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Effect of Conductive Circuits on Bonding Quality of Bimetallic Composite Roll Produced by Electroslag Remelting Cladding

  • Computational Modeling in Pyrometallurgy
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Abstract

A 2D coupled electromagnetic-fluid-thermal analysis based on the Fluent software and the “User-Defined Functions” was performed to investigate the effects of conductive circuits on the bonding quality of a bimetallic composite roll produced by the electroslag remelting cladding (ESRC) process. Three typical conductive circuit schemes were designed and the distribution characteristics of physical fields were calculated and discussed. The results illustrated that the differences in the conductive circuits mainly affected the distributions of electric potential, current density, Joule heating, Lorentz force, flow velocity, and final temperatures in the slag pool, in turn. A high temperature in the slag pool always led to high temperatures at the bimetallic interface and slag/steel interface which determined the bonding quality of bimetals and the solidification quality of the composite layer. Finally, the conductive circuit of electrode → slag pool → total part of current supplying mold (abbreviation ESTM) was recommended, and a GCr15/45 steel composite billet with uniform bimetallic interface was produced by the ESRC process.

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Acknowledgements

The authors are very grateful for financial support from the National Natural Science Foundation of China (52004188 and 51874084) and the China Postdoctoral Science Foundation (2019M652720).

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Authors and Affiliations

  1. The State Key Laboratory of Refractories and Metallurgy, Wuhan University of Science and Technology, Wuhan, 430081, China

    Yulong Cao, Jiawei Li & Guangqiang Li

  2. School of Metallurgy, Northeastern University, Shenyang, 110819, China

    Yanwu Dong & Zhouhua Jiang

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  1. Yulong Cao
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  2. Jiawei Li
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Correspondence to Yanwu Dong.

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Cao, Y., Li, J., Li, G. et al. Effect of Conductive Circuits on Bonding Quality of Bimetallic Composite Roll Produced by Electroslag Remelting Cladding. JOM 73, 2973–2984 (2021). https://doi.org/10.1007/s11837-021-04833-5

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  • DOI: https://doi.org/10.1007/s11837-021-04833-5

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