Abstract
Improvement of electrical insulating and adhesion characteristics of epoxydian resins cured with aminoimidazoline curing agents is considered. It is determined that necessary characteristics of fabricability (low viscosity and time of curing) and adhesion and cohesion strength to various metal substrates (steel, latten brass, coper, and aluminum) require low-viscous aminoimidazoline curing agents along with epoxy active diluents. The reasonability and effectiveness of combined action of the solutions of the products of condensation represented by Mannich bases containing imidazoline rings and initial aminoimidazolines as curing agents is demonstrated.
This is a preview of subscription content, log in via an institution to check access.
Similar content being viewed by others
REFERENCES
L. V. Chursova, A. N. Babin, T. A. Grebeneva, A. I. Tkachuk, A. I. Tsybin, V. P. Perevalov, and V. S. Mityanov, “Amine curing agents based on 4,4'-methylene bisaniline for epoxy binders,” Polym. Sci., Ser. D 10, 45–49 (2017).
V. A. Brezhnev and L. A. Onosova, “Investigation of the processes of formation of coatings based on modified epoxyamine compositions,” Usp. Khim. Khim. Tekhnol. 21 (5), 44–47 (2007).
G. Yang, Sh.-Y. Fu, and J. P. Yang, “Preparation and mechanical properties of modified epoxy resins with flexible diamines,” Polymer 48, 302–310 (2007).
A. V. Pestov, V. A. Osipova, I. S. Puzyrev, I. A. Veretennikova, D. I. Vichuzhanin, and S. V. Smirnov, “Effect of the composition of the alkoxide as a curing agent on the performance properties of epoxy glue,” in III Int. Conf. Modern Advances in the Field of Adhesives and Sealants (Dzerzhinsk–Nizhny Novgorod, 2019), pp. 108–110.
K. A. Medvedeva and E. N. Cherezova, “New curing systems for epoxydian oligomers,” Klei, Germetiki, Tekhnol., No. 10, 21–23 (2014).
A. P. Petrova and G. V. Malysheva, Adhesives, Adhesive Binders, and Adhesive Prepregs, Ed. by E. N. Kablov (Vseross. Inst. Aviats. Mater., Moscow, 2017) [in Russian].
S. N. Gladkikh, “Advances in the field of epoxy adhesives with increased heat resistance,” in III Int. Conf. Modern Advances in the Field of Adhesives and Sealants (Dzerzhinsk–Nizhny Novgorod, 2019), pp. 63–66.
S. N. Gladkikh, L. I. Kuznetsova, and E. N. Basharina, “Potting compounds based on modified epoxy resins,” Stroit. Dorozhn. Mash., No. 9, 47–49 (2007).
S. N. Gladkikh, V. M. Kolobkova, and E. N. Basharina, “New potting and impregnating compounds of cold curing on modified epoxy resins,” Klei, Germetiki, Tekhnol., No. 7, 8–13 (2006).
S. N. Gladkikh, E. N. Basharina, T. F. Vishnevskaya, et al., “Elastic transparent compounds for sealing elements of electro radio products,” Polym. Sci., Ser. D 5 (1), 38–41 (2012).
Kenji Kudo, Sawako Fuse, Masahiro Furutani, and Koji Arimitsu, “Imidasole-type thermal latent curing agents with high miscibility for one-component epoxy thermosetting resins,” J. Polym. Sci., Polym. Chem., 54, 2680–2688 (2016).
V. F. Stroganov, I. V. Stroganov, and V. A. Beloshenko, Shape Memory Epoxy Polymers: Structure, Properties, and Application (Kazan. Gos. Arkhit.-Stroit. Univ., Kazan, 2017) [in Russian].
Ghaemy Mousa and Sadjady Samaneh, “Study the curing kinetics îf DGEBA with imidazoles and propertystructure relatioships,” Iran. Polym. J. 15 (2), 103–110 (2006).
I. Z. Chernin, F. M. Smekhov, and Yu. V. Zherdev, Epoxy Polymers and Compositions (Khimiya, Moscow, 1982).
Author information
Authors and Affiliations
Corresponding author
Ethics declarations
The authors declare that they have no conflicts of interest.
Additional information
Translated by A. Muravev
Rights and permissions
About this article
Cite this article
Stroganov, V.F., Stroganov, I.V. Fast-Setting Low-Viscous Epoxy Compositions for Impregnation and Adhesion of Electrotechnical Products. Polym. Sci. Ser. D 13, 376–380 (2020). https://doi.org/10.1134/S1995421220040206
Received:
Revised:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1134/S1995421220040206