Large Thermal Rectification in a Solid-State Thermal Diode Constructed of Iron-Doped Nickel Sulfide and Alumina

Xuekai Zhang, Peng Tong, Jianchao Lin, Kun Tao, Xuelian Wang, Lulu Xie, Wenhai Song, and Yuping Sun
Phys. Rev. Applied 16, 014031 – Published 13 July 2021
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Abstract

Thermal diodes, which allow heat flow in one direction but prohibit it in the reverse direction, are fundamental for thermal manipulation. Here, we report the construction of a thermal diode consisting of Ni0.85Fe0.15S (bonded with 10 wt % silver) and alumina. A high rectification factor γ of 1.51 is achieved with a relatively small temperature bias of 97 K near room temperature, indicating great potential applications in the field of nonlinear thermal control. The excellent rectification effect is attributed to the high contrast change in thermal conductivity of Ni0.85Fe0.15S. In addition, we demonstrate that the maximum thermal rectification ratio is strongly dependent on the cold-terminal temperature of the thermal diode, the length ratio between the two segments, and the steepness of the first-order phase transition of Ni0.85Fe0.15S.

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  • Received 6 February 2021
  • Revised 11 June 2021
  • Accepted 23 June 2021

DOI:https://doi.org/10.1103/PhysRevApplied.16.014031

© 2021 American Physical Society

Physics Subject Headings (PhySH)

Condensed Matter, Materials & Applied PhysicsGeneral PhysicsStatistical Physics & Thermodynamics

Authors & Affiliations

Xuekai Zhang1,2, Peng Tong1,2,*, Jianchao Lin1,†, Kun Tao1,2, Xuelian Wang1,2, Lulu Xie1,2, Wenhai Song1, and Yuping Sun1,3

  • 1Key Laboratory of Materials Physics, Institute of Solid State Physics, Chinese Academy of Sciences, Hefei 230031, People’s Republic of China
  • 2University of Science and Technology of China, Hefei 230026, People’s Republic of China
  • 3Anhui Province Key Laboratory of Condensed Matter Physics at Extreme Conditions, High Magnetic Field Laboratory, Chinese Academy of Sciences, Hefei 230031, People’s Republic of China

  • *tongpeng@issp.ac.cn
  • jclin@issp.ac.cn

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Vol. 16, Iss. 1 — July 2021

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