Issue 5, 2021

A biobased low dielectric resin derived from vanillin and guaiacol

Abstract

A new biobased low dielectric resin derived from vanillin and guaiacol has been synthesized. Thanks to the low polarizability of hexafluorocyclobutyl units, this resin exhibits good dielectric properties with an average dielectric constant (Dk) of 2.67 and a dielectric dissipation factor (Df) of 2.9 × 10−3 at a frequency range from 0.15 MHz to 20 MHz. This resin also displays high dimensional stability with a coefficient of thermal expansion (CTE) of 46.3 ppm per °C from 25 °C to 180 °C and a glass transition temperature (Tg) of 243 °C. In addition, the polymer films on the silicon wafers also exhibit good uniformity, flatness, and high hydrophobicity, suggesting that this bio-based resin is suitable as an encapsulation for applications in the microelectronic industry.

Graphical abstract: A biobased low dielectric resin derived from vanillin and guaiacol

Supplementary files

Article information

Article type
Paper
Submitted
02 Dec 2020
Accepted
06 Jan 2021
First published
07 Jan 2021

Polym. Chem., 2021,12, 766-770

A biobased low dielectric resin derived from vanillin and guaiacol

L. Fang, Y. Tao, J. Zhou, C. Wang, M. Dai, J. Sun and Q. Fang, Polym. Chem., 2021, 12, 766 DOI: 10.1039/D0PY01653E

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