Abstract
Analysis of the literature data on the reasons for the development of mechanical stresses in epitaxial, polycrystalline, and amorphous films during their formation and under various external influences is carried out. The mechanism of the appearance of internal stresses during heteroepitaxial growth of films caused by the mismatch of the crystal lattice constants of the film and substrate is described. The relationship between the development of mismatch stresses in heteroepitaxial films and changes in the nature of their growth is shown. Models of the occurrence of compressive and tensile stresses in polycrystalline films due to the formation and coalescence of islands at the initial stage of their growth are considered. The regularities of the evolution of internal stresses in continuous films are discussed depending on the conditions of their deposition, as well as their chemical composition, structure, and mechanical properties. The mechanisms of development of internal stresses in thin films associated with the formation of point defects in them, the incorporation of impurities, and phase transformations occurring in the deposition process are reviewed. External factors that lead to the appearance of stresses in thin films during their storage and operation are considered in detail.
Similar content being viewed by others
REFERENCES
V. A. C. Haanappel, H. D. van Corbach, T. Fransen, and P. G. Gellings, Mater. Sci. Eng., A 167, 179 (1993). https://doi.org/10.1016/0921-5093(93)90352-F
B. E. Alaca, M. T. A. Saif, and H. Sehitoglu, Acta Mater. 50, 1197 (2002). https://doi.org/10.1016/S1359-6454(01)00421-9
P. J. J. Forschelen, A. S. J. Suiker, and O. van der Sluis, Int. J. Solids Struct. 97–98, 284 (2016). https://doi.org/10.1016/j.ijsolstr.2016.07.020
K. Khaledi, T. Brepols, and S. Reese, Mech. Mater. 137, 103142 (2019). https://doi.org/10.1016/j.mechmat.2019.103142
R. Stylianoua, D. Velic, W. Daves, W. Ecker, A. Stark, N. Schell, M. Tkadletz, N. Schalk, C. Czettl, and C. Mitterer, Int. J. Refract. Met. Hard Mater. 86, 105102 (2020). https://doi.org/10.1016/j.ijrmhm.2019.105102
D. S. Balint and J. W. Hutchinson, J. Appl. Mech. 68, 725 (2001). https://doi.org/10.1115/1.1388012
L. Lagunegrand, T. Lorriot, R. Harry, H. Wargnier, and J. M. Quenisset, Compos. Sci. Technol. 66, 1315 (2006). https://doi.org/10.1016/j.compscitech.2005.10.010
J. W. Hutchinson, M. Y. He, and A. G. Evans, J. Mech. Phys. Solids 48, 709 (2000). https://doi.org/10.1016/S0022-5096(99)00050-2
A. R. Shugurov and A. V. Panin, Phys. Mesomech. 13 (1–2), 9 (2010). https://doi.org/10.1016/j.physme.2010.03.010
C. Malerba, M. Valentini, R. C. L. Azanza, A. Rinaldi, and A. Mittiga, Mater. Des. 108, 725 (2016). https://doi.org/10.1016/j.matdes.2016.07.019
D. G. Liu, L. Zheng, J. Q. Liu, L. M. Luo, and Y. C. Wu, Ceram. Int. 44, 3644 (2018). https://doi.org/10.1016/j.ceramint.2017.11.115
S. J. Li, K. Wu, H. Z. Yuan, J. Y. Zhang, G. Liu, and J. Sun, Surf. Coat. Technol. 362, 35 (2019). https://doi.org/10.1016/j.surfcoat.2019.01.088
R. Delmelle, S. Michotte, M. Sinnaeve, and J. Proost, Acta Mater. 61, 2320 (2013). https://doi.org/10.1016/j.actamat.2013.01.003
X. Wang and J. J. Vlassak, Mech. Mater. 88, 50 (2015). https://doi.org/10.1016/j.mechmat.2015.05.001
H. Wang, W. Wang, W. Yang, Y. Zhu, Z. Lin, and G. Li, Appl. Surf. Sci. 369, 414 (2016). https://doi.org/10.1016/j.apsusc.2016.02.044
