAM technologies. In: Proc. 2015 IEEE int. interconnect tech. conf./IEEE mater. adv. metallization conf., pp 25–28. https://doi.org/10.1109/IITC-MAM.2015.7325605
Vorob’eva AI (2009) Fabrication techniques of electrode arrays for carbon nanotubes. Phys Usp 52:225–234. https://doi.org/10.3367/UFNe.0179.200903b.0243
Vorobyova AI, Outkina EA, Komar OM (2013) Study of metal pillar nanostructure formation with thin porous alumina template. Thin Solid Films 548:109–117. https://doi.org/10.1016/j.tsf.2013.09.016
Vorobyova AI, Outkina EA, Khodin AA (2016) Nickel/alumina nanocomposites by AC electrochemical processing. Appl Phys A: Mater Sci Process 122(2):Article No.130. https://doi.org/10.1007/s00339-016-9611-z
Vyas AA, Zhou C, Yang CY (2018) On-chip interconnect conductor materials for end-of-roadmap technology nodes. IEEE Trans Nanotechnol 17(1):4–10. https://doi.org/10.1109/TNANO.2016.2635583
Wolf MJ, Dretschkow T, Wunderle B, Jurgensen N, Engelmann G, Ehrmann O, Uhlig A, Michel B, Reichl H (2008) High aspect ratio TSV copper filling with different seed layers. In: ECTC: electronic components and technology conf. 27–30 May 2008, Lake Buena Vista, FL (IEEE, 2008), pp 563–570. https://doi.org/10.1109/ECTC.2008.4550029
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Vorobjova, A.I., Labunov, V.A., Outkina, E.A. et al. Local electrochemical deposition of Ni into vertical vias in Si/SiO2 substrate. Microsyst Technol 28, 1925–1933 (2022). https://doi.org/10.1007/s00542-022-05335-3
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DOI: https://doi.org/10.1007/s00542-022-05335-3