Abstract
In this paper, a SOI MOSFET is proposed using a P-N structure and an electrically hole-free region (EHFR-SOI). In this structure, to improve the electrical characteristics such as short channel effects, self-heating effects, and floating body effects, a Si3N4 layer is used on the source side of the SOI MOSFET with a P-N structure. The proposed technique converts the P-N structure to a N-P-N structure by creating an electrically hole-free region. So, by reducing the applied electric field to the carriers, a significant reduction in the electron temperature of the device will be created. Simulations and studies of the structure show that its thermal behavior is significantly improved. Also, the floating body effect, effective mobility, hot electron effect, and electric field in the structure are enhanced compared to a conventional SOI (C-SOI) structure. In addition, the gate-source and gate-drain capacitors have been improved, which indicates a higher switching speed of the structure.
Similar content being viewed by others
Data Availability
The data that support the findings of this study are available from the authors, upon reasonable request.
References
Plößl A, Kräuter G (2000) Silicon-on-insulator: materials aspects and applications. Solid State Electron 44(5):775–782
Veeraraghavan S, Fossum J (1989) Short-channel effects in SOI MOSFETs. IEEE Trans Electron Devices 36(3):522–528
Zareiee M, Mehrad M (2017) A reliable nano device with appropriate performance in high temperatures. ECS J Solid State Sci Technol 6(4):M50
Chaudhry A, Kumar MJ (2004) Controlling short-channel effects in deep-submicron SOI MOSFETs for improved reliability: a review. IEEE Trans Device Mater Reliab 4(1):99–109
Fukuda Y, Ito S, Ito M (2001) SOI-CMOS device technology. OKI Tech Rev 4:54
Park H, Colinge JP, Cristoloveanu S, Bawedin M (2020) Persistent floating-body effects in fully depleted silicon-on-insulator transistors. Physica Status Solidi (A) 217(9):1900948
Colinge J (2008) The new generation of SOI MOSFETs. Rom J Inf Sci Technol 11(1):3–15
Singh RK, Saxena A, Rastogi M (2011) Silicon on insulator technology review. Int J Eng Sci Emerging Technol 1(1):1–16
Mishra VK, Rao N (2020) Electrostatic investigation of intended source drain ultra thin body FD-SOI MOSFET. Silicon pp. 1–9
Muthuseenu K, Barnaby HJ, Patadia A, Holbert K, Privat A (2020) Ionizing radiation tolerance of stacked Si3N4-SiO2 gate insulators for power MOSFETs. Microelectron Reliab 104:113554
Ramezani Z, Orouji AA (2019) An asymmetric nanoscale SOI MOSFET by means of a PN structure as virtual Hole’s well at the source side. Silicon 11(2):761–773
Shaik RR, Arun G, Chandrasekar L, Pradhan KP (2020) A study of workfunction variation in pocket doped FD-SOI technology towards temperature analysis. Silicon pp. 1–10
Tahne BA, Naderi A, Heirani F (2020) Reduction in self-heating effect of SOI MOSFETs by three vertical 4H-SiC layers in the BOX. Silicon 12(4):975–986
Kononchuk O, Nguyen BY (2014) Silicon-on-insulator (soi) technology: manufacture and applications. Elsevier
Verma S, Abdullah M (2015) Review of SOI MOSFET design and fabrication parameters and its electrical characteristics. Int J Comput Appl 130(17):1
Anvarifard MK, Orouji AA (2013) Improvement of self-heating effect in a novel nanoscale SOI MOSFET with undoped region: a comprehensive investigation on DC and AC operations. Superlattice Microst 60:561–579
Rahimian M, Orouji AA (2012) A novel nanoscale MOSFET with modified buried layer for improving of AC performance and self-heating effect. Mater Sci Semicond Process 15:445–454
Gritsenko VA, Perevalov TV, Islamov DR (2016) Electronic properties of hafnium oxide: a contribution from defects and traps. Phys Rep 613:1–20
Ramezani Z, Orouji AA (2017) Amended electric field distribution: a reliable technique for electrical performance improvement in nano scale SOI MOSFETs. J Electron Mater 46(4):2269–2281
Mehrad M, Zareiee M (2016) Improved device performance in nano scale transistor: an extended drain SOI MOSFET. ECS J Solid State Sci Technol 5(7):M74
Karbalaei M, Dideban D (2016) A novel silicon on insulator MOSFET with an embedded heat pass path and source side channel doping. Superlattice Microst 90:53–67
Mehrad M (2021) Inserting different charge regions in power MOSFET for achieving high performance of the electrical parameters. Silicon 13(4):1107–1111
Triantopoulos K, Cassé M, Barraud S, Haendler S, Vincent E, Vinet M, Ghibaudo G (2019) Self-heating effect in FDSOI transistors down to cryogenic operation at 4.2 K. IEEE Trans Electron Devices 66:3498–3505
Ghaffari M, Orouji AA (2018) A novel nanoscale SOI MOSFET by embedding undoped region for improving self-heating effect. Superlattice Microst 118:61–78
Zareiee M (2017) High performance nano device with reduced short channel effects in high temperature applications. ECS J Solid State Sci Technol vol. 6(7)
Anvarifard MK, Orouji AA (2018) Proper electrostatic modulation of electric field in a reliable nano-SOI with a developed channel. IEEE Trans Electron Devices 65(4):1653–1657
Kamal AK, Singh J (2020) Simulation-based ultralow energy and high-speed LIF neuron using silicon bipolar impact ionization MOSFET for spiking neural networks. IEEE Trans Electron Devices 67(6):2600–2606
Zareiee M (2019) A new architecture of the dual gate transistor for the analog and digital applications. AEU-Int J Electron Commun 100:114–118
Hanaei M, Orouji AA, Ramezani Z, Amiri IS (2020) A silicon on nothing LDMOS with two air pillars in gate insulator for power applications. Silicon 12:2581–2586
Acknowledgments
Not applicable.
Funding
The authors received no financial support for the research, authorship, and/or publication of this article.
Author information
Authors and Affiliations
Contributions
S. Amir Bozorgi: Conceptualization, Writing – original draft, Software.
Ali A. Orouji: Supervision – review & editing.
Abdollah Abbasi: Validation, review & editing.
Corresponding author
Ethics declarations
Ethics Approval and Consent to Participate
Not applicable.
Consent for Publication
Not applicable.
Disclosure of Potential Conflicts of Interest
The authors declare that they have no potential conflicts of interests.
Research Involving Human Participants and/or Animals
Not applicable.
Informed Consent
Not applicable.
Competing Interests
The authors declare that they have no conflict of interest.
Additional information
Publisher’s Note
Springer Nature remains neutral with regard to jurisdictional claims in published maps and institutional affiliations.
Rights and permissions
About this article
Cite this article
Bozorgi, S.A., Orouji, A.A. & Abbasi, A. A Novel Nanoscale SOI MOSFET by Using a P-N Junction and an Electrically Hole Free Region to Improve the Electrical Characteristics. Silicon 14, 5905–5912 (2022). https://doi.org/10.1007/s12633-021-01304-z
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s12633-021-01304-z