Skip to main content
SpringerLink
Log in

Pumping power and heating area dependence of thermal resistance for a large-scale microchannel heat sink under extremely high heat flux

  • Original Article
  • Published:
Heat and Mass Transfer Aims and scope Submit manuscript

Abstract

In this paper, based on the Li-Peterson pumping consumption-thermal resistance optimization model, a single-phase structure-optimized large-scale microchannel heat sink with each channel having 0.2 mm width and 0.8 mm height for extremely high heat flux cooling was proposed and investigated. Employing deionized water as coolant, two different heat source areas were designed and the results were compared under different pumping power from 0.1 W to 6.5 W. The experimental and simulation results indicates that the proposed copper-based microchannel thermal management system can dissipate heat flux of 1000 W/cm2 over 1cm2 and 500 W/cm2 over 5cm2, respectively, adding critical data support to the database of single-phase microchannel heat sink with heat removal capacity exceeding 1000 W/cm2. Moreover, the possible minimum thermal resistance over a broad pumping power range of 0.1 W to 6.5 W was explored. Extremely low thermal resistance of 0.065 K/W and 0.019 K/W were obtained for these two heating area scenarios. Overall, the proposed copper-based optimized microchannel heat sink is an ideal solution to cool high heat flux devices.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Fig. 1
Fig. 2
Fig. 3
Fig. 4
Fig. 5
Fig. 6
Fig. 7
Fig. 8

source areas

Fig. 9
Fig. 10

Similar content being viewed by others

Abbreviations

\({A}_{ch}\) :

Effective heat transfer area (m2)

\({A}_{hs}\) :

Source dimension (m2)

\({c}_{p}\) :

Specific heat capacity (J/(kg∙K))

\({D}_{h}\) :

The characteristic dimension of microchannel (m)

\({D}_{tube}\) :

The inner diameter of tube (m)

\(f\) :

Fanning friction factor

\({f}_{app}\) :

Apparent friction factor

\(G\) :

Flow rate (L/h)

\(h\) :

Convective heat transfer coefficient (W/(m2∙K))

\(H\) :

Height of channel (mm)

\({H}_{b}\) :

Thickness of microchannel substrate (mm)

\(I\) :

Current (A)

\({K}_{w}\) :

Thermal conductivity of deionized water (W/(m∙K))

\(L\) :

Length of channel (mm)

\(m\) :

Mass flow (kg/s)

\(N\) :

Number of microchannels

\(Nu\) :

Nusselt number

\(P\) :

Pressure (kPa)

\({P}_{w}\) :

Pumping power (W)

\({P}_{Q}\) :

Input heating power by AC power (W)

\(\Delta P\) :

Pressure drop (kPa)

Pr :

Prandt number

\(Q\) :

Heating power (W)

\(q\) :

Heat flux (W/cm2)

\(R\) :

Total thermal resistance of heat sink (K/W)

\({R}_{cd}\) :

Conduction thermal resistance of heat sink (K/W)

\({R}_{cv}\) :

Convection thermal resistance of heat sink (K/W)

\({R}_{c}\) :

Capacity thermal resistance of heat sink (K/W)

Re :

Reynolds number

\(T\) :

Temperature (°C)

\({T}_{hs}\) :

Junction temperature of heat sink (°C)

\({T}_{m}\) :

Mean temperature (°C)

\({T}_{a}\) :

Ambient temperature (°C)

\(\Delta T\) :

Temperature difference (°C)

\(U\) :

Voltage (V)

\(u\) :

Velocity (m/s)

\(W\) :

Width of channel (mm)

\(\mu\) :

Viscosity (kg/(m∙s))

\(\rho\) :

Density (kg/m3)

MEMS:

Micro electro mechanical systems

DC:

Direct current

AC:

Alternating current

ch:

Microchannel

hs:

Heat sink

in/inlet:

Inlet

out/outlet:

Outlet

References

  1. Mudawar I (2001) Assessment of high-heat-flux thermal management schemes. IEEE Trans Compon Packag Technol 24(2):122–122

    Article  Google Scholar 

  2. Bar-Cohen A, Wang P, Rahim E (2007) Thermal management of high heat flux nanoelectronic chips. Microgravity Sci Technol 19(3):48–52

    Article  Google Scholar 

  3. Lee J, Mudawar I (2008) Fluid flow and heat transfer characteristics of low temperature two-phase micro-channel heat sinks – Part 1: Experimental methods and flow visualization results. Int J Heat Mass Transf 51:4315–4326

    Article  Google Scholar 

  4. Lasance CJM, Poppe A (2014) Thermal Management for LED Applications New York

  5. Habibi Khalaj A, Halgamuge SK (2017) A review on efficient thermal management of air- and liquid-cooled data centers: From chip to the cooling system. Appl Energy 205:1165–1188