S. N. Hsiao, F. T. Yuan, S. K. Chen, A. C. Sun, S. H. Su, and K. F. Chiu, J. Magn. Magn. Mater. 398, 275 (2016). https://doi.org/10.1016/j.jmmm.2015.09.034
M. S. Sungurov and V. A. Finkel, Tech. Phys. 63 (8), 1182 (2018). https://doi.org/10.1134/S1063784218080200
V. M. Prokhorov, E. V. Gladkikh, L. A. Ivanov, V. V. Aksenenkov, and A. N. Kirichenko, Tech. Phys. 64 (5), 654 (2019). https://doi.org/10.1134/S1063784219050190
Z. S. Ma, Y. C. Zhou, S. G. Long, and C. Lu, Surf. Coat. Technol. 207, 305 (2012). https://doi.org/10.1016/j.surfcoat.2012.07.002
X. Zhang, M. Watanabe, and S. Kuroda, Eng. Fract. Mech. 110, 314 (2013). https://doi.org/10.1016/j.engfracmech.2013.08.016
G.-A. Cheng, D.-Y. Han, C.-L. Liang, X.-L. Wu, and R.-T. Zheng, Surf. Coat. Technol. 228, s328 (2013). https://doi.org/10.1016/j.surfcoat.2012.05.108
O. P. Oladijo, A. M. Venter, and L. A. Cornish, Int. J. Refract. Met. Hard Mater. 44, 68 (2014). https://doi.org/10.1016/j.ijrmhm.2014.01.009
B. Vierneusel, L. Benker, S. Tremmel, M. Göken, and B. Merle, Thin Solid Films 638, 159 (2017). https://doi.org/10.1016/j.tsf.2017.06.016
T. Poirié, T. Schmitt, E. Bousser, L. Martinu, and J.-E. Klemberg-Sapieha, Tribol. Int. 109, 355 (2017). https://doi.org/10.1016/j.triboint.2016.12.053
Y. Xi, Y. Bai, K. Gao, X. Pang, H. Yang, L. Yan, and A. A. Volinsky, Ceram. Int. 44, 15851 (2018). https://doi.org/10.1016/j.ceramint.2018.05.266
M. S. Bae, C. Park, D. Shin, S. M. Lee, and I. Yun, Solid-State Electron. 133, 1 (2017). https://doi.org/10.1016/j.sse.2017.04.003
M. H. Hong, D. I. Shim, H. H. Cho, and H. H. Park, Appl. Surf. Sci. 446, 160 (2018). https://doi.org/10.1016/j.apsusc.2018.01.283
T. Wang, B. Wang, A. Haque, M. Snure, E. Heller, and N. Glavin, Microelectron. Reliab. 81, 181 (2018). https://doi.org/10.1016/j.microrel.2017.12.033
Yu. A. Boikov, I. T. Serenkov, V. I. Sakharov, and V. A. Danilov, Phys. Solid State 60 (1), 173 (2018). https://doi.org/10.1134/S1063783418010067
K. Sun, Q. Li, H. Guo, Y. Yang, and L. Li, J. Alloys Compd. 663, 645 (2016). https://doi.org/10.1016/j.jallcom.2015.12.193
Q. Liu, W. Zhou, J. Ding, M. Xiao, Z. J. Yu, H. Xu, W. G. Mao, Y. M. Pei, F. X. Li, X. Feng, and D. N. Fang, J. Magn. Magn. Mater. 423, 90 (2017). https://doi.org/10.1016/j.jmmm.2016.09.07
Y. Tan, K. Liang, Z. Mei, P. Zhou, Y. Liu, Y. Qi, Z. Ma, and T. Zhang, Ceram. Int. 44, 5564 (2018). https://doi.org/10.1016/j.ceramint.2017.12.200
K. Kumar, P. Arun, C. R. Kant, N. C. Mehra, L. Makinistian, and E. A. Albanesi, J. Phys. Chem. Solids 71, 163 (2010). https://doi.org/10.1016/j.jpcs.2009.10.013
B. Sarma and B. K. Sarma, J. Alloys Compd. 734, 210 (2018). https://doi.org/10.1016/j.jallcom.2017.11.028
M. L. Savchenko, N. N. Vasil’ev, A. S. Yaroshevich, D. A. Kozlov, Z. D. Kvon, N. N. Mikhailov, and S. A. Dvoretskii, Phys. Solid State 60 (4), 778 (2018). https://doi.org/10.1134/S1063783418040285
W. Li, P. Li, H. Zeng, and Z. Yue, and J. Zhai, Mater. Lett. 162, 135 (2016). https://doi.org/10.1016/j.matlet.2015.09.137
Y. Wang, K. Y. Li, F. Scenini, J. Jiao, S. J. Qu, Q. Luo, and J. Shen, Surf. Coat. Technol. 302, 27 (2016). https://doi.org/10.1016/j.surfcoat.2016.05.034
S. Saha, M. Tomar, and V. Gupta, Enzyme Microb. Technol. 79–80, 63 (2015). https://doi.org/10.1016/j.enzmictec.2015.07.008
L. B. Freund and S. Suresh, Thin Film Materials: Stress, Defect Formation and Surface Evolution (Cambridge Univ. Press, Cambridge, 2003).
