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Study on the Insulation Performance and Decomposition Characteristics of C5F10O/CO2 Gas Mixture

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Abstract

As a potential alternative to SF gas, C5F10O has excellent insulation performance. The researches on its insulation performance and decomposition mechanism are very significant for promotion and application. In this paper, power frequency breakdown and lightning impulse test were implemented on C5F10O/CO2 gas mixture under a slightly uneven field. It was found that the insulation performance of C5F10O/CO2 gas mixture at 0.7 MPa could be comparable to SF6 at 0.4 MPa. After detecting the discharge products after pulse spark discharge through electron attachment mass spectrometry, it was found that the products mainly came from the decomposition of C5F10O. The addition of CO2 inhibited the formation of C4F10 and C3F4O, and promoted the formation of CF4O and CF4. The yields of C3F6, C4F10, C3F8, CF4O, C4F10 and C2F2 were positively correlated with the content of C5F10O. The densities of C4F10, C3F4O, C3F8O, CF4O, CF4 and C4F10 increased with the number of discharge pulses, which could be as the characteristic gas of the discharge degree. Although many decomposition products were detected, their yields were very low. These results suggest the promising applicability of C5F10O/CO2 gas mixture for replacing SF6.

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Authors and Affiliations

  1. State Key Laboratory of Electrical Insulation and Power Equipment, Xi’an Jiaotong University, No 28 XianNing West Road, Xi’an, Shaanxi Province, 710049, People’s Republic of China

    Xiaonan Wang, Xiaohua Wang, Huan Yuan, Aijun Yang, Dingxin Liu & Mingzhe Rong

  2. School of Electrical Engineering, Xi’an University of Technology, No 5 JinHua South Road, Xi’an, Shaanxi Province, 710048, People’s Republic of China

    Qingqing Gao

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  1. Xiaonan Wang
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  2. Xiaohua Wang
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  3. Huan Yuan
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Correspondence to Xiaohua Wang or Huan Yuan.

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Wang, X., Wang, X., Yuan, H. et al. Study on the Insulation Performance and Decomposition Characteristics of C5F10O/CO2 Gas Mixture. Plasma Chem Plasma Process 42, 957–971 (2022). https://doi.org/10.1007/s11090-022-10252-4

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