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Fabrication of nano-cupric oxide in phenol–formaldehyde resin adhesive: effect of cupric chloride concentration on resin performance

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Abstract

The potential for simultaneously incorporating nano-copper oxide (CuO) while synthesizing phenol–formaldehyde (PF) resin using different concentrations of cupric chloride (CuCl2) was studied. Curing kinetics, resin morphology, as well as physical and mechanical properties of oriented strand boards produced using the modified PF resin were evaluated. Nano-CuO showed a positive effect on the PF resin curing reactions that was characterized by a significant decrease in the activation energy within conversion degree of 65%. X-ray photoelectron spectrometric analysis showed that bivalent CuO was present in the modified PF resin. Laser scattering particle analysis showed that more than 40% of CuO was in the nanoparticle range. Four types of nano-CuO crystal structures were observed. Incorporation of nano-CuO derived from a 40% concentration of CuCl2 into the PF resin gave a 74% increase in perpendicular MOR. 2-h thickness swelling of PCu-0.5 was improved significantly. The findings of this work have potential application to the engineered wood composites manufacturing.

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References

  • ASTM (2016) Standard E698-16. Test methods for Arrhenius kinetic constants for thermally unstable materials using differential scanning calorimetry and the Flynn/Ozawa method. In ASTM Annual Book of Standards, ASTM, West Conshohocken

  • Auad ML, Zhao L, Shen H, Nutt SR, Sorathia U (2007) Flammability properties and mechanical performance of epoxy modified phenolic foams. J Appl Polym Sci 104:1399–1407

    Article  CAS  Google Scholar 

  • Barghamadi M, Ghaemy M, Alizadeh R (2009) Non-isothermal cure kinetics of diglycidyl ether of biphenyl-a with various aromatic diamines. Iran Polym J 18:431–443

    CAS  Google Scholar 

  • Chinese Forestry Standard (2010) LY/T 1580-2010, Oriented strand board. State Forestry Administration, Beijing

    Google Scholar 

  • Chinese Standard (2005) LY/T 1635, use category and specification for preservative-treated wood. State Forestry Administration, Beijing

    Google Scholar 

  • Chinese Standard (2013) GB/T 17657, test methods of evaluating the properties of wood-based panels and surface decorated wood-based panels. State Forestry Administration, Beijing

    Google Scholar 

  • Chinese Standard (2017) GB/T 14074-2017 Testing methods for wood adhesives and their resins. General Administration of Quality Supervision, Inspection and Quarantine of the People’s Republic of China, Beijing

  • Gao W (2010) Preparation of structural strand board containing preservatives and the reaction mechanisms of its components. PhD Thesis, Beijing Forestry University

  • Gao W, Du G (2013) Curing kinetics of nano cupric oxide (CuO)-modified PF resin as wood adhesive: effect of surfactant. J Adhes Sci Technol 27:2421–2432

    Article  CAS  Google Scholar 

  • Gao W, Du G (2015) Physico-mechanical properties of plywood bonded by nano cupric oxide (CuO) modified PF resins against subterranean termites. Maderas Ciencia y Tecnología 17:129–138

    CAS  Google Scholar 

  • Gao W, Du G, Kamdem DP (2013) 13C CP/MAS NMR studies on the curing characteristics of phenol formaldehyde resin in the presence of nano cupric oxide and surfactants. Polym Compos 35:113–117

    Article  Google Scholar 

  • Gao W, Guo C, Yi T, Zhao S, Du G (2018) Dynamic mechanical thermal analysis (DMTA) of aqueous phenol formaldehyde (PF) resin modified by nano copper oxide (CuO). Eur J Wood Prod 76:1145–1151

    Article  CAS  Google Scholar 

  • Guo C, Yi T, Morrell J et al (2019) Incorporation of a nano/micro CuO formulation into phenol formaldehyde (PF) resin: curing kinetics, morphological analysis, and application. J Wood Chem Technol 39:372–383

    Article  CAS  Google Scholar 

  • Hartford WH (1973) Chemical and physical properties of wood preservatives and wood-preservative systems. In: Nicholas DD (ed) Wood deterioration and its prevention by preservative treatments, vol 2. Syracuse University Press, Syracuse, pp 1–120