A. Fluri, D. Pergolesi, A. Wokaun, and T. Lippert, Phys. Rev. B 97, 125412 (2018). https://doi.org/10.1103/PhysRevB.97.125412
S. A. Kukushkin and A. V. Osipov, J. Appl. Phys. 113, 024909 (2013). https://doi.org/10.1063/1.4773343
F. S. Frank and J. H. van der Merwe, Proc. R. Soc. London, Ser. A 198, 205 (1949). https://doi.org/10.1098/rspa.1949.0095
F. C. Frank and J. H. van der Merwe, Proc. R. Soc. London, Ser. A 198, 216 (1949). https://doi.org/10.1098/rspa.1949.0096
V. A. Shchukin, A. I. Borovkov, N. N. Ledentsov, and P. S. Kop’ev, Phys. Rev. B 51, 17767 (1995). https://doi.org/10.1103/PhysRevB.51.17767
O. P. Pchelyakov, Yu. B. Bolkhovityanov, A. V. Dvurechenskii, L. V. Sokolov, A. I. Nikiforov, A. I. Yakimov, and B. Voigtländer, Semiconductors 34, 1229 (2000). https://doi.org/10.1134/1.1325416
Yu. B. Bolkhovityanov, O. P. Pchelyakov, and S. I. Chikichev, Phys.-Usp. 44, 655 (2001). https://doi.org/10.1070/PU2001v044n07ABEH000879
M. Yu. Gutkin and A. M. Smirnov, Phys. Solid State 58, 1611 (2016). https://doi.org/10.1134/S1063783416080138
H. V. Thang, S. Tosoni, and G. Pacchioni, Appl. Surf. Sci. 483, 133 (2019). https://doi.org/10.1016/j.apsusc.2019.03.240
M.-J. Casanove, A. Alimoussa, M. Schwerdtfeger, S. Gaubert, H. Moriceau, and J.-C. Villegier, Mater. Sci. Eng., B 33, 162 (1995). https://doi.org/10.1016/0921-5107(94)01182-6
Y. Obayashi and K. Shintani, J. Appl. Phys. 84, 3141 (1998). https://doi.org/10.1063/1.368468
M. Copel, M. C. Reuter, M. Horn von Hoegen, and R. M. Tromp, Phys. Rev. B 42, 11682 (1990). https://doi.org/10.1103/PhysRevB.42.11682
R. J. Asaro and W. A. Tiller, Metall. Trans. 3, 1789 (1972). https://doi.org/10.1007/BF02642562
M. A. Grinfeld, Sov. Phys.-Dokl. 31, 831 (1986).
D. J. Srolovitz, Acta Metall. 37, 621 (1989). https://doi.org/10.1016/0001-6160(89)90246-0
Y. Pang and R. Huang, Phys. Rev. B 74, 075413 (2006). https://doi.org/10.1103/PhysRevB.74.075413
J. Berrehar, C. Caroli, C. Lapersonne-Meyer, and M. Schott, Phys. Rev. B 46, 13487 (1992). https://doi.org/10.1103/PhysRevB.46.13487
M. Volmer and A. Weber, Z. Phys. Chem. 119, 277 (1926).
I. Lucci, S. Charbonnier, L. Pedesseau, M. Vallet, L. Cerutti, J.-B. Rodriguez, E. Tournié, R. Bernard, A. Létoublon, N. Bertru, A. Le Corre, S. Rennesson, F. Semond, G. Patriarche, L. Largeau, et al., Phys. Rev. Mater. 2, 060401(R) (2018). https://doi.org/10.1103/PhysRevMaterials.2.060401
I. N. Stranski and L. Krastanov, Sitzungsber. Akad. Wiss. Wien, Math.-Naturwiss. Kl. IIb 146, 797 (1938).
D. J. Eaglesham and M. Cerullo, Phys. Rev. Lett. 64, 1943 (1990). https://doi.org/10.1103/PhysRevLett.64.1943
J. E. Prieto and I. Markov, Surf. Sci. 664, 172 (2017). https://doi.org/10.1016/j.susc.2017.05.018
M. D. Rouhani, A. M. Gue, R. Malek, G. Bouyssou, and D. Esteve, Mater. Sci. Eng., B 37, 252 (1996). https://doi.org/10.1016/0921-5107(95)01452-7
R. C. Cammarata, T. M. Trimble, and D. J. Srolovitz, J. Mater. Res. 15, 2468 (2000). https://doi.org/10.1557/JMR.2000.0354
W. D. Nix and B. M. Clemens, J. Mater. Res. 14, 3467 (1999). https://doi.org/10.1557/JMR.1999.0468
J. Leib, R. Mönig, and C. V. Thompson, Phys. Rev. Lett. 102 (25), 256101 (2009). https://doi.org/10.1103/PhysRevLett.102.256101
G. Abadias, A. Fillon, J. J. Colin, A. Michel, and C. Jaouen, Vacuum 100, 36 (2014). https://doi.org/10.1016/j.vacuum.2013.07.041
E. Chason and P. R. Guduru, J. Appl. Phys. 119, 191101 (2016). https://doi.org/10.1063/1.4949263
C. Furgeaud, L. Simonot, A. Michel, C. Mastail, and G. Abadias, Acta Mater. 159, 286 (2018). https://doi.org/10.1016/j.actamat.2018.08.019
