Skip to main content
Log in

Effects of assembly errors and bonding defects on the centroid drift of a precision sleeve structure

  • Published:
Advances in Manufacturing Aims and scope Submit manuscript

Abstract

Adhesive joints are widely used in precision electromechanical products, and their bonding process has significant effects on the performance of an assembled product. This paper presents a numerical study on the bonding assembly of a sleeve structure of a precision inertial device using a finite element method, where the stresses due to curing and relaxation behaviors are considered. The effects of assembly errors and bonding defects on the centroid drift of the sleeve structure were found and analyzed quantitatively. This study can help understand the zero-drift mechanism of the precision inertial device and contribute valuable data for its error compensation.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Fig. 1
Fig. 2
Fig. 3
Fig. 4
Fig. 5
Fig. 6
Fig. 7
Fig. 8
Fig. 9
Fig. 10
Fig. 11
Fig. 12
Fig. 13
Fig. 14
Fig. 15

Similar content being viewed by others

References

  1. Banea MD, Da Silva LFM (2009) Adhesively bonded joints in composite materials: an overview. Proc Inst Mech Eng Part L J Mater Des Appl 223(1):1–18

    Google Scholar 

  2. Kinloch AJ (1987) Adhesion and adhesives: science and technology. Chapman & Hall, London

    Book  Google Scholar 

  3. Baldan A (2004) Adhesively-bonded joints and repairs in metallic alloys, polymers and composite materials: adhesives, adhesion theories and surface pretreatment. J Mater Sci 39:1–49

    Article  Google Scholar 

  4. Machalická K, Eliášová M (2017) Adhesive joints in glass structures: effects of various materials in the connection, thickness of the adhesive layer, and ageing. Int J Adhes Adhes 72:10–22

    Article  Google Scholar 

  5. Ehrhart B, Valeske B, Muller CE et al (2010) Methods for the quality assessment of adhesive bonded CFRP structures: a resumé. In: The 2nd international symposium on NDT in aerospace 2010, Hamburg, Germany, 22–24 November, pp 1–9

  6. Guyott CCH, Cawley P, Adams RD et al (2016) The non-destructive testing of adhesively bonded structure: a review. J Adhes 8464:37–41

    Google Scholar 

  7. Elhannani M, Madani K, Legrand E et al (2017) Numerical analysis of the effect of the presence, number and shape of bonding defect on the shear stresses distribution in an adhesive layer for the single-lap bonded joint, Part 1. Aerosp Sci Technol 62:122–135

    Article  Google Scholar 

  8. Jairaja R, Naik GN (2019) Weak bond effects in adhesively bonded joints between the dissimilar adherends. J Adhes. https://doi.org/10.1080/00218464.2019.1702027

    Article  Google Scholar 

  9. Heslehurst RB (1999) Observations in the structural response of adhesive bondline defects. Int J Adhes Adhes 19(2/3):133–154

    Article  Google Scholar 

  10. Elhannani M, Madani K, Chama Z et al (2017) Influence of the presence of defects on the adhesive layer for the single-lap bonded joint—Part II: probabilistic assessment of the critical state. Aerosp Sci Technol 63:372–386

    Article  Google Scholar 

  11. Geleta TN, Woo K, Cairns DS et al (2018) Failure behavior of inclined thick adhesive joints with manufacturing defect. J Mech Sci Technol 32:2173–2182

    Article  Google Scholar 

  12. Shishesaz M, Bavi N (2013) Shear stress distribution in adhesive layers of a double-lap joint with void or bond separation. J Adhes Sci Technol 27:1197–1225

    Article  Google Scholar 

  13. Majid JO, Mohammad RMS (2018) Investigation of defect effects on adhesively bonded joint strength using cohesive zone modeling. J Mech Eng Stroj Cas 68:5–24

    Google Scholar 

  14. Heidarpour F, Farahani M, Ghabezi P (2018) Experimental investigation of the effects of adhesive defects on the single lap joint strength. Int J Adhes Adhes 80:128–132

    Article  Google Scholar 

  15. Costa M, Viana G, Da Silva LFM et al (2017) Environmental effect on the fatigue degradation of adhesive joints: a review. J Adhes 93:127–146

