Novel epoxy resin adhesives toughened by functionalized poly (ether ether ketone) s
Introduction
Polymeric adhesives offer many advantages compared to other traditional methods of joining such as welding, bolting, brazing, mechanical fastening etc. [1]. Compositions based on epoxy resins represent the most popular structural adhesives which can bond an array of similar or dissimilar materials such as metals, plastics, ceramics, wood etc. On curing, epoxy resins produce a highly cross-linked network structure with good mechanical, thermal and creep resistance properties but compromising the damage tolerance [[2], [3], [4], [5], [6], [7]]. Unmodified epoxy resins are brittle in nature and cause poor resistance to crack initiation and growth. This will lead to poor adhesive strength between the bonded assemblies and ultimately failure. Nevertheless, different strategies exist for modification of epoxy structural adhesives to improve their strength without significantly impairing other desirable properties.
Modification of epoxy structural adhesives by rubber particles can enhance the toughness and improve the adhesive strength [8]. Toughening of epoxy adhesives using varying proportions of carboxyl terminated poly (2-ethylhexyl acrylate) rubber has resulted in a two-fold increase in adhesive and impact strengths with incorporation of 9-13 wt % of liquid rubber [9]. The addition of core shell rubber (CSR) nanoparticles increased the fracture energy of epoxy structural adhesives more than by 10 times than the unmodified adhesives [10]. A synergistic influence of rubber particles and graphene nanoplatelets improved the bulk mechanical properties, fracture toughness and lap shear strength of the epoxy adhesive [11]. Significant improvement has been observed in the adhesive joint strength by modification using silica nanoparticles added at concentrations of 10 - 20 % in an epoxy [12].
The use of reactive or non-reactive types of thermoplastics in improving the adhesive properties of epoxy resins is seldom reported. Modification of epoxy adhesives with preformed polyamide particles have been reported to be effective in improving the T peel strength of an adhesive by a factor of three in comparison to conventional rubber particles [13]. A combination of carboxyl terminated butadiene acrylonitrile (CTBN) rubber and a linear poly (hydroxyl ether) [Phenoxy] thermoplastic in epoxy film adhesives have improved their fracture resistance [14]. The incorporation of electro spun nanofiber mats of polyvinyl alcohol in to epoxy adhesives resulted in an approximately 13.5% increase in shear strength properties [15]. The resinous polyamic acid and thermoplastic polyimide modification of epoxy adhesives have significantly improved the impact and tensile adhesive strength of metallic joints [16]. Functionalized thermoplastics such as amine and epoxy terminated poly (phthalazinone ether nitrile sulfone ketone) modified epoxy adhesives exhibited very high glass transition temperatures (>300 °C) with high adhesive strength (48.7 MPa) at room temperature and after various heat treatments [17]. Studies on the influence of functionalized thermoplastic poly (ether etherketone) s, in improving the adhesive properties of epoxy resins are limited. Epoxy-aminonovolac- phthalonitrile networks toughened by hydroxyl functionalized poly (ether ether ketones) have been reported with enhanced lap shear strength at RT and 150 °C on steel substrates [18].
The present paper discusses investigations on the processing and evaluation of a category of epoxy adhesives toughened with hydroxyl functionalized poly (ether etherketone) s, PEEKTOH, to address the dual roles as toughening agents and as adhesion strength promoters under various environmental conditions. Ambient curable epoxy adhesive formulations were designed and evaluated using aluminum alloy (AA 2014) substrates. Curing parameters were monitored using differential scanning calorimetry (DSC) and rheological experiments and interface properties were evaluated from lap shear strengths determined at 25 °C, -196 °C and at 100 °C. Wetting characteristics were established by contact angle measurements and correlated to the microstructure of the compositions. The morphologies were examined in detail using SEM and UV - Visible spectroscopy to understand the composition-property relationships.
Section snippets
Materials
Hydroxyl terminated poly (ether ether ketone) s bearing pendent tertiary butyl groups, PEEKTOH (M̅n: 5900), were synthesized according to the reported literature [19]. A diglycidyl ether of bisphenol A (DGEBA) based epoxy resin having an epoxide equivalent weight of 189 g/eq was purchased from M/s. Huntsman India Pvt. Ltd. Triethylenetetramine was procured from M/s. Sigma Aldrich India Pvt.Ltd and used as curing agent. All the raw materials were used as received. The various raw materials used
Fourier transform infrared (FTIR) spectroscopy
In the present study, the cured and uncured adhesive formulations of the neat and PEEKTOH toughened adhesive formulations were subjected to FTIR to ensure the completion of curing. FTIR spectra of the samples were recorded using a Thermofisher Nicolet iS50 spectrometer at room temperature. Powder samples were made in to pellets with dry KBr powder and spectra were recorded in the wavelength range from 4000 to -500 cm-1 for 8 scans at a resolution of 4 cm−1. Resinous samples were smeared on a
Spectral properties
The cured and uncured adhesive formulations processed as described in section 2.2.2 were subjected to FTIR spectral analysis to monitor the cure completion. Fig. 1 presents the FTIR spectra of all formulations. The absorption at 915 cm−1 observed in uncured formulations corresponds to stretching of the C–O bond of an epoxy group. After curing for the specified duration, the band has disappeared, indicating complete reaction of epoxy groups.
Rheological properties
The rheological behavior of the formulations plays a
Conclusions
Various adhesive formulations based on DGEBA epoxies and different proportions of hydroxyl functionalized PEEK were processed and cured using triethyletetramine. Incorporation of PEEKTOH phases reduced the gelation time of the adhesive from 175 min to 30 min for EP-PEEKTOH (15). About 19% improvements in LSS were achieved for EP-PEEKTOH (5) than the unmodified epoxy at 25 °C. The single lap shear strengths evaluated at 25 °C, -196 °C and 100 °C. EP-PEEKTOH systems exhibited maximum lap shear
Acknowledgments
The authors thank Director, VSSC for granting permission to publish this work. They also thank Analytical and Spectroscopy Division, Vikram Sarabhai Space Centre, ISRO for the support in characterization and testing of the materials.
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