    Google Scholar 

  • He Z, Zhang Y, Wei W (2012) Formaldehyde and VOC emissions at different manufacturing stages of wood-based panels. Build Environ 47:197–204

    Article  Google Scholar 

  • Hirano K, Asami M (2013) Phenolic resins-100 years of progress and their future. React Funct Polym 73:256–269

    Article  CAS  Google Scholar 

  • Liu Y, Laks P, Heiden P (2002a) Controlled release of biocides in solid wood. I. Efficacy against brown rot wood decay fungus (Gloeophyllum trabeum). J Appl Polym Sci 86:596–607

    Article  CAS  Google Scholar 

  • Liu Y, Laks P, Heiden P (2002b) Controlled release of biocides in solid wood. III. Preparation and characterization of surfactant-free nanoparticles. J Appl Polym Sci 86:615–621

    Article  CAS  Google Scholar 

  • Pilato L (2013) Phenolic resins: 100 years and still going strong. React Funct Polym 73:270–277

    Article  CAS  Google Scholar 

  • Pizzi A, Mittal KL (2003) Handbook of adhesive technology revised and expanded. Marcel Dekker, Inc., New York

    Book  Google Scholar 

  • Vyazovkin S, Sbirrazzuoli N (1999) Kinetic methods to study isothermal and non-isothermal epoxy anhydride cure. Macromol Chem Phys 200:2294–2303

    Article  CAS  Google Scholar 

  • Vyazovkin S, Sbirrazzuoli N (2006) Isoconversional kinetic analysis of thermally stimulated processes in polymers. Macromol Rapid Commun 27:1515–1532

    Article  CAS  Google Scholar 

  • Wang H, Lv R, Huang Z, Liu P, Cong P, Li T (2016) Synthesis and characterization of a fluorinated phenolic resin/phenolic resin blend. J Macromol Sci B 55:85–98

    Article  CAS  Google Scholar 

  • Yi T, Zhao S, Gai W, Guo C, Yang L, Du G (2018) The similar in situ polymerization of nano cupric oxide preparation and phenol formaldehyde resin synthesis: the process and mechanism. Int J Adhes Adhes 87:109–118

    Article  CAS  Google Scholar 

  • Yi T, Guo C, Zhao S, Zhan K, Gao W, Yang L, Du G (2020) The simultaneous preparation of nano cupric oxide (CuO) and phenol formaldehyde (PF) resin in one system: aimed to apply as wood adhesives. Eur J Wood Prod 78:471–482

    Article  CAS  Google Scholar 

  • Zhang Q, Zhang K, Xu D et al (2014) CuO nanostructures: synthesis, characterization, growth mechanisms, fundamental properties, and applications. Prog Nat Sci 60:208–337

    CAS  Google Scholar 

  • Zhao X, Xu Q (2010) Research on direct precipitation preparation process of nano-copper oxide. In: China Forestry Science and Technology Conference, pp 426–430

  • Zhao S, Gao W, Yi T, Guo C, Zhan K, Du G (2019) Fabrication of nano cupric oxide in phenol-formaldehyde resin adhesive: synthesis, curing characteristics, and morphology. Wood Sci Technol 53:819–853

    Article  CAS  Google Scholar 

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Acknowledgments

The authors express their gratitude to the National Natural Science Foundation of China (Granted 31660175), for their financial support to this research work, and also appreciate support from the Project of Yunnan Reserve Talents of Young Academic and Technical Leaders (2018HB025), as well as Yunnan Top Young Talents of Ten Thousand Talents Plan.

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Correspondence to Wei Gao.

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Zhao, S., Zhan, K., Lu, Q. et al. Fabrication of nano-cupric oxide in phenol–formaldehyde resin adhesive: effect of cupric chloride concentration on resin performance. Wood Sci Technol 54, 1551–1567 (2020). https://doi.org/10.1007/s00226-020-01219-9

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  • DOI: https://doi.org/10.1007/s00226-020-01219-9

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