R. Koch, Surf. Coat. Technol. 204, 1973 (2010). https://doi.org/10.1016/j.surfcoat.2009.09.047
D. Magnfalt, A. Fillon, R. D. Boyd, U. Helmersson, K. Sarakinos, and G. Abadias, J. Appl. Phys. 119, 055305 (2016). https://doi.org/10.1063/1.4941271
D. L. Ma, P. P. Jing, Y. L. Gong, B. H. Wu, Q. Y. Deng, Y. T. Li, C. Z. Chen, Y. X. Leng, and N. Huang, Vacuum 160, 226 (2019). https://doi.org/10.1016/j.vacuum.2018.11.039
D. P. Adams, L. J. Parfitt, J. C. Biello, S. M. Yalisove, and Z. U. Rek, Thin Solid Films 266, 52 (1995). https://doi.org/10.1016/0040-6090(95)00603-6
C. Hua, X. Yan, J. Wei, J. Guo, J. Liu, L. Chen, L. Hei, and C. Li, Diamond Relat. Mater. 73, 62 (2017). https://doi.org/10.1016/j.diamond.2016.12.008
M. Laugier, Vacuum 31, 155 (1981). https://doi.org/10.1016/0042-207X(81)90007-5
R. C. Cammarata, Prog. Surf. Sci. 46, 1 (1994). https://doi.org/10.1016/0079-6816(94)90005-1
C. Friesen and C. V. Thompson, Phys. Rev. Lett. 89, 126103 (2002). https://doi.org/10.1103/PhysRevLett.89.126103
C. Friesen, S. C. Seel, and C. V. Thompson, J. Appl. Phys. 95, 1011 (2004). https://doi.org/10.1063/1.1637728
C. W. Pao, D. J. Srolovitz, and C. V. Thompson, Phys. Rev. B 74, 155437 (2006). https://doi.org/10.1103/PhysRevB.74.155437
R. Abermann and R. Koch, Thin Solid Films 129, 71 (1985). https://doi.org/10.1016/0040-6090(85)90096-3
R. Abermann, Thin Solid Films 186, 233 (1990). https://doi.org/10.1016/0040-6090(90)90145-4
R. Abermann, Vacuum 41, 1279 (1990). https://doi.org/10.1016/0042-207X(90)93933-A
D. W. Hoffman and J. A. Thornton, J. Vac. Sci. Technol. 20, 355 (1982). https://doi.org/10.1116/1.571463
M. Janda and O. Stefan, Thin Solid Films 112, 127 (1984). https://doi.org/10.1016/0040-6090(84)90490-5
J. A. Floro, S. J. Hearne, J. A. Hunter, P. Kotula, E. Chason, S. C. Seel, and C. V. Thompson, J. Appl. Phys. 89, 4886 (2001). https://doi.org/10.1063/1.1352563
H. Z. Yu and C. V. Thompson, Acta Mater. 67, 189 (2014). https://doi.org/10.1016/j.actamat.2013.12.031
C. V. Thompson and R. Carel, J. Mech. Phys. Solids 44, 657 (1996). https://doi.org/10.1016/0022-5096(96)00022-1
H. K. Pulker, Thin Solid Films 89, 191 (1982). https://doi.org/10.1016/0040-6090(82)90447-3
R. W. Hoffman, in Physics of Thin Films, Ed. by G. Hass and R.E. Thun (Academic, New York, 1966), Vol. 3, p. 211.
R. W. Hoffman, Thin Solid Films 34, 185 (1976). https://doi.org/10.1016/0040-6090(76)90453-3
L. B. Freund and E. Chason, J. Appl. Phys. 89, 4866 (2001). https://doi.org/10.1063/1.1359437
K. L. Johnson, K. Kendall, and A. D. Roberts, Proc. R. Soc. London, Ser. A 324, 301 (1971). https://doi.org/10.1098/rspa.1971.0141
R. Koch, J. Phys.: Condens. Matter 6, 9519 (1994). https://doi.org/10.1088/0953-8984/6/45/005
P. Chaudhari, J. Vac. Sci. Technol. 9, 520 (1972). https://doi.org/10.1116/1.1316674
M. F. Doerner and W. D. Nix, Crit. Rev. Solid State Mater. Sci. 14, 225 (1988). https://doi.org/10.1080/10408438808243734
H. J. Frost, F. Spaepen, and M. F. Ashby, Scr. Metall. 16, 1165 (1982). https://doi.org/10.1016/0036-9748(82)90089-8
R. Abermann, R. Koch, and R. Kramer, Thin Solid Films 58, 365 (1979). https://doi.org/10.1016/0040-6090(79)90272-4
F. Spaepen, Acta Mater. 48, 31 (2000). https://doi.org/10.1016/S1359-6454(99)00286-4
A. Gonzalez-González, G. M. Alonzo-Medina, A. I. Oliva, C. Polop, J. L. Sacedón, and E. Vasco, Phys. Rev. B 84, 155450 (2011). https://doi.org/10.1103/PhysRevB.84.155450
A. González-González, C. Polop, and E. Vasco, Phys. Rev. Lett. 110, 056101 (2013). https://doi.org/10.1103/PhysRevLett.110.056101
