We study the possibility of using the technology of 3D photopolymer printing with subsequent metallization of working surfaces for developing electrodynamic components of microwave devices. The technology applicability is considered by examples of mockups of a profiled helical waveguide for a microwave undulator of a Compton free-electron laser and a periodic slow-wave system of a backward-wave oscillator with a ribbon electron beam. The results of “cold” measurements of the parameters of these electrodynamic systems are presented and good agreement with the simulation results is obtained, which confirms the prospects of using additive technologies for developing components of the vacuum microwave electronic devices.
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B. Liu, X.Gong, and W. J. Chappell, IEEE Trans. Microw. Theory Tech., 52, No. 11, 2567–2575 (2004). https://doi.org/10.1109/TMTT.2004.837165
X. Shang, P.Penchev, C.Guo, et al., IEEE Trans. Microw. Theory Tech., 64, No. 8, 2572–2580 (2016). https://doi.org/10.1109/TMTT.2016.2574839
J. Sence, W. Feuray, A.Perigaud, et al., Int. J. Microw. Wirel. Technol., 10, No. 7, 772–782 (2018). https://doi.org/10.1017/S1759078717001465
S.Verploegh, M. Coffey, E.Grossman, and Z.Popovic, IEEE Trans. Microw. Theory Tech., 65, No. 12, 5144–5153 (2017). https://doi.org/10.1109/TMTT.2017.2771446
S. V.Kuzikov, S.P. Antipov, A. Liu, et al., in: Proc. 38th Int. Free Electron Laser Conf. (FEL 2017), August 20–25, 2017, Santa Fe, USA, pp. 525–528. https://doi.org/10.18429/JACoW-FEL2017-WEP055
A. R. Phipps, A. J.Maclachlan, L. Zhang, et al., in: Proc. 21st IEEE Int. Conf. on Pulsed Power (PPC 2017), June 18–22, 2017, Brighton, United Kingdom, pp. 1–4. https://doi.org/10.1109/PPC.2017.8291307
E. I. Simakov, R. D. Gilbertson, M. J.Herman, et al., in: Proc. 9th Int. Particle Acceleration Conf. (IPAC 2018). April 29–May 4, 2018, Vancouver, Canada, pp. 4671–4674. https://doi.org/10.18429/JACoW-IPAC2018-THPML011
M. D’Auria, W. J.Otter, J. Hazelle, et al., IEEE Trans. Comp. Pack. Manuf. Technol., 5, No. 9, 1339–1349 (2015). https://doi.org/10.1109/TCPMT.2015.2462130.
K. Y.Chan, R.Ramer, and R. Sorrentino, IEEE Trans. Microw. Theory Techniq., 66, No. 9, 3993–4001 (2018). https://doi.org/10.1109/TMTT.2018.2851573
D. I. Sobolev, M. D. Proyavin, N.Yu.Peskov, et al., EPJ Web Conf., 195, 01017 (2018). https://doi.org/10.1051/epjconf/201819501017
P. Sigmund, Nucl. Instrum. Meth. Phys. Res. B, 27, No. 1, 1–20 (1987). https://doi.org/10.1016/0168-583X(87)90004-8
I. E. Shpak, Electrolytes for Copper Plating [in Russian], ´Elektronika, Moscow (1989).
V. V. Sviridov, T.N.Vorob’eva, T.V.Gaevskaya, and L. I. Stepanova, Chemical Deposition of Metals from Aqueous Solutions [in Russian], Izd. Universitetskoe, Minsk (1987).
M. Dionigi, C.Tomassoni, G.Venanzoni, and R. Sorrentino, IEEE Microw. Wirel. Comp. Lett., 27, No. 11, 953–955 (2017). https://doi.org/10.1109/LMWC.2017.2750090
https://www.3dsystems.com
https://polymertal.com
E.B.Abubakirov, A.A.Vikharev, N. S.Ginzburg, et al., Radiophys. Quantum Electron., 62, Nos. 7–8, 520–527 (2019). https://doi.org/10.1007/s11141-020-09998-8
S. V.Kuzikov, A. V. Savilov, and A.A. Vikharev, Appl. Phys. Lett., 105, No. 3, 033504 (2014). https://doi.org/10.1063/1.4890586
S.Tantawi, M. Shumail, J. Neilson, et al., Phys. Rev. Lett., 112, No. 16, 164802 (2014). https://doi.org/10.1103/PhysRevLett.112.164802
S. V.Kuzikov and A. V. Savilov, Phys. Plasmas., 25, No. 11, 113114 (2018). https://doi.org/10.1063/1.5049880
A. K. Kaminsky, S.N. Sedykh, I.V.Bandurkin, et al., Appl. Phys. Lett., 115, No. 16, 163501 (2019). https://doi.org/10.1063/1.5123409
A. E. Fedotov, V. L. Bratman, P. B. Makhalov, and V. N. Manuilov, EPJ Web Conf., 195, No. 16, 01026 (2018). https://doi.org/10.1051/epjconf/201819501026
D.E. Pershing, K.T.Nguyen, D.K. Abe, et al., IEEE Trans. Electron Dev., 61, No. 6, 1637–1642 (2014). https://doi.org/10.1109/TED.2014.2304473
J.Pasour, E.Wright, K. T.Nguyen, et al., IEEE Trans. Electron Dev., 61, No. 6, 1630–1636 (2014). https://doi.org/10.1109/TED.2013.2295771
Y. Shin, L. R.Barnett, and N.C. Luhmann, IEEE Trans. Electron Dev., 56, No. 5, 706–712 (2009). https://doi.org/10.1109/TED.2009.2015404
A. G. Rozhnev, N. M. Ryskin, T. A.Karetnikova, et al., Radiophys. Quantum Electron., 56, Nos. 8–9, 542–553 (2014). https://doi.org/10.1007/s11141-014-9457-1
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Translated from Izvestiya Vysshikh Uchebnykh Zavedenii, Radiofizika, Vol. 63, Nos. 5–6, pp. 521–531, May–June 2020.
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Proyavin, M.D., Vikharev, A.A., Fedotov, A. et al. Development of Electrodynamic Components for Microwave Electronic Devices Using the Technology of 3D Photopolymer Printing with Chemical Surface Metallization. Radiophys Quantum El 63, 469–478 (2020). https://doi.org/10.1007/s11141-021-10072-0
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DOI: https://doi.org/10.1007/s11141-021-10072-0