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Fabrication of Parts with Integrated Circuits by Selective Electroless Plating of Additively Manufactured Plastic Substrates

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Abstract

The use of printed circuit boards (PCBs) has become essential in manufacturing parts with electronic functions. However, the placement of PCBs inside a product requires special plates or fixtures that need to be separately designed, fabricated, and assembled. In addition, PCB manufacturing generally utilizes various toxic metals and etchants. Thus, there is a need to address the issues of space, cost, and environmental toxicity inherent in PCBs. This paper proposes a novel method of fabricating PCB-free part with electronic circuits in a set using the casing or exterior of a product. This process enables the manufacturing of a type of molded interconnect device without conventional molding technologies by directly forming conductive circuits on the side or back of 3D-printed substrates using selective electroless plating. For 3D printing of the product structure, this study uses substrates made of polylactic acid (PLA) and acrylonitrile butadiene styrene (ABS), which are commonly used in the popular material-extrusion 3D printing technology. As ABS and PLA have different chemical properties, the region to be plated with the electrical circuit is fabricated using ABS, whereas the remaining substrate is fabricated using PLA. ABS was chemically treated to allow electroless plating. A process for forming 3D circuits was developed and evaluated by selective electroless plating of the areas of the substrate requiring circuitry. To verify the applicability of the proposed process, circuits and integrated parts used in the industry were redesigned into a single component and fabricated by applying the proposed process. The results demonstrate that the proposed process has good practical applicability. Furthermore, it has low environmental toxicity with low requirements for material consumption and processing energy.

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References

  1. Yung, K. C., Liem, H., Choy, H. S., & Lun, W. K. (2010). Thermal performance of high brightness LED array package on PCB. International Communications in Heat and Mass Transfer, 37(9), 1266–1272.

    Article  Google Scholar 

  2. Chen, M., Ogunseitan, O. A., Wang, J., Chen, H., Wang, B., & Chen, S. (2016). Evolution of electronic waste toxicity: Trends in innovation and regulation. Environment International, 89–90, 147–154.

    Article  Google Scholar 

  3. Kang, M., & Kang, K. (2018). Flexible 2-layer paper printed circuit board fabricated by inkjet printing for 3-D origami electronics. International Journal of Precision Engineering and Manufacturing-Green Technology, 5, 421–426.

    Article  Google Scholar 

  4. Lee, J., Kim, H., Choi, J., & Lee, I. (2017). A review on 3D printed smart devices for 4D printing. International Journal of Precision Engineering and Manufacturing-Green Technology, 4, 373–383.

    Article  Google Scholar 

  5. Lu, Y., Yun, H., Vatani, M., Kim, H., & Choi, J. (2015). Direct-print/cure as a molded interconnect device (MID) process for fabrication of automobile cruise controllers. Journal of Mechanical Science and Technology, 29, 5377–5385.

    Article  Google Scholar 

  6. Yun, H., Kim, H., & Lee, I. (2017). Research of circuit manufacturing for new MID technology development. Journal of Mechanical Science and Technology, 31, 5737–5743.

    Article  Google Scholar 

  7. Ko, H.-J. (2014). Development of 3D MID(Molded Interconnect Device) cruise control switch. Master thesis, Department of Mechanical Engineering Graduate School, Andong National University.

  8. Lim, S.-G. (2016). Research for generating circuit pattern of three-dimensional plastic (ABS) structure. Master thesis, Department of Mechanical Engineering Graduate School, Andong National University.

  9. Hon, K. K. B., Li, L., & Hutching, I. M. (2008). Direct Writing technology—Advances and developments. CIRP Annals, 57(2), 601–620.

    Article  Google Scholar 

  10. Kim, N.S., Han, K.N., Church, & KH. (2007). Direct Writing Technology for 21st Century Industries -Focus on Micro-Dispensing Deposition Write Technology. In: KSMTE Annual Spring Conference 2007, pp. 511–515.

  11. Ren, L., Li, B., Song, Z., Liu, L., Ren, L., & Zhou, X. (2019). 3D printing of bioinspired structural materials with fibers induced by doctor blading process. International Journal of Precision Engineering and Manufacturing-Green Technology, 6, 89–99. https://doi.org/10.1007/s40684-019-00030-7.

    Article  Google Scholar 

  12. Alkadi, F., Lee, J., Yeo, J., Hwang, S., & Choi, J. (2019). 3D printing of ground tire rubber composites. International Journal of Precision Engineering and Manufacturing-Green Technology, 6, 211–222. https://doi.org/10.1007/s40684-019-00023-6.

    Article  Google Scholar 

  13. Hu, F., Lyu, L., & He, Y. (2019). A 3D printed paper-based thermally driven soft robotic gripper inspired by cabbage. International Journal of Precision Engineering and Manufacturing, 20, 1915–1928. https://doi.org/10.1007/s12541-019-00199-6.

    Article  Google Scholar 

  14. Liu, J., Zheng, Y., Ma, Y., Qureshi, A., & Ahmad, R. (2019). A topology optimization method for hybrid subtractive-additive remanufacturing. International Journal of Precision Engineering and Manufacturing-Green Technology. https://doi.org/10.1007/s40684-019-00075-8.

