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Licensed Unlicensed Requires Authentication Published by De Gruyter April 1, 2022

Applying metal coatings to dielectric materials by photochemical processes

  • Shayzada Koshkarbaeva , Vasilya Janpaizova , Kalamkas Amanbaeva , Malik Sataev , Perizat Abdurazova ORCID logo EMAIL logo , Bagdagul Serikbaeva and Yerkebulan Raiymbekov

Abstract

Photochemical processes in thin surface layers of solutions of compounds of the copper subgroup elements leading to the formation of dispersed metal particles on the surface of dielectrics are investigated. It is shown that dispersed particles of elemental gold are formed on dielectrics moistened with AuCl3 solution and exposed to sunlight. At the same time, there is no need to use any chemical reducing agents. On cotton fabrics moistened with solutions of AgNO3, CuBr2, when exposed to sunlight, silver and copper monohalides are formed, respectively. These processes take place with the participation of terminal cellulose molecules and also do not require the use of chemical reducing agents. In addition, it was found that copper monohalides can be converted into elemental copper particles by a photochemical reaction involving ascorbic acid. Examples of metallization of a number of dielectrics using photochemical activation using sunlight are given.


Corresponding author: Perizat Abdurazova, M.Auezov South Kazakhstan University, Shymkent, Kazakhstan, E-mail:

  1. Author contributions: Conceptualization – M.S.; Software, Formal analysis – K.A., Y.R.; Investigation – B.S.; Resources, Writing - Original Draft – S.K.; Writing - Review & Editing – P.A., Y.R.; Visualization, Data Curation – V.D.

  2. Research funding: The authors received no specific funding for this article.

  3. Conflict of interest statement: The authors declare no conflicts of interest regarding this article.

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Received: 2021-12-27
Accepted: 2022-03-18
Published Online: 2022-04-01

© 2022 Walter de Gruyter GmbH, Berlin/Boston

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