Non-similar solution of Sisko nanofluid flow with variable thermal conductivity: a finite difference approach

The main purpose of this study is to present a non-similar analysis of two-dimensional boundary layer flow of non-Newtonian nanofluid over a vertical stretching sheet with variable thermal conductivity. The Sisko fluid model is used for non-Newtonian fluid with an exponent (n* > 1), that is, shear thickening fluid. Buongiorno model for nanofluid accounting Brownian diffusion and thermophoresis effects is used to model the governing differential equations.

The governing boundary layer equations are converted into nondimensional coupled nonlinear partial differential equations using appropriate transformations. The resultant differential equations are solved numerically using implicit finite difference scheme in association with the quasilinearization technique.

This analysis shows that the temperature raises for thermal conductivity parameter and velocity ratio parameter while decreases for the thermal buoyancy parameter. The thermophoresis and Brownian diffusion parameter that characterizes the nanofluid flow enhances the temperature and reduces the heat transfer rate. Skin friction drag can be effectively reduced by proper control of the values of thermal buoyancy and velocity ratio parameter.

The wall heating and cooling investigation result in the analysis of the control parameters that are related to the designing and manufacturing of thermal systems for cooling applications and energy harvesting. These control parameters have practical significance in the designing of heat exchangers and solar thermal collectors, in glass and polymer industries, in the extrusion of plastic sheets, the process of cooling of the metallic plate, etc.

To the best of authors’ knowledge, it is found from the literature survey that no similar work has been published which investigates the non-similar solution of Sisko nanofluid with variable thermal conductivity using finite difference method and quasilinearization technique.