E. Chason, B. W. Sheldon, L. B. Freund, J. A. Floro, and S. J. Hearne, Phys. Rev. Lett. 88, 156103 (2002). https://doi.org/10.1103/PhysRevLett.88.156103
S. J. Tello, A. F. Bower, E. Chason, and B. W. Sheldon, Phys. Rev. Lett. 98, 216104 (2007). https://doi.org/10.1103/PhysRevLett.98.216104
E. Chason, Thin Solid Films 526, 1 (2012). https://doi.org/10.1016/j.tsf.2012.11.001
E. Chason, J. W. Shin, S. J. Hearne, and L. B. Freund, J. Appl. Phys. 111, 083520 (2012). https://doi.org/10.1063/1.4704683
E. Chason and A. F. Bower, J. Appl. Phys. 125, 115304 (2019). https://doi.org/10.1063/1.5085313
J. W. Shin and E. Chason, Phys. Rev. Lett. 103, 056102 (2009). https://doi.org/10.1103/PhysRevLett.103.056102
H. Z. Yu and C. V. Thompson, Appl. Phys. Lett. 104, 141913 (2014). https://doi.org/10.1063/1.4871214
D. Flötotto, Z. M. Wang, L. P. H. Jeurgens, and E. J. Mittemeijer, J. Appl. Phys. 118 (5), 055305 (2015). https://doi.org/10.1063/1.4928162
E. Chason, A. M. Engwall, Z. Rao, and T. Nishimura, J. Appl. Phys. 123, 185305 (2018). https://doi.org/10.1063/1.5030740
S. J. Hearne and J. A. Floro, J. Appl. Phys. 97, 014901 (2005). https://doi.org/10.1063/1.1819972
E. Chason, J. W. Shin, C.-H. Chen, A. M. Engwall, C. M. Miller, S. J. Hearne, and L. B. Freund, J. Appl. Phys. 115, 123519 (2014). https://doi.org/10.1063/1.4870051
A. M. Engwall, Z. Rao, and E. Chason, Mater. Des. 110, 616 (2016). https://doi.org/10.1016/j.matdes.2016.07.089
E. Chason, A. M. Engwall, F. Pei, M. Lafouresse, U. Bertocci, G. Stafford, J. A. Murphy, C. Lenihan, and D. N. Buckley, J. Electrochem. Soc. 160 (12), D3285 (2013). https://doi.org/10.1149/2.048312jes
A. M. Engwall, Z. Rao, and E. Chason, J. Electrochem. Soc. 164 (13), D828 (2017). https://doi.org/10.1149/2.0921713jes
R. Koch, D. Hu, and A. K. Das, Phys. Rev. Lett. 94, 146101 (2005). https://doi.org/10.1103/PhysRevLett.94.146101
H. Windischmann, Crit. Rev. Solid State Mater. Sci. 17, 547 (1992). https://doi.org/10.1080/10408439208244586
J. A. Floro, E. Chason, R. C. Cammarata, and D. J. Srolovitz, MRS Bull. 27, 19 (2002). https://doi.org/10.1557/mrs2002.15
G. C. A. M. Janssen, Thin Solid Films 515, 6654 (2007). https://doi.org/10.1016/j.tsf.2007.03.007
G. Abadias, E. Chason, J. Keckes, M. Sebastiani, G. B. Thompson, E. Barthel, G. L. Doll, C. E. Murray, C. H. Stoessel, and L. Martinu, J. Vac. Sci. Technol., A 36, 020801 (2018). https://doi.org/10.1116/1.5011790
S. O. Mbam, S. E. Nwonu, O. A. Orelaja, U. S. Nwigwe, and X. F. Gou, Mater. Res. Express 6, 122001 (2019). https://doi.org/10.1088/2053-1591/ab52cd
P. Eh. Hovsepian, A. A. Sugumaran, Y. Purandare, D. A. L. Loch, and A. P. Ehiasarian, Thin Solid Films 562, 132 (2014). https://doi.org/10.1016/j.tsf.2014.04.002
F. Cemin, G. Abadias, T. Minea, and D. Lundin, Thin Solid Films 688, 137335 (2019). https://doi.org/10.1016/j.tsf.2019.05.054
F. M. D’Heurle and J. M. Harper, Thin Solid Films 171, 81 (1989). https://doi.org/10.1016/0040-6090(89)90035-7
J. A. Thornton and D. W. Hoffman, Thin Solid Films 171, 5 (1989). https://doi.org/10.1016/0040-6090(89)90030-8
G. Carter, J. Phys. D: Appl. Phys. 27, 1046 (1994). https://doi.org/10.1088/0022-3727/27/5/024
H. Windischmann, J. Appl. Phys. 62, 1800 (1987). https://doi.org/10.1063/1.339560
L. Romano-Brandt, E. Salvatia, E. Le Bourhis, T. Moxhama, I. P. Dolbnyac, and A. M. Korsunsky, Surf. Coat. Technol. 381, 125142 (2020). https://doi.org/10.1016/j.surfcoat.2019.125142