    Article  Google Scholar 

  15. Kim, H., Cha, M., Kim, B., Lee, I., & Mun, D. (2019). Maintenance framework for repairing partially damaged parts using 3D printing. International Journal of Precision Engineering and Manufacturing, 20, 1451–1464. https://doi.org/10.1007/s12541-019-00132-x.

    Article  Google Scholar 

  16. Chung, H., Lee, N., Ko, J., Lee, T., & Lee, P. (2019). Optimal powder deposition process to develop a new direct-write additive manufacturing system. International Journal of Precision Engineering and Manufacturing, 20, 1057–1067. https://doi.org/10.1007/s12541-019-00129-6.

    Article  Google Scholar 

  17. Nguyen, C. H. P., Kim, Y., & Choi, Y. (2019). Design for additive manufacturing of functionally graded lattice structures: a design method with process induced anisotropy consideration. International Journal of Precision Engineering and Manufacturing-Green Technology. https://doi.org/10.1007/s40684-019-00173-7.

    Article  Google Scholar 

  18. Lee, D., Kim, H., Sim, J., Lee, D., Cho, H., & Hong, D. (2019). Trends in 3D printing technology for construction automation using text mining. International Journal of Precision Engineering and Manufacturing, 20, 871–882. https://doi.org/10.1007/s12541-019-00117-w.

    Article  Google Scholar 

  19. Kim, H., Park, S., & Lee, I. (2019). Additive manufacturing of smart insole by direct printing of pressure sensitive material. Journal of Mechanical Science and Technology, 33, 5609–5614. https://doi.org/10.1007/s12206-019-1101-8.

    Article  Google Scholar 

  20. Jeon, S., Han, J., Jeong, W., Son, J., & Kim, J. (2019). Flexibility enhancement of poly(lactide-co-glycolide) for fused deposition modeling technology. International Journal of Precision Engineering and Manufacturing-Green Technology, 6, 465–475. https://doi.org/10.1007/s40684-019-00067-8.

    Article  Google Scholar 

  21. Günay, E. E., Velineni, A., Park, K., & Kremer, G. (2019). An investigation on process capability analysis for fused filament fabrication. International Journal of Precision Engineering and Manufacturing. https://doi.org/10.1007/s12541-019-00298-4.

    Article  Google Scholar 

  22. Kim, M. K., Lee, I. H., & Kim, H. (2018). Effect of fabrication parameters on surface roughness of FDM parts. International Journal of Precision Engineering and Manufacturing, 19, 137–142. https://doi.org/10.1007/s12541-018-0016-0.

    Article  Google Scholar 

  23. Beak, B. M., Lee, J. H., Shin, D. S., & Lee, K. S. (2012). Development of three dimensions laser direct patterning system. Journal of the KSMTE, 21(1), 116–122.

    Google Scholar 

  24. Lee, I. K. (2004). A study on the Ni UBM using electroless Ni plating method. Master thesis, School of Material Engineering, Seoul National University.

  25. Hong, M. S. (2012). Mechanical properties and electromagnetic interference shielding behaviors of electroless nickel-loaded multi-walled carbon nanotube/chopped fibers-reinforced high density poly ethylene matrix composites. Master thesis Department of Nano Advanced Materials, Jeonju University.

  26. Tang, X., Cao, M., Bi, C., Yan, L., & Zhang, B. (2008). Research on a new surface activation process for electroless plating on ABS plastic. Materials Letters, 62(6–7), 1089–1091.

    Article  Google Scholar 

  27. Olivera, S., Muralidhara, H. B., Venkatesh, K., Gopalakrishna, K., & Vivek, C. S. (2016). Plating on acrylonitrile–butadiene–styrene (ABS) plastic: a review. Journal of Materials Science, 51, 3657–3674.

    Article  Google Scholar 

  28. Haque, I.-U., Ahmad, S., & Khan, A. (2005). Electroless nickel plating on ABS plastics from nickel chloride and nickel sulfate baths. Journal Chemical Society of Pakistan, 27(3), 246–249.

    Google Scholar 

  29. Kim, S. Y. (2018). 3D circuit device by selective plating of 3D printing parts. Master thesis, Department of Mechanical Engineering Graduate School, Andong National University.

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Acknowledgement

This research was supported by the Basic Science Research Program through the National Research Foundation of Korea (NRF) funded by the Ministry of Science, ICT and Future Planning (NRF-2017R1A2B4009386)

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Authors and Affiliations

  1. Sungbo P&T LTD, Hwaseong-si, Gyeonggi-do, South Korea

    Seonyeop Kim

  2. School of Mechanical Engineering, Chungbuk National University, Chungdae-ro 1, Seowon-Gu, Cheongju, Chungbuk, 28644, South Korea

    Inhwan Lee

  3. Department of Mechanical and Automotive Engineering, Andong National University, Andong, Gyeongsangbuk-do, 36729, South Korea

    Hochan Kim

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  1. Seonyeop Kim
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Correspondence to Hochan Kim.

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Kim, S., Lee, I. & Kim, H. Fabrication of Parts with Integrated Circuits by Selective Electroless Plating of Additively Manufactured Plastic Substrates. Int. J. of Precis. Eng. and Manuf.-Green Tech. 8, 1439–1447 (2021). https://doi.org/10.1007/s40684-020-00252-0

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  • DOI: https://doi.org/10.1007/s40684-020-00252-0

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