    Article  Google Scholar 

  6. Karayiannis TG, Mahmoud MM (2017) Flow boiling in microchannels: Fundamentals and applications. Appl Therm Eng 115:1372–1397

    Article  Google Scholar 

  7. Dix J, Jokar A (2010) Fluid and thermal analysis of a microchannel electronics coolerusing computational fluid dynamics. Appl Therm Eng 30(8):948–961

    Article  Google Scholar 

  8. Kadam ST, Kumar R (2014) Twenty first century cooling solution: microchannelheat sinks. Int J Therm Sci 85:73–92

    Article  Google Scholar 

  9. Agostini B, Fabbri M, Park JE, Wojtan L, Thome JR, Michel B (2007) State of the artof high heat flux cooling technologies. Heat Transfer Eng 28:258–281

    Article  Google Scholar 

  10. Reddy SR, Dulikravich GS (2015) Multi-objective optimization of micro pin-fin arrays for cooling of high heat flux electronics. in: Proc IMECE2015. Texas

  11. Yeh LT (1995) Review of heat transfer technologies in electronicequipment. ASME J Electron Packag 117:333–339

    Article  Google Scholar 

  12. Ebadian MA, Lin CX (2011) A review of high-heat-flux heat removal technologies. J Heat Trans 133(11):112–112

    Article  Google Scholar 

  13. Christensen A, Graham S (2009) Thermal effects in packaging high power light emitting diode arrays. Appl Therm Eng 29:364–371

    Article  Google Scholar 

  14. Gilmore N, Timchenko V, Menictas C (2018) Microchannel cooling of concentrator photovoltaics: A review. Renew Sustain Energy Rev 90:1041–1059

    Article  Google Scholar 

  15. Kandlikar SG, Grande WJ (2003) Evolution of microchannel flow passages-thermohydraulic performance and fabrication technology. Heat Transfer Eng 24:13–17

    Google Scholar 

  16. Khan MG, Fartaj A (2011) A review on microchannel heat exchangers and potential applications. Int J Energy Res 35:553–582

    Article  Google Scholar 

  17. Tuckerman DB, Pease RFW (1981) High-performance heat sinking for VLSI. IEEE Electron Device Lett 2:126–129

    Article  Google Scholar 

  18. Naterer GF (2005) Reducing energy availability losses with open parallel microchannels embedded in a micropatterned surface. Int J Energy Res 29:1215–1229

    Article  Google Scholar 

  19. Skidmore JA, Freitas BL, Crawford J, Satariano J, Utterback E, DiMercurio L, Cutter K, Sutton S (2000) Silicon monolithic microchannel-cooled laser diode array. Appl Phys Lett 77(1):10–12

    Article  Google Scholar 

  20. Qu W, Mudawar I (2002) Experimental and numerical study of pressure drop and heat transfer in a single-phase micro-channel heat sink. Int J Heat Mass Transf 45:2549–2565

    Article  Google Scholar 

  21. Chang JY, Prasher RS, Chau D, Myers A, Dirner J, Prstic S, He D (2005) Convective performance of package based single phase microchannel heat exchanger. in: Proc IPACK2005. San Francisco

  22. Hirshfeld H, Silverman I, Arenshtam A, Kijel D, Nagler, (2006) A High heat flux cooling of accelerator targets with micro-channels. Nucl Instrum Methods Phys Res Sect A: Accelerators Spectrometers Detectors Associated Equipment 562(2):903–905

    Article  Google Scholar 

  23. Solovitz SA, Stevanovic LD, Beaupre RA (2006) Micro-channel thermal manage-ment of high power devices. in: Applied Power Electronics Conference and Exposition. Dallas

  24. Brunschwiler T, Michel B, Rothuizen H, Kloter U, Wunderle B, Oppermann H (2008) Forced Convective Interlayer Cooling in Vertically Integrated Packages. in: Proc ITherm. Orlando

  25. Escher W, Brunschwiler T, Michel B, Poulikakos D (2010) Experimental investigation of an ultra-thin manifold microchannel heat sink for liquid-cooled chips. J Heat Transfer 132 (8):081402

  26. Koyuncuoğlu A, Jafari R, Okutucu-Özyurt T, Külah H (2012) Heat transfer and pressure drop experiments on CMOS compatible microchannel heat sinks for monolithic chip cooling applications. Int J Therm Sci 56:77–85

    Article  Google Scholar 

  27. Kozłowska A, Łapka P, Seredyński M, Teodorczyk M, Dąbrowska-Tumańska E (2015) Experimental study and numerical modeling of micro-channel cooler with micro-pipes for high-power diode laser arrays. Appl Therm Eng 91:279–287

    Article  Google Scholar 

  28. Colgan EG, Furman B, Gaynes M, Graham W, LaBianca N, Magerlein JH, Polastre RJ, Rothwell MB (2007) A practical implementation of silicon microchannel coolers for high power chips. IEEE T Compon Pack T 30(2):218–225

