Abstract
Physicomechanical, thermophysical, and electrical properties of syntactic foams based on ED-20 epoxy diane resin and hollow phenol-formaldehyde microspheres have been considered. The optimal amount of microspheres in the composition has been determined. It has been shown that hollow microspheres affect the adhesion and strength characteristics of the sealant and reduce the dielectric loss tangent in the centimeter UHF range, which allows one to recommend such syntactic foams as sealing compositions in radioelectronic equipment and antenna-feeder devices operating in the ultra-high-frequency radio range.
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Translated by A. Muravev
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Chukhlanov, V.Y., Selivanov, O.G., Chukhlanova, N.V. et al. Syntactic Foams for Filling Sealing Compositions Based on Epoxy Resin and Hollow Phenol-Formaldehyde Microspheres. Polym. Sci. Ser. D 13, 241–244 (2020). https://doi.org/10.1134/S1995421220030053
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DOI: https://doi.org/10.1134/S1995421220030053