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Surface Silanization of Polyimide for Autocatalytic Metallization

  • Interfacial Stability in Multi-component Systems
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Abstract

Due to its superior chemical stability, mechanical strength, light weight, and flexibility, polyimide (PI) has been widely used as a polymeric substrate of flexible printed circuit boards such as flexible copper clad laminates (FCCLs). The development of an adhesiveless dual-layer structure is imperative for the application of FCCLs in globalized 5G consumer electronics. In this work, autocatalytic metallization on a silane-grafted PI film was developed to fabricate a high-quality Cu/PI substrate. PI was functionalized by amine-terminated organosilanes to load polyvinylpyrrolidone-capped Pd nanoclusters (PVP-nPd) as a catalyst. The effects of organosilanes with different numbers of amine functional groups on the adsorption of the PVP-nPd catalyst and the subsequent metallization of Cu were systematically investigated. Comprehensive surface characterizations were carried out on the PI films before and after silanization. The organosilane bearing three amine groups was found to outperform its counterpart with one amine group, exhibiting a fourfold increase in catalyst adsorption, which also improved the metallization efficiency.

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Acknowledgements

This work was financially supported by the “Innovation and Development Center of Sustainable Agriculture” from The Featured Areas Research Center Program within the framework of the Higher Education Sprout Project by the Ministry of Education (MOE) in Taiwan. This work was also financially supported by the Ministry of Science and Technology (MOST 107-2218-E-005-001) in Taiwan.

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Authors and Affiliations

  1. Department of Chemical Engineering, National Chung Hsing University, Taichung, 402, Taiwan

    Jun-Nan Liu, Manik Chandra Sil & Chih-Ming Chen

  2. Department of Mechanical Engineering, The University of Hong Kong, Pok Fu Lam, Hong Kong

    Rui Cheng & Shien-Ping Feng

  3. Innovation and Development Center of Sustainable Agriculture (IDCSA), National Chung Hsing University, Taichung, 402, Taiwan

    Chih-Ming Chen

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  1. Jun-Nan Liu
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Liu, JN., Sil, M.C., Cheng, R. et al. Surface Silanization of Polyimide for Autocatalytic Metallization. JOM 72, 3529–3537 (2020). https://doi.org/10.1007/s11837-020-04286-2

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  • DOI: https://doi.org/10.1007/s11837-020-04286-2

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