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Effects of heat sink structure on heat transfer performance cooled by semiconductor and nanofluids

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Abstract

On account of the low heat dissipation problem of common cooling systems, an experimental system with enhanced structures was set to improve the heat transfer of heat sink cooled by semiconductor and TiO2-water nano-fluids. The influences of structures (smooth surface, metal foam with PPI=30, cylindrical bulge (height: H=2 mm, staggered arrangement), cylindrical groove (depth: D′=2 mm, staggered arrangement)), nanoparticle mass fractions (ω=0.0–0.5 wt%), input power of the semiconductor (P=2 W, 4 W, 6 W), and Reynolds numbers (Re=414−1,119) on the flow and heat transfer properties of TiO2-water nanofluids were studied. The compositive thermal and hydraulic properties of the enhanced technologies were analyzed by thermal efficiency. Results indicated that the combination of semiconductor and metal foam shows the most excellent performance compared with other combinations and it can be enhanced by 48.1% at best. Nanofluids with ω=0.4 wt% display the best cooling capacity instead of the highest concentration. The cooling effect shows an increasing trend with the input power of the semiconductor.

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Abbreviations

A:

area of the copper [m2]

cp :

specific heat of nanofluids [J·kg−1·K−1]

D:

hydraulic diameter [m]

D′ :

depth of cylindrical groove [m]

f:

frictional resistance coefficient

h:

convection heat transfer coefficient [W·m−2·K−1]

l:

length [m]

L:

wetted perimeter [m]

Nu:

Nusselt number

Δp/Δl :

pressure drop per unit length [Pa/m]

PPI:

pores per inch

Q:

heat absorption of nanofluids [W]

q:

mass flow rate [kg/s]

Re:

Reynolds number

T:

temperatures [K]

u:

velocity of nanofluids [m/s]

ρ :

density [kg/m3]

φ :

volume fraction [%]

ω :

mass fraction [%]

δ :

thickness of copper [m]

λ :

thermal conductivity [W·m−1·K−1]

μ :

dynamic viscosity [Pa·s]

η :

compositive assessment exponent

bf:

base fluid

nf:

nanofluids

np:

nanoparticle

w:

wall

in:

inlet

out:

outlet

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Acknowledgements

This work is financially supported by Natural Science Foundation of Jiangsu Province, China (Grant No. BK20181359).

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Authors and Affiliations

  1. Jiangsu Province Engineering Laboratory of High Efficient Energy Storage Technology and Equipments, China University of Mining and Technology, Xuzhou, 221116, China

    Cong Qi, Tiantian Chen, Jianglin Tu & Yuxing Wang

  2. School of Electrical and Power Engineering, China University of Mining and Technology, Xuzhou, 221116, China

    Cong Qi, Tiantian Chen, Jianglin Tu & Yuxing Wang

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  1. Cong Qi
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  2. Tiantian Chen
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  4. Yuxing Wang
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Correspondence to Cong Qi.

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Qi, C., Chen, T., Tu, J. et al. Effects of heat sink structure on heat transfer performance cooled by semiconductor and nanofluids. Korean J. Chem. Eng. 37, 2104–2116 (2020). https://doi.org/10.1007/s11814-020-0634-y

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  • DOI: https://doi.org/10.1007/s11814-020-0634-y

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