Regular paperImproved digital performance of charge plasma based junctionless C-FinFETs at 10 nm technology node and beyond
Introduction
Aggressive down scaling of various kinds of MOSFETs built using different materials such as Si [1], [2], [3] and Ge [4], [5] leads to reduced gate control over the charge transport through the channel, which entails short channel effects (SCEs). In order to mitigate these shortcomings, the multigate architectures, especially tri-gated FinFETs, gained huge attention in the sub-30 nm technology node owing to their excellent control of short channel effects (SCEs), lower leakage current and high packing density [1], [2], [3]. For extremely miniaturized devices, the fabrication of p-n junctions having very high doping concentration gradient is critical and costly as well [6]. The junctionless (JL) FinFET featuring uniform doping type with a typical concentration ~1019 cm−3 [6] throughout the channel and source/drain regions has been proposed as a very promising option to address these problems [6], [7], [8], [9], [10].There have been some recent investigations concerning the impact of non uniform doping concentration on the behavior of JL FinFETs which include modeling of threshold voltage [11], evaluation of digital performance [12]and investigation of analog/RF as well as linearity performance [13] of JL FinFETs with Gaussian doping profile. Unfortunately heavily doped JL transistors are, however, prone to random dopant fluctuations (RDFs), line edge roughness (LER) and threshold voltage variability [14], [15], [16].
To alleviate the foregoing shortcomings of JL-FinFETs we propose, for the first time, a new device concept of charge plasma based junction-less FinFETs (CPJL-FinFETs). The doping concentration of Si Fin is considered to be 1 × 1017 cm−3 following ref. [17]. While the charge-plasma concept was conceived earlier in the context of the diode, BJT, and double gate MOS structures and the related findings were reported in [8], [17], [18], [19], [20], [21], [22], [23], there have been no such investigations towards the usefulness of charge plasma based tri-gated FinFETs for digital circuit applications.
The objective of this paper is to investigate comprehensively the digital performance of a complementary-Fin (C- Fin) inverter using CPJL-FinFETs at both 10 and 7 nm technology nodes following the guidelines noted in the International Roadmap for Devices and Systems [24], and to present a comparison with its identical JL-Fins counterpart supported by physics based analysis including quantum–mechanical effects. In addition, we construct a 3-stage ring oscillator (RO) using C-FinFET inverters and determine propagation delay per inverter stage (tp), and also the frequency of oscillations (fosc) of the oscillator. In order to achieve our goal, first we design an inverter using p-channel CPJL-FinFET and an n-channel CPJL-FinFET. Next, we simulate its characteristics to extract multiple digital device parameters such as noise margin (NM), logic swing (LS), DC power consumption (PDC), rise time (tr), fall time (tf), and propagation delay per inverter (tp). Finally, we compare the above-noted digital performance parameters for CPJL-Fin inverter with those of JL-Fin inverter.
Section snippets
Device structure and simulation
The primary requirements for using the charge-plasma concept, which are considered in our study are described as follows: (a) the workfunction of metallic contact in source/drain (S/D) should be less and greater than that of silicon, such that φm < [χSi + (EG/2q)] for the n-FinFET and φm > [χSi + (EG/2q)] for the p-FinFET, respectively; where q is the elementary charge, χSi is the electron affinity of bulk silicon (χSi = 4.17 eV), and EG is the band-gap of bulk silicon, (b) thickness of the
Model calibration
In order to validate various models used in the simulation set-up we consider measured transfer characteristics of Si n- and p-JLFinFETs having gate length of 13 nm reported in [30]. The Si p- and n- JLFinFETs in [30] comprised a Si JLFin featuring 15-nm width and 9-nm height. These transistors were fabricated using a Si body kept on a buried oxide layer thickness of 145 nm. Optical (DUV) lithography followed by a resist trimming process was performed to achieve nanowire structures. The gate
Results and discussion
We investigate digital performance of the proposed CP-JL FinFETs and compare their performance with that of JL FinFETs at 10 and 7 nm technology nodes. Since at these nodes quantum mechanical effects influence the device characteristics notably, we have always taken into account quantum mechanical effects in order to obtain accurate current voltage characteristics of both CP- and JL FinFETs. It is worthwhile noting that considering quantum mechanical effects, we have presented all the results
Conclusion
A novel charge plasma based C-FinFET (CPJL-CFin) inverter, is proposed for nanoscale CMOS technology nodes. Its digital performance is investigated, and analyzed physically including quantum–mechanical effects. Our proposed CPJL-CFin inverter outperforms the equivalent JL complementary FinFET (JL-CFin) inverter, in terms of several logic device parameters viz. noise margin, logic swing, rise time, fall time, average switching delay, and propagation delay while dissipating less off-state power
Declaration of Competing Interest
The authors declare that they have no known competing financial interests or personal relationships that could have appeared to influence the work reported in this paper.
