Skip to main content
SpringerLink
Log in

Silica/Epoxy Hybrid Encapsulation with High Heat-Resistance and Low Coefficient of Thermal Expansion

  • Article
  • Published:
Macromolecular Research Aims and scope Submit manuscript

Abstract

As a matrix resin of silica/epoxy hybrid encapsulation material with high heat resistance and low coefficient of thermal expansion, a tri-functional triglycidyl p-aminophenol (TGPAP) epoxy was successfully synthesized with the desired chemical structure by reacting epichlorohydrin with p-aminophenol using sodium hydroxide catalyst. In order to produce highly pure TGPAP with lower viscosity, a physical thin film vacuum distillation was carried out after synthesis, resulting in 97% purity with the viscosity of 700 cps at room temperature. Silica/TGPAP hybrid was fabricated using two kinds of ground fumed silica with different sizes of 20 μm and 9 μm. Glass transition temperature of the hybrid was found to be as high as 185 °C. Viscosity of the hybrid was 30,000 cps at room temperature before curing, implying good processability. When two different sizes of silica were used with 1 to 1 weight ratio, very low coefficient of thermal expansion of 22.79 ppm/°C was obtained. From thermal shock test, no cracks were observed even after 1,000 cycles of thermal shock between −40 °C and 125 °C when 67 wt% (45.8 vol%) of silica was involved in the hybrid. In conclusion, silica/TGPAP hybrid with improved processability, superior thermal shock resistance and low thermal expansion coefficient could be fabricated as electronic device encapsulation.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Similar content being viewed by others

References

  1. Z. Chen, Proc. of the 5th International Conference on Environment, Materials, Chemistry and Power Electronics, Zhengzhou, 2016, p 21.

  2. D. H. Schramm, J. of Renewable Energy and Sustainable Development, 1, 233 (2015).

    Google Scholar 

  3. H. Casier, Proceesings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 7 (2004).

  4. W. Hollstein, Proc. Inductica (2012).

  5. L. Gang, J. Experiment Science & Technology, 8, 20 (2010).

    Google Scholar 

  6. E. M. Johansson, Thesis, Controlling the Pore Size and Morphology of Mesoporous Silica, Linköping Univ. Electronic Press, Linköping, 2010.

    Google Scholar 

  7. I. Baylakoglu, C. Hillman, and M. Pecht, Proc. of the International IEEE Conference on the Business of Electronic Product Reliability and Liability, Hong Kong, 2003.

  8. J. Tarrío-Saavedra, J. López-Beceiro, S. Naya, C. Gracia, and R. Artiaga, Express Polym. Lett., 4, 382 (2010).

    Article  Google Scholar 

  9. Y. Wang, H. Liu, W. Li, and R. Ding, Macromol. Res., 27, 310 (2019).

    Article  CAS  Google Scholar 

  10. H. T. Han and C. S. Wang, Eur. Polym. J., 37.2, 267 (2001).

    Google Scholar 

  11. T. Braun, K. F. Becker, M. Koch, V. Bader, R. Aschenbrenner, and H. Reichl, 8thInternational Advanced Packaging Materials Symposium IEEE., 2002, pp 151–159.

  12. R. Mustafa, M. B. H. Othman, H. Ismail, and Z. Ahmad, Malaysian Polym. J., 4, 68 (2009).

    Google Scholar 

  13. B. E. Neves, R. B. Snyder, and T. A. Estes, Proc. of IPC Printed Circuit EXPO, Long Beach, 2003.

  14. C. S. Wang and Z. K. Liao, Polym. Bulletin, 25, 559 (1991).

    Article  CAS  Google Scholar 

  15. C. Asada, S. Basnet, M. Otsuka, C. Sasaki, and Y. Nakamura, Int. J. Biol. Macromol, 74, 413 (2015).

    Article  CAS  PubMed  Google Scholar 

  16. A. D. Nguyen and F. Le Goffic, Chem. Eng. Sci., 52, 2661 (1997).

    Article  Google Scholar 

  17. J. Cvengroš, Š. Pollák, M. Micov, and J. Lutišan, Chem. Eng. J., 81, 9 (2001).

    Article  Google Scholar 

  18. J. Cvengroš, Chem. Eng. Technol., 18, 49 (1995).

    Article  Google Scholar 

  19. ASTM D 1652-97, American Society for Testing Materials International (1997).

  20. ISO 2127-1, International Organization for Standardization (2019).

  21. ISO 2555, International Organization for Standardization (2018).

  22. T. H. Huh, S. Y. Lee, S. K. Park, J. H. Chang, Y. Lee, and Y. J. Kwark, Macromol. Res., 26, 187 (2018).

    Article  CAS  Google Scholar 

  23. S. E. Lehman Jr., U.S. Patent 7,351,784 (2008).

  24. JESD22-A104B, Joint Electron Device Engineering Council Standard (2000).

  25. JESD22-A106B, Joint Electron Device Engineering Council Standard (2004).

  26. AEC-Q200 Grade 1, Automotive Electronics Council Component Technical Committee (2010).

Download references

Author information

Authors and Affiliations

  1. School of Chemical Engineering, Sungkyunkwan University, Suwon, Gyeonggi, 16419, Korea

    Sung Bum Lee, Sung Hee Kim & Jun Young Lee

  2. KUKDO Chemical, 61, Gasandigital 2-ro, Geumcheon-gu, Seoul, 08588, Korea

    Sung Bum Lee & Ho Sik Lee

  3. Hyundai Motor Group, 150, Hyundaiyeonguso-ro, Hwaseong-si, Gyeonggi, 18280, Korea

    Chang Bum Son

Authors
  1. Sung Bum Lee
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Ho Sik Lee
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Chang Bum Son
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. Sung Hee Kim
    View author publications

    You can also search for this author in PubMed Google Scholar

  5. Jun Young Lee
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to Jun Young Lee.

Additional information

Publisher’s Note Springer Nature remains neutral with regard to jurisdictional claims in published maps and institutional affiliations.

Acknowledgments: This research was financially supported by National Research Foundation of Korea (NRF) grant (2010-0027955) and Korea Institute of Industrial Technology as “Development of smart textronic products based on electronic fibers and textiles (kitech JA-20-0001).”

Rights and permissions

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Lee, S.B., Lee, H.S., Son, C.B. et al. Silica/Epoxy Hybrid Encapsulation with High Heat-Resistance and Low Coefficient of Thermal Expansion. Macromol. Res. 28, 1040–1045 (2020). https://doi.org/10.1007/s13233-020-8135-8

Download citation

  • Received:

  • Revised:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s13233-020-8135-8

Keywords

Search

Navigation