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Soluble Polyimide-reinforced TGDDM and DGEBA Epoxy Composites

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Abstract

Polyimide (PI) synthesized from aromatic diamine and dianhydrides via two-step poly-condensation method was highly soluble in TGDDM (MY-720) and DGEBA (E-51) at desirable temperature. TGDDM-PI (M-PI) and DGEBA-PI (E-PI) composites within 0.5%-3% PI loading could be prepared without organic solvent. On the cryogenically fractured surfaces of M-PI and E-PI composites, no obvious heterogeneous phase was observed by SEM. The mechanical properties were promoted significantly by PI, especially for impact strength. Adding 2% PI-2W into MY-720 and E-51 composites, the impact strength increased to 21 and 51 kJ/m2, the tensile strength increased by 62% and 19%, and the flexural strength by 18% and 13%, respectively, with slight increases in tensile modulus. These results were related to the promotion in plasticity of composites and changes in fragile→ductile fracture mode. Moreover, Tg and thermal stability of M-PI and E-PI were increased effectively.

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Acknowledgments

This work was financially supported by the National Key Research and Development Program of China (No. 2016YFC0204300) and the National Natural Science Foundation of China (Nos. 21777043 and 21976056).

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Authors and Affiliations

  1. Research Institute of Industrial Catalysis, School of Chemistry and Molecular Engineering, East China University of Science and Technology, Shanghai, 200237, China

    Qi Chen, Shun Wang, Feng Qin, Kuan Liu, Qian Liu, Qing Zhao & Xing-Yi Wang

  2. Key Laboratory for Specially Functional Polymers and Related Technology of Ministry of Education, School of Materials Science and Engineering, East China University of Science and Technology, Shanghai, 200237, China

    Yan-Hong Hu

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  1. Qi Chen
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Correspondence to Xing-Yi Wang or Yan-Hong Hu.

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Chen, Q., Wang, S., Qin, F. et al. Soluble Polyimide-reinforced TGDDM and DGEBA Epoxy Composites. Chin J Polym Sci 38, 867–876 (2020). https://doi.org/10.1007/s10118-020-2395-9

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  • DOI: https://doi.org/10.1007/s10118-020-2395-9

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