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New Ternary Copper–Nickel Alloys with Refractory Elements for Epitaxial Substrates

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Abstract

The quality of the crystallographic texture is analyzed for thin ribbons made of ternary Cu–40% Ni–Me (Me = Nb, Mo, or W) alloys, which are promising materials for epitaxial substrates. Optimal regimes of recrystallization annealing of ~100-μm-thick ribbons made of these alloys are determined, which provide perfect cubic texture with a fraction of {001}〈100〉 grains of more than 96%. The proposed alloys are paramagnetic at operating temperatures of a high-temperature superconductor and less expensive than the nickel ones; therefore, they may be an alternative to the Ni–4.8 at % W alloy, which is most popular in the production of ribbon substrates.

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ACKNOWLEDGMENTS

The structural analysis was performed on a Quanta-200 microscope (FEI) at the Electron Microscopy Department of the Testing Center for Nanotechnologies and Advanced Materials Center for Collective Use at the Mikheev Institute of Metal Physics of the Russian Academy of Sciences.

Funding

This study was performed within the framework of a state order on the subject “Structure” (state registration no. AAAA-A18-118020190116-6) and supported in part by the Russian Foundation for Basic Research (project no. 20-43-660034 r_a).

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Correspondence to Yu. V. Khlebnikova.

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Translated by A. Sin’kov

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Khlebnikova, Y.V., Suaridze, T.R. & Akshentsev, Y.N. New Ternary Copper–Nickel Alloys with Refractory Elements for Epitaxial Substrates. Tech. Phys. Lett. 46, 1170–1173 (2020). https://doi.org/10.1134/S106378502012010X

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  • DOI: https://doi.org/10.1134/S106378502012010X

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