Acknowledgement
The first author acknowledges CSIR, HRDG, India for providing fellowship for SRF vide File No. 09/028(1030)/2018-EMR-I dtd. 16.04.2018. The second author wants to thank SERB, India for providing financial support through the project bearing FILE NO. EEQ/2017/000634 dtd. 17.03.2018.
References (34)
- et al.
New subthreshold performance analysis of germanium based dual halo gate stacked triple material surrounding gate tunnel field effect transistor
Superlatt Microstruct
(2019) - et al.
Junctionless nanowire transistor (JNT): properties and design guidelines
Solid-State Electron
(2011) - et al.
Reduction of self-heating effect using selective buried oxide (SELBOX) charge plasma based junctionless transistor
AEU-Int J Electron Commun
(2018) - et al.
FinFET—a self-aligned double-gate MOSFET scalable to 20 nm
IEEE Trans Electron Dev
(2000) - et al.
The ultimate CMOS device and beyond
Proc IEDM tech dig San Francisco
(2012) A new device-physics-based noise margin/logic swing model of surrounding-gate MOSFET working on subthreshold logic gate
IEEE Trans Electron Dev
(2016)- et al.
Subthreshold performance analysis of germanium source dual halo dual dielectric triple material surrounding gate tunnel field effect transistor for ultra low power applications
J Electron Mater
(2019) - et al.
Nanowire transistors without junctions
Nat Nanotechnol
(2010) - et al.
Device and circuit performance estimation of junctionless bulk FinFETs
IEEE Trans Electron Dev
(2013) - et al.
Improved statistical variability and delay performance with junctionless inserted oxide FinFET
AEU-Int J Electron Commun
(2020)
Threshold voltage modeling for a Gaussian-doped junctionless FinFET
J Comput Electron
Impact of uniform and non-uniform doping variations for ultrathin body junctionless FinFETs
Mater Sci Semicond Process
The improved RF/stability and linearity performance of the ultrathin-body Gaussian-doped junctionless FinFET
J Comput Electron
Variability impact of random dopant fluctuation on nanoscale junctionless FinFETs
IEEE Electron Dev Lett
Analysis of threshold voltage variability due to random dopant fluctuations in junctionless FETs
IEEE Electron Dev Lett
Study of discrete doping-induced variability in junctionless nanowire MOSFETs using dissipative quantum transport simulations
IEEE Electron Dev Lett
Source/drain engineered charge-plasma junctionless transistor for the immune of line edge roughness effect
IEEE Trans Electron Dev
Cited by (6)
Enhanced analog/RF performance of hybrid charge plasma based junctionless C-FinFET amplifiers at 10 nm technology node
2023, Microelectronics JournalCitation Excerpt :The carrier density for CP-FinFETs attains higher values at the surface of the fins but somehow lowered when it reaches at the center of the fins in comparison with the equivalent JL-fins, which may be interpreted taking into account the bulk current conduction for junctionless transistors [10]. On the other hand, for CP-fins the conduction channel is dispersed all through the Si fin i.e., volume accumulation, which is also commensurate with our earlier finding in Ref. [17]. However, as the CP-FinFET has significantly lower doping concentration, it causes higher carrier mobility in comparison with the JL-FinFET, resulting in an enhancement of ION while reducing doping induced variability as well.
Junctionless SOI FinFET with advanced spacer techniques for sub-3 nm technology nodes
2022, AEU - International Journal of Electronics and CommunicationsCitation Excerpt :This high temperature leads to lateral diffusion in source/drain which is unavoidable during annealing and places a restriction on the thermal budget [1]. Hence to overcome the requirements of steep doping profile and ultra-fast annealing, junctionless (JL) transistors are proposed which are devoid of metallurgical junctions [2]. The JL devices can be formed on bulk or SOI over their advantages and disadvantages [3–5].
Optimization of a Nanoscale Operational Amplifier Based on a Complementary Carbon Nanotube Field-Effect Transistor by Adjusting Physical Parameters
2024, IEEE Transactions on NanotechnologyEffect of Work Function Modulation on Switching Current Ratio For A Dual Metal Gate Junctionless FinFET (DMG-JL FinFET)
2023, 2023 International Conference on Next Generation Electronics, NEleX 2023