    Article  Google Scholar 

  29. Lee YJ, Lee PS, Chou SK (2013) Hotspot mitigating with obliquely finned microchannel heat sink–an experimental study. IEEE Trans Compon Packag Technol 3:1332–1341

    Google Scholar 

  30. Xia GD, Ma DD, Zhai YL, Li YF, Liu R, Du M (2015) Experimental and numerical study of fluid flow and heat transfer characteristics in microchannel heat sink with complex structure. Appl Therm Eng 105:848–857

    Google Scholar 

  31. Liu HL, An XK, Wang CS (2017) Heat transfer performance of T-Y type micro-channel heat sink with liquid GaInSn coolant. Int J Therm Sci 120:203–219

    Article  Google Scholar 

  32. Zhang XD, Yang XH, Zhou YX, Rao W, Gao JY, Ding YJ, Shu QQ, Liu J (2019) Experimental investigation of galinstan based minichannel cooling for high heat flux and large heat power thermal management. Energ Convers Manage 185:248–258

    Article  Google Scholar 

  33. Shamim MS, Narde RS, Gonzalez-Hernandez JL, Ganguly A, Venkatarmanb J, Kandlikar SG (2019) Evaluation of Wireless Network-on-Chip Architectures with Microchannel-Based Cooling in 3D Multicore Chips. Sustain Comput Infor 21:165–178

    Google Scholar 

  34. Xie H, Yang B, Zhang SY, Song MR (2020) Research on the mechanism of heat transfer enhancement in microchannel heat sinks with micropin fins. Int J Energy Res 44(9):1–17

    Google Scholar 

  35. Yang M, Cao BY (2020) Multi-objective optimization of a hybrid microchannel heat sink combining manifold concept with secondary channels. Appl Therm Eng 181:115592

  36. Erp RV, Soleimanzadeh R, Nela L, Kampitsis G, Matioli E (2020) Co-designing electronics with microfluidics for more sustainable cooling. Nature 585:211–216

    Article  Google Scholar 

  37. Hu JS, Zuo GZ, Maingi R et al (2019) Experiments of continuously and stably flowing lithium limiter in EAST towards a solution for the power exhaust of future fusion devices. Nucl Mater Energy 18:99–104

    Article  Google Scholar 

  38. Li J, Peterson GP (2007) 3-Dimentional Numerical Optimization of Silicon-based High Performance Parallel-channel Micro Heat Sink with Liquid Flow. Int J Heat Mass Transf 50:2895–2904

    Article  Google Scholar 

  39. Li J, Peterson GP (2006) Geometric Optimization of an Integrated Micro Heat Sink with liquid Flow. IEEE Trans Components and Packaging Technologies 29:145–154

    Article  Google Scholar 

  40. ANSYS FLUENT Tutorial Guide 19.2

  41. Incropera FP (1999) Liquid Cooling of Electronic Devices by Single-Phase Convection. Wiley-Interscience

    Google Scholar 

Download references

Acknowledgements

This work is supported by the National Natural Science Foundation of China (Project No.51776195).

Author information

Authors and Affiliations

  1. School of Engineering Science, University of Chinese Academy of Sciences, 19A Yu-quan-lu Road, Shijingshan District, Beijing, 100049, PR China

    Bo Sun

  2. School of Mechanical Engineering, Shenyang University of Technology, Shenyang, 110870, China

    Huiru Wang

  3. Dawning Information Industry Co., LTD, Beijing, China

    Zhongshan Shi

  4. Laboratory of Advanced Thermal Management Technologies, School of Engineering Science, University of Chinese Academy of Sciences, 19A Yu-quan-lu Road, Shijingshan District, Beijing, 100049, PR China

    Ji Li

Authors
  1. Bo Sun
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Huiru Wang
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Zhongshan Shi
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. Ji Li
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to Ji Li.

Additional information

Publisher's Note

Springer Nature remains neutral with regard to jurisdictional claims in published maps and institutional affiliations.

Higlights

• A structure-optimized large microchannel heat sink for extremely high heat flux was designed.

• Rough surface promotes heat transfer through creating flow disturbance at low Re number.

• Actual heat fluxes of 1104.54W/cm2 and 480.60W/cm2 were dissipated over 1cm2 and 5cm2 area.

• Dependence of thermal resistance on pumping power between 0.1W and 6.5W was identified.

• Unprecedented low thermal resistance of 0.065K/W and 0.019K/W were obtained respectively.

Rights and permissions

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Sun, B., Wang, H., Shi, Z. et al. Pumping power and heating area dependence of thermal resistance for a large-scale microchannel heat sink under extremely high heat flux. Heat Mass Transfer 58, 195–208 (2022). https://doi.org/10.1007/s00231-021-03104-y

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s00231-021-03104-y

Search

Navigation