Abstract
Active metal brazing of SiC-base ceramics and composites to Ti, Cu-clad-Mo, and nickel was carried out to screen promising commercial braze compositions with liquidus temperatures of 810-1040 °C. Microstructure, elemental composition, and microhardness were characterized using FESEM, EDS, and Knoop test in joints brazed using Ag-Cu-Ti alloys (Cusil-ABA and Ticusil) and a Ni-base alloy (MBF-20). Ti- and Si-rich interfacial layers developed in joints brazed using Ti-containing brazes, whereas Ni- and Si-rich layers formed in joints brazed using Ni-base brazes. Monolithic SiC/Mo and SiC/Kovar joints with Cusil-ABA had sound interfaces and compressive shear strengths of 25-30 MPa. In the case of composites, surface preparation influenced bond quality: ground SiC-SiC samples led to sound joints and unground samples led to interfacial decohesion at low thermal strains whereas joints cracked regardless of the surface preparation at large thermal strains. Among SiC-SiC/metal joints, SiC-SiC/Cu-clad-Mo had the best microstructure and bond quality. Microstructures of joints made using MBF-20 mixed with low-expansion Si-X (X: Y, Ta, Hf, Ti, B) eutectic powders to control the thermal expansion are also presented.
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Acknowledgements
R. Asthana acknowledges the research support from Ohio Aerospace Institute, Cleveland, OH. The authors wish to thank Mr. Bryan P. Coddington for his help in experimental work and Mr. Michael C. Halbig, NASA Glenn Research Center, Cleveland, for his constructive comments and suggestions.
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This article is an invited submission to JMEP selected from presentations at the Symposium “Joining and Related Technologies,” belonging to the topic “Processing” at the European Congress and Exhibition on Advanced Materials and Processes (EUROMAT 2019), held September 1–5, 2019, in Stockholm, Sweden, and has been expanded from the original presentation.
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Singh, M., Asthana, R. & Sobczak, N. Active Brazing of SiC-Base Ceramics to High-Temperature Alloys. J. of Materi Eng and Perform 29, 4898–4912 (2020). https://doi.org/10.1007/s11665-020-04934-3
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DOI: https://doi.org/10.1007/s11665-020-04934-3