F. Cemin, G. Abadias, T. Minea, C. Furgeaud, F. Brisset, D. Solas, and D. Lundin, Acta Mater. 141, 120 (2017). https://doi.org/10.1016/j.actamat.2017.09.007
G. C. A. M. Janssen and J.-D. Kamminga, Appl. Phys. Lett. 85, 3086 (2004). https://doi.org/10.1063/1.1807016
J.-D. Kamminga, Th. H. de Keijser, R. Delhez, and E. J. Mittemeijer, J. Appl. Phys. 88, 6332 (2000). https://doi.org/10.1063/1.1319973
C. M. Gilmore and J. A. Sprague, Thin Solid Films 419, 18 (2002). https://doi.org/10.1016/S0040-6090(02)00609-0
J.-D. Kamminga, Th. H. de Keijser, R. Delhez, and E. J. Mittemeijer, Thin Solid Films 317, 169 (1998). https://doi.org/10.1016/S0040-6090(97)00614-7
G. Abadias and Y. Y. Tse, J. Appl. Phys. 95, 2414 (2004). https://doi.org/10.1063/1.1646444
A. Debelle, G. Abadias, A. Michel, and C. Jaouen, J. Appl. Phys. 84, 5034 (2004). https://doi.org/10.1063/1.1763637
E. Chason, M. Karlson, J. J. Colin, D. Magnfält, K. Sarakinos, and G. Abadias, J. Appl. Phys. 119 (14), 145307 (2016). https://doi.org/10.1063/1.4946039
A. Fillon, G. Abadias, A. Michel, and C. Jaouen, Thin Solid Films 519, 1655 (2010). https://doi.org/10.1016/j.tsf.2010.07.091
J. J. Colin, G. Abadias, A. Michel, and C. Jaouen, Acta Mater. 126, 481 (2017). https://doi.org/10.1016/j.actamat.2016.12.030
T. Kaub, Z. Rao, E. Chason, and G. B. Thompson, Surf. Coat. Technol. 357, 939 (2019). https://doi.org/10.1016/j.surfcoat.2018.10.059
J. B. Gibson, A. N. Goland, M. Milgram, and G. H. Vineyard, Phys. Rev. 120, 1229 (1960). https://doi.org/10.1103/PhysRev.120.1229
S. Zhang, H. T. Johnson, G. J. Wagner, W. K. Liu, and K. J. Hsia, Acta Mater. 51, 5211 (2003). https://doi.org/10.1016/S1359-6454(03)00385-9
L. A. Davis, in Metallic Glasses, Ed. by J. J. Gilman and H. J. Leamy (Am. Soc. Metals, Metals Park, Ohio, 1978), p. 190.
T. Nonaka, G. Ohbayashi, Y. Toriumi, Y. Mori, and H. Hashimoto, Thin Solid Films 370, 258 (2000). https://doi.org/10.1016/S0040-6090(99)01090-1
T. P. Leervad Pedersen, J. Kalb, W. K. Njoroge, D. Wamwangi, M. Wuttig, and F. Spaepen, Appl. Phys. Lett. 79, 3597 (2001). https://doi.org/10.1063/1.1415419
B. Ben Yahia, M. S. Amara, M. Gallard, N. Burle, S. Escoubas, C. Guichet, M. Putero, C. Mocuta, M.-I. Richard, R. Chahine, C. Sabbione, M. Bernard, L. Fellouh, P. Noé, and O. Thom, Micro Nano Eng. 1, 63 (2018). https://doi.org/10.1016/j.mne.2018.10.001
W. Q. Lia, F. R. Liu, Y. Z. Zhang, G. Hana, W. N. Hana, F. Liu, and N. X. Sund, J. Non-Cryst. Solids 516, 99 (2019). https://doi.org/10.1016/j.jnoncrysol.2019.04.004
H. Horikoshi and N. Tamura, Jpn. J. Appl. Phys. 2, 328 (1963). https://doi.org/10.1143/JJAP.2.328
G. E. White and H. Chen, J. Appl. Phys. 68, 3317 (1990). https://doi.org/10.1063/1.346384
P. P. Buaud, F. M. d’Heurle, E. A. Irene, B. K. Patnaik, and N. R. Parikh, J. Vac. Sci. Technol., B 9, 2536 (1991). https://doi.org/10.1116/1.585688
P. Gergaud, O. Thomas, and B. Chenevier, J. Appl. Phys. 94, 1584 (2003). https://doi.org/10.1063/1.1590059
S.-L. Zhang and F. M. d’Heurle, Thin Solid Films 213, 34 (1992). https://doi.org/10.1016/0040-6090(92)90471-M
A. Fillon, G. Abadias, A. Michel, C. Jaouen, and P. Villechaise, Phys. Rev. Lett. 104, 096101 (2010). https://doi.org/10.1103/PhysRevLett.104.096101
B. Krause, G. Abadias, C. Furgeaud, A. Michel, A. Resta, A. Coati, Y. Garreau, A. Vlad, D. Hauschild, and T. Baumbach, ACS Appl. Mater. Interfaces 11, 39315 (2019). https://doi.org/10.1021/acsami.9b11492
D. S. Gardner, T. L. Michalka, P. A. Flinn, T. W. Barbee, Jr., K. C. Saraswat, and J. D. Meindl, Proc. 2nd Int. IEEE VLSI Multilevel Interconnection Conf. (Santa Clara, 1985), p. 102.
