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Study on the cutting mechanism of SiCp/Al considering particle size and distribution

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Abstract

In recent years, SiCp/Al metal matrix composites (MMCs) have attracted increasing attention from academia and industry. The size and distribution of particles in this material have an important effect on its actual performance. First, the geometric analysis of milling is performed. A two-dimensional micro finite element model consisting of hard SiC particles and a soft aluminum matrix is established to study the milling of SiCp/Al composites. In this paper, the cutting mechanism of SiCp/Al MMCs reinforced by a uniform distribution of particles of the same size and random distribution of non-equal size particles at the micron level was compared by using the finite element method and finite element model with a zero-thickness cohesive layer. The simulation results show that same-size particles are evenly distributed in the matrix, and good stress distribution and chip morphology can be obtained. In addition, the cutting force fluctuation is small, and the machining surface quality is good. The properties of Al-based SiC composites can be improved by evenly distributing same-size particles. Considering the particle size and distribution, the random model can more accurately simulate the chip, cutting force fluctuation of the workpiece, and workpiece surface damage than the uniform model. A good correlation between the research results and experimental results is shown in the literature.

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The material and data in this paper are obtained by software simulation and quoting other people’s experimental data.

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XZ analyzed and verified the usability and accuracy of the model. YC analyzed comparison of the cutting mechanism of different aluminum-based silicon carbide composites and the effect of silicon carbide particle size and distribution on the machining process. All authors read and approved the final manuscript.

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Correspondence to Xu Zhang.

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Chen, Y., Zhang, X. Study on the cutting mechanism of SiCp/Al considering particle size and distribution. Int J Adv Manuf Technol 115, 1211–1225 (2021). https://doi.org/10.1007/s00170-021-07225-w

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  • DOI: https://doi.org/10.1007/s00170-021-07225-w

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