Abstract
It is demonstrated that it is possible to use the ammonia molecular beam epitaxy for growing structurally perfect high-ohmic GaN layers which allow generating SiN/Al(Ga)N/GaN heterostructures for transistors with a high mobility of electrons. The growth conditions are determined for GaN layers with smooth surface morphology (with a mean-squared deviation of \({\sim}\)2 nm) appropriate for creating sharp heteroboundaries. The possibility of improving the crystalline perfection of GaN layer due to the use of buffer high-temperature AlN layer (with the growth temperature above 940\({}^{\circ}\)C) is demonstrated. It was shown that in situ surface passivation of Al(Ga)N/GaN heterostructures by the ultrathin SiN layer allows generating normally closed transistors with unprecedented low values of the current collapse (\({\sim}1\%\)).
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ACKNOWLEDGMENTS
The authors thank V.E. Zemlyakov, V.I. Egorkin, and A.A. Zaitsev from the National Research University of Electronic Technology for their aid in preparing test transistors and their characterization and B.Ya. Ber and D.Yu. Kazantsev from the Ioffe Institute of the Russian Academy of Sciences for performing SIMS measurements.
Funding
The work is supported by the State Task 0306-2019-00008 ‘‘Heterostructures based on A\({}_{3}\)B\({}_{5}\) materials for microwave electronics and microwave photoelectrronics’’.
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Translated by E. Oborin
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Malin, T.V., Milakhin, D.S., Mansurov, V.G. et al. Growth of Nitride Heteroepitaxial Transistor Structures: from Epitaxy of Buffer Layers to Surface Passivation. Optoelectron.Instrument.Proc. 56, 485–491 (2020). https://doi.org/10.3103/S8756699020050064
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DOI: https://doi.org/10.3103/S8756699020050064