Abstract
Phase formation in a solid state reaction in Al/Cu bilayer and multilayer thin films was studied by the methods of in situ transmission electron microscopy, electron diffraction, simultaneous thermal analysis and x-ray diffraction. It was established that the phase formation sequences in the (Al/Cu)n (n = 2, 15) multilayer thin films (θ-Al2Cu → γ1-Al4Cu9 → η2-AlCu) and Al/Cu bilayer thin films (θ-Al2Cu → η2-AlCu → γ1-Al4Cu9) were different. It was assumed that the phase formation process in the thin films was strongly affected by a number of copper/aluminum interfaces due to the changes of aluminum and copper diffusion current.
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30 March 2021
A Correction to this paper has been published: https://doi.org/10.1007/s11837-021-04633-x
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Acknowledgements
This work was supported by the Russian Science Foundation under Grant #18-13-00080. The electron microscopy investigations were conducted in the SFU Joint Scientific Center whose infrastructure was supported by the State assignment (#FSRZ-2020-0011) of the Ministry of Science and Higher Education of the Russian Federation. The preparation of cross-section samples for TEM investigations was conducted in the Krasnoyarsk Regional Center of Research Equipment of Federal Research Center “Krasnoyarsk Science Center SB RAS”.
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Moiseenko, E.T., Zharkov, S.M., Altunin, R.R. et al. Peculiarities of Intermetallic Phase Formation in the Process of a Solid State Reaction in (Al/Cu)n Multilayer Thin Films. JOM 73, 580–588 (2021). https://doi.org/10.1007/s11837-020-04522-9
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DOI: https://doi.org/10.1007/s11837-020-04522-9