Abstract
The epoxy-modified silicones have the advantages of both epoxy and organic silicon. In this paper, a series of epoxy-modified methyl phenyl silicone resins were synthesized through the hydrosilylation reaction between 1, 2-epoxy-4-vinylcyclohexane and methyl phenyl silicone resins. The effects of catalyst dosage, reaction time and temperature on the products were further discussed to determine optimal reaction conditions. Then, the as-prepared epoxy-modified silicone resins were cured with methylhexahydrophthalic anhydride. The curing kinetics was investigated through differential scanning calorimetry (DSC). The curing conditions were determined as follows: 1-h curing at 80 °C for and subsequent 1-h curing at 110 °C. The as-prepared products exhibited high light transmittance (~ 90% at 450 nm), strong bonding, suitable hardness and sound waterproof performance. In addition, the introduction of methylphenylsiloxane chain significantly improved the heat resistance and UV resistance of cured products. The epoxy-modified silicone resins are ideal LED packaging materials.
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All data generated or analyzed during this study are included in this published article.
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Acknowledgements
This project was supported by Department of education’s Production-Study-Research combined innovation Funding “Blue Fire Plan (Huizhou)”.
Funding Statement
This work was supported by Department of education’s Production-Study-Research combined innovation Funding “Blue Fire Plan (Huizhou)” under the grant No. CXZJHZ201718.
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Zhaqun Pan contributed to the conception of the study; Mianfeng Chen, Kelin Zeng performed the experiment; Zhaoqun Pan, Mianfeng Chen, Kelin Zeng contributed significantly to analysis and manuscript preparation; Zhaoqun Pan, Mianfeng Chen, Kelin Zeng performed the data analyses and wrote the manuscript; Mianfeng Chen, Kelin Zeng, Yingzi Kang helped perform the analysis with constructive discussions.
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Pan, Z., Chen, M., Zeng, K. et al. Synthesis of Epoxy-Modified Methyl Phenyl Silicone Resins for LED Encapsulation. Silicon 14, 1159–1167 (2022). https://doi.org/10.1007/s12633-020-00868-6
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DOI: https://doi.org/10.1007/s12633-020-00868-6