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Epoxy Anhydride Low-Combustibility Compositions for Impregnating Electronics Products

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Abstract

The possibility of improving the thermal impact resistance and dielectric performance at 100–125°C of epoxy diane resins cured with an anhydride curing agent by means of reactive plasticizers (flexibilizers) and hardeners is considered. The efficiency of using CKD-KTRA low-molecular carboxylate rubbers as flexibilizers is confirmed, as well as the efficiency of using the condensation product of monoglycidyl ether and diethyl amine with oleic and sebacic acids as a hardener. It is shown that diglycidyl ether based on tribromaniline reduces combustibility.

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Notes

  1. H. Lee and Kr. Neville, Handbook of Epoxy Resins (McGraw-Hill, New York, 1967).

  2. Proceedings of the Fourth International Conference on Polymer Materials of Lowered Combustibility, Volgograd, 2000 (Volgograd: Politekhnik, 2000).

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Authors and Affiliations

  1. Kazan National Research University of Technology, 420015, Kazan, Tatarstan, Russia

    I. V. Stroganov

  2. Kazan State University of Architecture and Engineering, 420043, Kazan, Tatarstan, Russia

    V. F. Stroganov

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  1. I. V. Stroganov
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  2. V. F. Stroganov
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Correspondence to V. F. Stroganov.

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Translated by S. Kuznetsov

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Stroganov, I.V., Stroganov, V.F. Epoxy Anhydride Low-Combustibility Compositions for Impregnating Electronics Products. Polym. Sci. Ser. D 14, 218–221 (2021). https://doi.org/10.1134/S1995421221020337

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  • DOI: https://doi.org/10.1134/S1995421221020337

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