D. Winau, R. Koch, M. Weber, K.-H. Rieder, R. K. Garg, T. Schurig, and H. Koch, Appl. Phys. Lett. 61, 279 (1992). https://doi.org/10.1063/1.107937
G. Thurner and R. Abermann, Vacuum 41, 1300 (1990). https://doi.org/10.1016/0042-207X(90)93939-G
Y. Xu and X.-T. Yan, Chemical Vapour Deposition: An Integrated Engineering Design for Advanced Materials (Springer, London, 2010).
V. K. Tolpygo and D. R. Clarke, Acta Mater. 47, 3589 (1999). https://doi.org/10.1016/S1359-6454(99)00216-5
M. Murakami, J. Vac. Sci. Technol. 9, 2469 (1991). https://doi.org/10.1116/1.577258
L. Rossmann, M. Northam, B. Sarley, L. Chernova, V. Viswanathan, B. Harder, and S. Raghavan, Surf. Coat. Technol. 378, 125047 (2019). https://doi.org/10.1016/j.surfcoat.2019.125047
L. J. Schowalter and W. Li, Appl. Phys. Lett. 62, 696 (1993). https://doi.org/10.1063/1.108843
S. Kumar, M. T. Alam, Z. Connell, and M. A. Haque, Scr. Mater. 65, 277 (2011). https://doi.org/10.1016/j.scriptamat.2011.04.030
Y. H. Oh, S. I. Kim, M. Kim, S. Y. Lee, and Y. W. Kim, Ultramicroscopy 181, 160 (2017). https://doi.org/10.1016/j.ultramic.2017.05.018
F. M. d’Heurle and P. S. Ho, in Thin Films—Interdiffusion and Reactions, Ed. by J. M. Poate, K. N. Tu, and J. W. Mayer (Wiley, New York, 1978), p. 243.
R. Kirchheim, Acta Metall. Mater. 40, 309 (1992). https://doi.org/10.1016/0956-7151(92)90305-X
A. Korhonen, P. Børgesen, K. N. Tu, and C. Y. Li, J. Appl. Phys. 73, 3790 (1993). https://doi.org/10.1063/1.354073
L. Klinger, E. Glickman, A. Katsman, and L. Levin, Mater. Sci. Eng., B 23, 15 (1994). https://doi.org/10.1016/0921-5107(94)90271-2
E. E. Glickman, Phys. Low-Dimens. Struct. 1998 (5–6), 53 (1998). https://www.elibrary.ru/item.asp?id=14009779
L. Filipovic, Microelectron. Reliab. 97, 38 (2019). https://doi.org/10.1016/j.microrel.2019.04.005
I. A. Blech and C. Herring, Appl. Phys. Lett. 29, 131 (1976). https://doi.org/10.1063/1.89024
P.-C. Wang, G. S. Cargill III, I. C. Noyan, and C.-K. Hu, Appl. Phys. Lett. 72, 1296 (1998). https://doi.org/10.1063/1.120604
K. N. Tu, J. Appl. Phys. 94, 5451 (2003). https://doi.org/10.1063/1.1611263
K. N. Tu, Y. Liu, and M. Li, Appl. Phys. Rev. 4, 011101 (2017). https://doi.org/10.1063/1.4974168
A. Ababneh, U. Schmid, J. Hernando, J. L. Sanchez-Rajas, and H. Seidel, Mater. Sci. Eng., B 172, 253 (2010). https://doi.org/10.1016/j.mseb.2010.05.026
H. Liu, F. Zeng, G. Tang, F. Pan, Appl. Surf. Sci. 270, 225 (2013). https://doi.org/10.1016/j.apsusc.2013.01.005
S. Dutta, A. A. Jeyaseelan, and S. Sruthi, Thin Solid Films 562, 190 (2014). https://doi.org/10.1016/j.tsf.2014.04.072
L. Yin, W. Hu, M. Wu, J. Shi, and J. Zhu, J. Mater. Sci.: Mater. Electron. 30, 14072 (2019). https://doi.org/10.1007/s10854-019-01772-5
R. E. Newnham, V. Sundar, R. Yimnirun, J. Su, and Q. M. Zhang, J. Phys. Chem. B 101, 10141 (1997). https://doi.org/10.1021/jp971522c