    Article  Google Scholar 

  16. Awaja F, Gilbert M, Kelly G et al (2009) Adhesion of polymers. Prog Polym Sci 34:948–968

    Article  Google Scholar 

  17. Marques EAS, Da Silva LFM, Banea MD et al (2014) Adhesive joints for low- and high-temperature use: an overview. J Adhes 91:556–585

    Article  Google Scholar 

  18. Ramírez FMG, de Moura MFSF, Moreira RDF et al (2020) A review on the environmental degradation effects on fatigue behaviour of adhesively bonded joints. Fatigue Fract Eng Mater Struct 43:1307–1326

    Article  Google Scholar 

  19. Miravalles M, Dharmawan IIP (2007) The creep behaviour of adhesives a numerical and experimental investigation. Dissertation, Chalmers University of Technology, Göteborg, Sweden

  20. French P, Krijnen G, Roozeboom F (2016) Precision in harsh environments. Microsyst Nanoeng 2:1–12

    Article  Google Scholar 

  21. Zha G, Huang X, Liu W (2016) Research on heading sensitive drift storage behavior of inertial platform system under the action of assembly stress relaxation. In: Proceedings of 2016 prognostics and system health management conference, Chengdu, 19–21 October, pp 1–6

  22. Zhou W, Li F, Yu H et al (2017) Influence of adhesive non-uniformity on zero offset of micro accelerometer. Int J Mod Phys B 31:1–8

    Google Scholar 

  23. Zhou W, Peng P, Yu H et al (2017) Material viscoelasticity-induced drift of micro-accelerometers. Materials (Basel) 10:1–11

    Google Scholar 

  24. Zarnik MS, Rocak D, Macek S (2004) Residual stresses in a pressure-sensor package induced by adhesive material during curing: a case study. Sensors Actuators A Phys 116:442–449

    Article  Google Scholar 

  25. Zhang Z, Wan Z, Liu C et al (2010) Effects of adhesive material on the output characteristics of pressure sensor. In: The 11th international conference on electronic packaging technology and high density packaging, Xi'an, 16–19 August, pp 657–660

  26. Chuang CH, Huang YH, Lee SL (2012) The influence of adhesive materials on chip-on-board packing of MEMS microphone. Microsyst Technol 18:1931–1940

    Article  Google Scholar 

  27. Peng P, Zhou W, Yu H et al (2016) Investigation of the thermal drift of MEMS capacitive accelerometers induced by the overflow of die attachment adhesive. IEEE Trans Compon Packag Manuf Technol 6:822–830

    Article  Google Scholar 

  28. Zhang J, Li Y, Zhang F (2019) Analysis of centroid variation of three-floating gyroscope based on error sensitivity. In: IOP conference series: materials science and engineering, 20–22 September 2019, Hefei, China, pp 12–16

  29. Chen X, Zhang Z, Jin X et al (2018) Effects of bonding position error on the motion precision stability of precision motor system under temperature load. Navig Control 17:69–74

    Google Scholar 

  30. Yao Z, Hu J, Zhang Z (2018) Assembly technology of structure stability control for high precision gyroscope. J Mech Eng 54:145–152

    Article  Google Scholar 

  31. Lide DR, Baysinger G (2005) CRC handbook of chemistry and physics. CRC Press, Boca Raton

    Google Scholar 

  32. Mainardi F, Spada G (2011) Creep, relaxation and viscosity properties for basic fractional models in rheology. Eur Phys J Spec Top 193:133–160

    Article  Google Scholar 

  33. Chen X, Zhang Z, Jin X et al (2018) Simulation method for precision bonding structure with micron scale adhesive layer. In: The 7th CIRP conference on assembly technologies and systems, 10–12 May 2018, Tianjin, pp 100–105

Download references

Acknowledgments

This work was financially supported by the Natural Science Foundation of Beijing (Grant No. 3204054), the National Natural Science Foundation of China (Grant Nos. 51935003, 51905038), and the National Fundamental Scientific Research (Grant No. JCKY2019203B031).

Author information

Authors and Affiliations

Authors

Corresponding author

Correspondence to Huan-Xiong Xia.

Rights and permissions

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Liu, JH., Li, XY., Xia, HX. et al. Effects of assembly errors and bonding defects on the centroid drift of a precision sleeve structure. Adv. Manuf. 9, 509–519 (2021). https://doi.org/10.1007/s40436-021-00346-1

Download citation

  • Received:

  • Revised:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s40436-021-00346-1

Keywords

Navigation