The microstructure in the bonding interface region of an ultrasonic spot welded Cu/Ni joint was investigated. At the copper side near the bonding interface, all the refined grains with random orientations and high-angle grain boundaries are < 5 nm in size. Nano-sized undulations occur at the Cu/Ni interface. The formation of nano-sized grains and undulation characteristics is ascribed to the dynamic recrystallization as well as shear instability in ultrasonic spot welding.
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This work was funded by the National Natural Science Foundation of China (Grant Nos. 51905171, 51975406) and Henan Province Science and Technology Research and Development Project (Grant No. HNGD2020013).
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Ni, Z.L., Yang, J.J., Wang, X.X. et al. Formation of Refined Grain Size Less Than 5 nm and Nano-sized Undulations in the Bonding Interface Region of an Ultrasonic Spot Welded Cu/Ni Joint. Metall Mater Trans A 51, 5606–5611 (2020). https://doi.org/10.1007/s11661-020-05956-1
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DOI: https://doi.org/10.1007/s11661-020-05956-1