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The superplastic forming/diffusion bonding and mechanical property of TA15 alloy for four‐layer hollow structure with squad grid

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Abstract

The superplastic forming/diffusion bonding (SPF/DB) process has been widely applied to manufacture the multi-layer components. In this paper, a four-layer hollow structure with squad grid was fabricated by SPF/DB process. The superplastic behavior of TA15 alloy was investigated by the uni-axial tensile tests at high temperature, and the maximum elongation of 911 % was obtained at 920 °C/0.001 s− 1. The finite element method (FEM) of the four-layer structure was conducted, and the results showed that TA15 alloy was appropriate for fabricating this complex-shaped structure. Then the four-layer hollow structure was successfully fabricated by SPF/DB process at 920 °C with the target strain rate of 0.001 s− 1. Finally, the microstructure, thickness distribution and mechanical property of the four-layer hollow structure were investigated. The grain size increased from 5 μm to 10 μm and the sound bonding interface was achieved. The thickness distribution was symmetrical in height direction. The compressive strength and the maximum bending load of the four-layer hollow structure was 50 MPa and 64.4 kN, respectively.

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Acknowledgements

This work was supported by Henan Provincial Department of Science and Technology Research Project (Grant No. 182102210468).

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Authors and Affiliations

  1. School of Mechanical and Electric Engineering, Nanyang Normal University, Nanyang, 473061, China

    Zhihao Du

  2. School of Materials Science and Engineering, Harbin Institute of Technology, Harbin, 150001, China

    Kaifeng Zhang

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  1. Zhihao Du
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  2. Kaifeng Zhang
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Correspondence to Zhihao Du.

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Du, Z., Zhang, K. The superplastic forming/diffusion bonding and mechanical property of TA15 alloy for four‐layer hollow structure with squad grid. Int J Mater Form 14, 1057–1066 (2021). https://doi.org/10.1007/s12289-021-01621-z

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  • DOI: https://doi.org/10.1007/s12289-021-01621-z

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