V. A. Ivanov, A. S. Sakharov, and M. E. Konyzhev, Usp. Prikl. Fiz. 1 (6), 697 (2013).
J.-F. Vanhumbeeck and J. Proost, Electrochim. Acta 53 (21), 6165 (2008). https://doi.org/10.1016/j.electacta.2007.11.028
A. H. Heuer, H. Kahn, P. M. Natishan, F. J. Martin, and L. E. Cross, Electrochim. Acta 58, 157 (2011). https://doi.org/10.1016/j.electacta.2011.09.027
F. Blaffart, Q. Van Overmeere, T. Pardoen, and J. Proost, J. Solid State Electrochem. 17, 1945 (2013). https://doi.org/10.1007/s10008-013-2036-0
R. M. McMeeking and C. M. Landis, J. Appl. Mech. 72, 581 (2005). https://doi.org/10.1115/1.1940661
J.-Ph. Jay, F. Le Berre, S. P. Pogossian, and M. V. Indenbom, J. Magn. Magn. Mater. 322, 2203 (2010). https://doi.org/10.1016/j.jmmm.2010.02.011
R. Varghese, R. Viswan, K. Joshi, S. Seifikar, Y. Zhou, J. Schwartz, and S. Priya, J. Magn. Magn. Mater. 363, 179 (2014). https://doi.org/10.1016/j.jmmm.2014.03.076
S. H. Lim, H. J. Kim, S. M. Na, and S. J. Suh, J. Magn. Magn. Mater. 239, 546 (2002). https://doi.org/10.1016/S0304-8853(01)00660-6
S. S. Aplesnin, A. N. Masyugin, M. N. Sitnicov, U. I. Rybina, and T. Ishibashi, J. Magn. Magn. Mater. 464, 44 (2018). https://doi.org/10.1016/j.jmmm.2018.05.038
A. Shintani, S. Sugaki, and H. Nakashima, J. Appl. Phys. 51, 4197 (1980). https://doi.org/10.1063/1.328277
J.-D. Kim, S.-I. Pyun, and M. Seo, Electrochim. Acta 48 (9), 1123 (2003). https://doi.org/10.1016/S0013-4686(02)00823-X
S. M. Kim, S. H. Jin, Y. J. Lee, and M. H. Lee, Electrochim. Acta 252, 67 (2017). https://doi.org/10.1016/j.electacta.2017.08.157
J. Proost and A. Delvaux, Electrochim. Acta 322, 134752 (2019). https://doi.org/10.1016/j.electacta.2019.134752
O. Cao and J. A. Rogers, Adv. Mater. 21, 29 (2009). https://doi.org/10.1002/adma.200801995
J. A. Rogers, T. Someya, and Y. Huang, Science 327, 1603 (2010). https://doi.org/10.1126/science.1182383
X. M. Luo, B. Zhang, and G. P. Zhang, Nano Mater. Sci. 1 (3), 198 (2019). https://doi.org/10.1016/j.nanoms.2019.02.003
W. Gao, Y. Zhu, Y. Wang, G. Yuan, and J. M. Liu, J. Materiomics 6, 1 (2020). https://doi.org/10.1016/j.jmat.2019.11.001
C.-C. Lee, Thin Solid Films 544, 443 (2013). https://doi.org/10.1016/j.tsf.2013.02.084
D. Faurie, P.-O. Renault, E. Le Bourhis, G. Geandier, P. Goudeau, and D. Thiaudiere, Appl. Surf. Sci. 306, 70 (2014). https://doi.org/10.1016/j.apsusc.2014.02.032
A. A. Vereschaka, S. N. Grigoriev, N. N. Sitnikov, G. V. Oganyan, and A. Batako, Surf. Coat. Technol. 332, 198 (2017). https://doi.org/10.1016/j.surfcoat.2017.10.027
K. Bobzin, T. Brögelmann, N. C. Kruppe, and M. Carlet, Surf. Coat. Technol. 385, 125370 (2020). https://doi.org/10.1016/j.surfcoat.2020.125370
A. Grill, Diamond Relat. Mater. 12, 166 (2003). https://doi.org/10.1016/S0925-9635(03)00018-9
M. Qadir, Y. Li, and C. Wen, Acta Biomater. 89, 14 (2019). https://doi.org/10.1016/j.actbio.2019.03.006
H. Tian, N. Saka, and E. Rabinowicz, Wear 142, 57 (1991). https://doi.org/10.1016/0043-1648(91)90152-K
N. K. Myshkin, V. V. Konchits, and M. Braunovich, Electrical Contacts (Intellekt, Dolgoprudnyi, 2008) [in Russian].
E. V. Torskaya, A. M. Merzin, I. V. Mosyagina, and Yu. V. Kornev, Phys. Mesomech. 21, 475 (2018). https://doi.org/10.1134/S1029959918060012
Q. Liu, T. He, W. Y. Guo, Y. Baia, Y. S. Ma, Z. D. Chang, H. B. Liu, Y. X. Zhou, F. Ding, Y. W. Sun, Z. F. Han, and J. J. Tang, Surf. Coat. Technol. 370, 362 (2019). https://doi.org/10.1016/j.surfcoat.2019.03.044
R. Colaço, in Fundamentals of Friction and Wear on the Nanoscale, Ed. by E. Gnecco and E. Meyer (Springer, Heidelberg, 2007), p. 453.
M. A. Fortes, R. Colaço, and M. F. Vaz, Wear 230 (1), 1 (1999). https://doi.org/10.1016/S0043-1648(99)00086-1
Funding
This study was performed as a part of a state order to the Institute of Strength Physics and Materials Science, Siberian Branch, Russian Academy of Sciences, project III.23.1.3.
Author information
Authors and Affiliations
Corresponding author
Ethics declarations
The authors declare that they have no conflicts of interest.
Additional information
Translated by S. Rostovtseva
Rights and permissions
About this article
Cite this article
Shugurov, A.R., Panin, A.V. Mechanisms of Stress Generation in Thin Films and Coatings. Tech. Phys. 65, 1881–1904 (2020). https://doi.org/10.1134/S1063784220120257
Received:
Revised:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1134/S1063784220120257