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Influence of Sample Tilt and Applied Load on Microscratch Behavior of Copper Under a Spherical Diamond Indenter

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Abstract

Microscratch test with a spherical indenter was carried out on copper under different tilt conditions and applied loads. Influence of surface slope and applied load on scratch responses such as friction coefficient, residual groove width, penetration depth was quantified by simple (e.g., linear, quadratic, and power-law) expressions. Apparent friction coefficient for non-tilt condition can be obtained by correcting the results measured for a prior known surface slope. Contact area is believed to be confined in the front side of the indenter with pile-up of material contributing to the horizontally projected area and a minor segment for the vertically projected area. The radius of spherical indenter can be calibrated on a reference material from residual groove width and penetration depth data.

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Data Availability

The data and material are available from the corresponding author on request via email: mingliuUK@gmail.com or mingliu@fzu.edu.cn.

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Acknowledgements

This project is supported by the National Natural Science Foundation of China (Grant No. 51705082), Engineering Research Centre for CAD/CAM of Fujian Provincial Colleges and Universities (Grant No. K201705), Development Center of Scientific and Educational Park of Fuzhou University in the city of Jinjiang (Grant No. 2019-JJFDKY-11), and Fuzhou University Testing Fund of precious apparatus (Grant No. 2020T017).

Funding

National Natural Science Foundation of China (Grant No. 51705082), Engineering Research Centre for CAD/CAM of Fujian Provincial Colleges and Universities (Grant No. K201705), Development Center of Scientific and Educational Park of Fuzhou University in the city of Jinjiang (No. 2019-JJFDKY-11), and Fuzhou University Testing Fund of precious apparatus (Grant No. 2020T017).

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  1. School of Mechanical Engineering and Automation, Fuzhou University - Qishan Campus, Fuzhou, 350116, Fujian, People’s Republic of China

    Ming Liu

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Correspondence to Ming Liu.

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Liu, M. Influence of Sample Tilt and Applied Load on Microscratch Behavior of Copper Under a Spherical Diamond Indenter. Tribol Lett 69, 88 (2021). https://doi.org/10.1007/s11249-021-01466-2

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